SiC wafer 4H-N 6H-N HPSI 4H-semi 6H-semi 4H-P 6H-P 3C uhlobo 2inch 3inch 4inch 6inch 8inch
Iipropati
IiWafers zeSiC zohlobo lwe-4H-N kunye ne-6H-N (iiWafers zeSiC zohlobo lwe-N)
Isicelo:Isetyenziswa kakhulu kwizixhobo ze-elektroniki ezinamandla, ii-optoelectronics, kunye nezicelo zobushushu obuphezulu.
Uluhlu lobubanzi:50.8 mm ukuya kuma-200 mm.
Ubukhulu:350 μm ± 25 μm, enobukhulu obunganyanzelekanga obuyi-500 μm ± 25 μm.
Ukuxhathisa:Uhlobo lwe-N 4H/6H-P: ≤ 0.1 Ω·cm (udidi lwe-Z), ≤ 0.3 Ω·cm (udidi lwe-P); Uhlobo lwe-N 3C-N: ≤ 0.8 mΩ·cm (udidi lwe-Z), ≤ 1 mΩ·cm (udidi lwe-P).
Uburhabaxa:I-Ra ≤ 0.2 nm (i-CMP okanye i-MP).
Uxinano lweeMipayipi ezincinci (MPD):< 1 nganye/cm².
I-TTV: ≤ 10 μm kuzo zonke iidayamitha.
I-Warp: ≤ 30 μm (≤ 45 μm kwiiwafers eziyi-8 intshi).
Ukukhutshwa komda:3 mm ukuya kwi-6 mm kuxhomekeke kuhlobo lwe-wafer.
Ukupakisha:Ikhasethi yewafer eninzi okanye isitya sewafer enye.
Ubungakanani obufumanekayo obuyi-3inch 4inch 6inch 8inch
I-HPSI (iiWafers zeSiC eziQinisekisiweyo ngokuPheleleyo)
Isicelo:Isetyenziselwa izixhobo ezifuna ukumelana okuphezulu nokusebenza okuzinzileyo, njengezixhobo zeRF, usetyenziso lwe-photonic, kunye neesensa.
Uluhlu lobubanzi:50.8 mm ukuya kuma-200 mm.
Ubukhulu:Ubukhulu obuqhelekileyo obuyi-350 μm ± 25 μm kunye neendlela ezahlukeneyo zeewafers ezityebileyo ukuya kuthi ga kwi-500 μm.
Uburhabaxa:URa ≤ 0.2 nm.
Uxinano lweeMipayipi ezincinci (MPD): ≤ 1 nganye/cm².
Ukuxhathisa:Ukumelana okuphezulu, okuhlala kusetyenziswa kwizicelo zokuthintela ukufudumeza kancinci.
I-Warp: ≤ 30 μm (kwiisayizi ezincinci), ≤ 45 μm kwizangqa ezinkulu.
I-TTV: ≤ 10 μm.
Ubungakanani obufumanekayo obuyi-3inch 4inch 6inch 8inch
4H-P、6H-P&3C I-SiC wafer(IiWafers zeSiC zohlobo lwe-P)
Isicelo:Ngokuyintloko yezixhobo zamandla kunye nezixhobo ezisebenzisa i-frequency ephezulu.
Uluhlu lobubanzi:50.8 mm ukuya kuma-200 mm.
Ubukhulu:350 μm ± 25 μm okanye ukhetho olulungiselelwe wena.
Ukuxhathisa:Uhlobo lwe-P 4H/6H-P: ≤ 0.1 Ω·cm (udidi lwe-Z), ≤ 0.3 Ω·cm (udidi lwe-P).
Uburhabaxa:I-Ra ≤ 0.2 nm (i-CMP okanye i-MP).
Uxinano lweeMipayipi ezincinci (MPD):< 1 nganye/cm².
I-TTV: ≤ 10 μm.
Ukukhutshwa komda:3 mm ukuya kwi-6 mm.
I-Warp: ≤ 30 μm kwiisayizi ezincinci, ≤ 45 μm kwiisayizi ezinkulu.
Ubungakanani obufumanekayo obuyi-3inch 4inch 6inch5×5 10×10
Itheyibhile yeeParamitha zeDatha ezingaphelelanga
| Ipropati | 2 intshi | 3intshi | 4intshi | 6intshi | 8intshi | |||
| Uhlobo | 4H-N/HPSI/ | 4H-N/HPSI/ | 4H-N/HPSI//4H/6H-P/3C; | 4H-N/HPSI//4H/6H-P/3C; | I-4H-N/HPSI/4H-SEMI | |||
| Ububanzi | 50.8 ± 0.3 mm | 76.2±0.3mm | 100±0.3mm | 150±0.3mm | 200 ± 0.3 mm | |||
| Ubukhulu | 330 ± 25 um | 350 ±25 um | 350 ±25 um | 350 ±25 um | 350 ±25 um | |||
| 350±25um; | 500±25um | 500±25um | 500±25um | 500±25um | ||||
| okanye eyenziwe ngokwezifiso | okanye eyenziwe ngokwezifiso | okanye eyenziwe ngokwezifiso | okanye eyenziwe ngokwezifiso | okanye eyenziwe ngokwezifiso | ||||
| Uburhabaxa | URa ≤ 0.2nm | URa ≤ 0.2nm | URa ≤ 0.2nm | URa ≤ 0.2nm | URa ≤ 0.2nm | |||
| I-Warp | ≤ 30um | ≤ 30um | ≤ 30um | ≤ 30um | ≤45um | |||
| I-TTV | ≤ 10um | ≤ 10um | ≤ 10um | ≤ 10um | ≤ 10um | |||
| Krwela/Grumba | I-CMP/MP | |||||||
| I-MPD | <1e/cm-2 | <1e/cm-2 | <1e/cm-2 | <1e/cm-2 | <1e/cm-2 | |||
| Imilo | Ingqukuva, Ithe tyaba yi-16mm; Ubude yi-22mm; Ubude yi-30/32.5mm; Ubude yi-47.5mm; I-NOTCH; I-NOTCH; | |||||||
| I-Bevel | 45°, I-SEMI Spec; Imilo ye-C | |||||||
| Ibanga | Ibanga lemveliso yeMOS neSBD; Ibanga lophando; Ibanga elingaqhelekanga, Ibanga le-wafer yembewu | |||||||
| Amagqabaza | Ububanzi, Ubukhulu, Ukuqonda, iinkcukacha ezingentla zingenziwa ngokwezifiso ngokwesicelo sakho | |||||||
Izicelo
·Amandla e-Elektroniki
Ii-wafer ze-SiC zohlobo lwe-N zibaluleke kakhulu kwizixhobo ze-elektroniki ezisebenza ngamandla ngenxa yokukwazi kwazo ukuphatha i-voltage ephezulu kunye ne-current ephezulu. Zisetyenziswa kakhulu kwii-power converters, ii-inverters, kunye nee-motor drives kumashishini afana namandla avuselelekayo, izithuthi zombane, kunye ne-industrial automation.
· I-Optoelectronics
Izixhobo zeSiC zohlobo lwe-N, ngakumbi kwizicelo ze-optoelectronic, zisetyenziswa kwizixhobo ezifana nee-diode ezikhupha ukukhanya (ii-LED) kunye nee-laser diodes. Ukuqhuba kwazo ubushushu obuphezulu kunye ne-wide bandgap kuzenza zilungele izixhobo ze-optoelectronic ezisebenza kakuhle.
·Izicelo zoBushushu obuPhezulu
Ii-wafer ze-SiC ze-4H-N 6H-N zilungele kakuhle iindawo ezinobushushu obuphezulu, njengakwizixhobo zombane kunye nezixhobo ezisetyenziswa kwi-aerospace, kwiimoto, nakwiindawo zoshishino apho ukuchithwa kobushushu kunye nokuzinza kumaqondo obushushu aphezulu kubaluleke kakhulu.
·Izixhobo zeRF
Ii-wafer ze-SiC ze-4H-N 6H-N zisetyenziswa kwizixhobo zerediyo (RF) ezisebenza kwiindawo ezinamaza aphezulu. Zisetyenziswa kwiinkqubo zonxibelelwano, iteknoloji yeradar, kunye nonxibelelwano lwesathelayithi, apho kufuneka khona ukusebenza kakuhle kwamandla kunye nokusebenza kakuhle.
·Usetyenziso lweFotoniki
Kwi-photonics, ii-SiC wafers zisetyenziselwa izixhobo ezifana nee-photodetectors kunye nee-modulators. Iimpawu ezikhethekileyo zesixhobo zivumela ukuba sisebenze ekuveliseni ukukhanya, ukuguqulwa, kunye nokuchongwa kwiinkqubo zonxibelelwano lwe-optical kunye nezixhobo zomfanekiso.
·Izinzwa
Ii-wafer ze-SiC zisetyenziswa kwiindlela ezahlukeneyo zokusebenzisa ii-sensor, ingakumbi kwiindawo ezinzima apho ezinye izinto zinokungasebenzi kakuhle. Ezi ziquka ubushushu, uxinzelelo, kunye nee-sensor zeekhemikhali, ezibalulekileyo kwiinkalo ezifana neemoto, ioyile negesi, kunye nokubeka esweni okusingqongileyo.
·Iinkqubo zokuQhuba iiMoto zoMbane
Itekhnoloji yeSiC idlala indima ebalulekileyo kwizithuthi zombane ngokuphucula ukusebenza kakuhle kunye nokusebenza kweenkqubo zokuqhuba. Ngee-semiconductors zamandla eSiC, izithuthi zombane zinokufikelela kubomi bebhetri obungcono, amaxesha okutshaja ngokukhawuleza, kunye nokusebenza kakuhle kwamandla.
·IiSensors eziPhambili kunye neeFotonic Converters
Kwiiteknoloji ze-sensor eziphucukileyo, ii-SiC wafers zisetyenziselwa ukwenza ii-sensors ezichanekileyo kakhulu kwizicelo ze-robotics, izixhobo zonyango, kunye nokubeka esweni okusingqongileyo. Kwii-photonic converters, iipropati ze-SiC zisetyenziswa ukuze kube lula ukuguqulwa kwamandla ombane abe ziisignali ezibonakalayo, nto leyo ebalulekileyo kunxibelelwano lwefowuni kunye neziseko ze-intanethi ezikhawulezayo.
Imibuzo neempendulo
Q:Yintoni i-4H kwi-4H SiC?
A:"4H" kwi-4H I-SiC ibhekisa kwisakhiwo sekristale se-silicon carbide, ngakumbi imo ye-hexagonal eneeleya ezine (H). I-"H" ibonisa uhlobo lwe-hexagonal polytype, eyahlula kwezinye ii-SiC polytypes ezifana ne-6H okanye i-3C.
Q:Iyintoni i-thermal conductivity ye-4H-SiC?
A:Ulawulo lobushushu lwe-4H-SiC (iSilicon Carbide) lumalunga ne-490-500 W/m·K kubushushu begumbi. Olu lawulo lobushushu oluphezulu lwenza ukuba lulungele ukusetyenziswa kwii-elektroniki zamandla nakwiindawo ezinobushushu obuphezulu, apho ukuchithwa kobushushu okusebenzayo kubalulekile.














