INkqubo yeLaser yeMicrojet echanekileyo yeZixhobo eziNqinileyo kunye neziBrittle

Inkcazelo emfutshane:

Isishwankathelo:

Idizayinelwe ukusetyenzwa ngokuchanekileyo kwexabiso eliphezulu, izinto ezinzima kunye ne-brittle, le nkqubo ye-laser machining ye-laser iphakamisa iteknoloji ye-microjet laser edityaniswa ne-DPSS Nd: umthombo we-laser ye-YAG, enikezela ukusebenza kwe-wavelength kabini kwi-532nm kunye ne-1064nm. Ngeziphumo zamandla ezilungiselelwayo ze-50W, i-100W, kunye ne-200W, kunye nokuchaneka okuphawulekayo kokuma kwe-±5μm, inkqubo ilungiselelwe izicelo ezivuthiweyo ezifana nokusikwa, ukudayiva, kunye nokujikeleza komphetho we-silicon carbide wafers. Ikwaxhasa uluhlu olubanzi lwezinto ezizayo ezibandakanya i-gallium nitride, idayimane, i-gallium oxide, i-aerospace composites, i-LTCC substrates, iiwafers ze-photovoltaic, kunye neekristale ze-scintillator.

Ukuxhotyiswa ngeenketho zombini ezihambelanayo kunye ne-direct-drive motor, le nkqubo ibetha ibhalansi echanekileyo phakathi kokuchaneka okuphezulu kunye nesantya sokucubungula-esenza ukuba ilungele zombini amaziko ophando kunye neendawo zokuvelisa i-industrial.

Thumela i-imeyile kuthi

Iimbonakalo

Ezona mpawu

1. Dual-Wavelength Nd:YAG Laser Source
Isebenzisa i-diode-pumped solid-state Nd: YAG laser, inkqubo ixhasa zombini uhlaza (532nm) kunye ne-infrared (1064nm) ubude bamaza. Esi sixhobo se-dual-band senza ukuhambelana okuphezulu kunye noluhlu olubanzi lweeprofayili zokufunxa izinto, ukuphucula isantya sokucubungula kunye nomgangatho.

2. UThutho lweLaser yeMicrojet entsha
Ngokudibanisa i-laser kunye ne-microjet yamanzi yoxinzelelo oluphezulu, le nkqubo isebenzisa imbonakalo yangaphakathi epheleleyo kumbane welaser ngokuchanekileyo ecaleni komsinga wamanzi. Le ndlela yonikezelo ikhethekileyo iqinisekisa ugqaliselo lwe-ultra-fine kunye nokusasazwa okuncinci kwaye ihambisa ububanzi belayini ngokucokisekileyo njenge-20μm, inika umgangatho wokusikwa ongenakulinganiswa.

3. Ulawulo lwe-Thermal kwi-Micro Scale
Imodyuli echanekileyo echanekileyo yokupholisa amanzi ilawula ukushisa kwindawo yokucubungula, ukugcina indawo echaphazelekayo ukushisa (HAZ) ngaphakathi kwe-5μm. Olu phawu lubaluleke ngakumbi xa usebenza ngezinto ezingeva lubushushu kunye nezaphukileyo ezifana ne-SiC okanye i-GaN.

4. Uqwalaselo lwaMandla eModyuli
Iqonga lixhasa iinketho ezintathu zamandla e-laser-50W, 100W, kunye ne-200W-evumela abathengi ukuba bakhethe ukucwangciswa okuhambelana neemfuno zabo zokuphuma kunye nesisombululo.

5. I-Platform yokuLawula iMotion echanekileyo
Inkqubo ibandakanya inqanaba eliphezulu lokuchaneka kunye ne-± 5μm yokubeka, equkethe i-5-axis motion kunye ne-optional linear or direct-drive motors. Oku kuqinisekisa ukuphindaphindwa okuphezulu kunye nokuguquguquka, nakwijometri ezintsonkothileyo okanye ukusetyenzwa kwebhetshi.

IiNdawo zokuSebenza

ISilicon Carbide Wafer Processing:

Ilungele ukucheba komphetho, ukusika, kunye nokudaywa kwee-wafers ze-SiC kumbane wombane.

IGallium Nitride (GaN) Substrate Machining:

Ixhasa ukuchaneka okuphezulu kokubhala kunye nokusika, okulungiselelwe iRF kunye nezicelo ze-LED.

Ulwakhiwo lweSemiconductor yeBandgap ebanzi:

Iyahambelana nedayimane, i-gallium oxide, kunye nezinye izinto ezivelayo ze-high-frequency, high-voltage applications.

I-Aerospace Composite Cutting:

Ukusikwa ngokuchanekileyo kwe-ceramic matrix composite kunye ne-aerospace-grade substrates ekumgangatho ophezulu.

I-LTCC kunye neMathiriyeli ye-Photovoltaic:

Isetyenziselwa i-micro ngokusebenzisa ukomba, ukugoba, kunye nokubhala kwi-PCB ye-frequency ephezulu kunye nokuveliswa kweeseli zelanga.

I-scintillator kunye ne-Optical Crystal Shaping:

Yenza ukusika okuphantsi kwe-yttrium-aluminiyam garnet, LSO, BGO, kunye nezinye izinto ezichanekileyo.

Inkcazo

Inkcazo	Ixabiso
Uhlobo lweLaser	DPSS Nd:YAG
I-Wavelengths exhaswayo	532nm / 1064nm
Iinketho zamandla	50W / 100W / 200W
Ukubeka Ukuchaneka	±5μm
Ubuncinci bobubanzi bomgca	≤20μm
Indawo echatshazelwe bubushushu	≤5μm
Inkqubo eshukumayo	I-Linear / i-Direct-drive motor
Ukuxinwa kwamandla aphezulu	Ukuya kuthi ga kwi-10⁷ W/cm²

Ukuqukumbela

Le nkqubo ye-laser ye-microjet ichaza kwakhona imida ye-laser machining kwizinto ezinzima, ezinqabileyo, kunye nezixhobo ezibuthathaka. Ngokudityaniswa kwayo okukhethekileyo kwe-laser-amanzi, ukuhambelana kwe-wavelength kabini, kunye nenkqubo yentshukumo eguquguqukayo, ibonelela ngesisombululo esilungiselelwe abaphandi, abavelisi, kunye nabahlanganisi benkqubo abasebenza ngezinto zokusika. Nokuba isetyenziswa kwiilaphu ze-semiconductor, iilebhu ze-aerospace, okanye imveliso yephaneli yelanga, eli qonga lizisa ukuthembeka, ukuphindaphinda, kunye nokuchaneka okuxhobisa ukusetyenzwa kwezinto kwisizukulwana esilandelayo.