Inkqubo yeLaser yeMicrojet echanekileyo yezixhobo eziqinileyo nezithambileyo

Inkqubo yeLaser yeMicrojet echanekileyo yezinto eziqinileyo nezithambileyo Umfanekiso obonisiweyo

Inkcazo emfutshane:

Isishwankathelo:

Yenzelwe ukucutshungulwa ngokuchanekileyo kwezinto ezixabisekileyo, eziqinileyo nezibuthathaka, le nkqubo yokulungisa i-laser ephucukileyo isebenzisa itekhnoloji ye-laser ye-microjet edityaniswe nomthombo we-laser we-DPSS Nd:YAG, enika ukusebenza kwe-dual-wavelength kwi-532nm kunye ne-1064nm. Ngombane olungiselelweyo we-50W, 100W, kunye ne-200W, kunye nokuchaneka okumangalisayo kwe-±5μm, le nkqubo ilungiselelwe ukusetyenziswa okuvuthiweyo okufana nokusika, ukugawula, kunye nokujikelezisa imiphetho yee-wafers ze-silicon carbide. Ikwaxhasa uluhlu olubanzi lwezinto zesizukulwana esilandelayo kubandakanya i-gallium nitride, idayimani, i-gallium oxide, ii-aerospace composites, ii-LTCC substrates, ii-wafers ze-photovoltaic, kunye neekristale ze-scintillator.

Ixhotyiswe ngeendlela ezahlukeneyo zeemoto ezisebenzisa ulayini kunye nezisebenzisa umbane ngqo, le nkqubo ifikelela kumlinganiselo ogqibeleleyo phakathi kokuchaneka okuphezulu kunye nesantya sokucubungula—nto leyo eyenza ukuba ifaneleke kuzo zombini iindawo zophando kunye neendawo zemveliso yemizi-mveliso.

Thumela i-imeyile kuthi

Iimbonakalo

Ezona mpawu

1. Umthombo weLaser ye-Dual-Wavelength Nd:YAG
Isebenzisa i-laser ye-Nd:YAG ene-diode-pumped solid-state Nd:YAG, le nkqubo ixhasa zombini ubude be-wavelengths obuluhlaza (532nm) kunye nobe-infrared (1064nm). Olu buchule be-dual-band buvumela ukuhambelana okuphezulu kunye noluhlu olubanzi lweeprofayili zokufunxa izinto, nto leyo ephucula isantya sokucubungula kunye nomgangatho.

2. Uthumelo lweLaser yeMicrojet oluNtsha
Ngokudibanisa i-laser ne-microjet yamanzi enoxinzelelo oluphezulu, le nkqubo isebenzisa ukubonakaliswa kwangaphakathi okupheleleyo ukuhambisa amandla e-laser ngqo kumjelo wamanzi. Le ndlela yokuhambisa eyahlukileyo iqinisekisa ukugxila okuncinci kakhulu kunye nokusasazeka okuncinci kwaye inika ububanzi bemigca obuyi-20μm, inika umgangatho wokusika ongenakuthelekiswa nanto.

3. Ulawulo lobushushu kwiMicro Scale
Imodyuli yokupholisa amanzi ngokuchaneka edibeneyo ilawula ubushushu kwindawo yokucubungula, igcina indawo echaphazelekileyo kubushushu (HAZ) ngaphakathi kwe-5μm. Olu phawu lubaluleke kakhulu xa usebenza ngezinto ezibuthathaka kubushushu nezinokuqhekeka ezifana neSiC okanye iGaN.

4. Uqwalaselo lwaMandla eModular
Iqonga lixhasa iindlela ezintathu zamandla e-laser—i-50W, i-100W, kunye ne-200W—okuvumela abathengi ukuba bakhethe uqwalaselo oluhambelana neemfuno zabo zokukhupha kunye nesisombululo.

5. Iqonga loLawulo lokuHamba ngokuNgqo
Le nkqubo ibandakanya inqanaba lokuchaneka okuphezulu elinokubekwa kwe-±5μm, elinentshukumo ye-5-axis kunye neemoto eziqhutywa ngokuthe ngqo okanye ezizii-linear. Oku kuqinisekisa ukuphindaphindeka okuphezulu kunye nokuguquguquka, nokuba kwiijiyometri ezintsonkothileyo okanye ekucutshungulweni kwebhetshi.

Iindawo zoSetyenziso

Ukucubungula iWafer yeSilicon Carbide:

Ilungele ukucheba, ukunqumla, kunye nokusika ii-wafers ze-SiC kwizixhobo ze-elektroniki ezinamandla.

Umatshini weGallium Nitride (GaN) Substrate:

Ixhasa ukubhalwa nokusikwa okuchanekileyo, yenzelwe ukusetyenziswa kwe-RF kunye ne-LED.

Ulwakhiwo lweSemiconductor yeBandgap ebanzi:

Iyahambelana nedayimani, i-gallium oxide, kunye nezinye izinto ezivelayo kwizicelo ze-high-frequency, high-voltage.

Ukusikwa kwe-Aerospace Composite:

Ukusikwa ngokuchanekileyo kwezinto ezidityanisiweyo ze-ceramic matrix kunye nezinto ezisemgangathweni ze-aerospace.

Izixhobo ze-LTCC kunye ne-Photovoltaic:

Isetyenziselwa ukwenza ii-micro ngokugrumba, ukugrumba, kunye nokubhala kwiimveliso ze-PCB ezisebenzisa i-high-frequency kunye neeseli zelanga.

Ukubumba iScintillator kunye neOptical Crystal:

Ivumela ukusika i-yttrium-aluminium garnet, i-LSO, i-BGO, kunye nezinye ii-precision optics ezingenasiphako.

Inkcazo

Inkcazo	Ixabiso
Uhlobo lweLaser	I-DPSS Nd:YAG
Ubude bamaza buxhasiwe	532nm / 1064nm
Iinketho zamandla	50W / 100W / 200W
Ukuchaneka kokubeka indawo	±5μm
Ububanzi boMgca obuphantsi	≤20μm
Indawo Echaphazeleka Bubushushu	≤5μm
Inkqubo yokuHamba	Imoto eqhutywa ngokuthe ngqo/ngomgca
Ubuninzi bamandla	Ukuya kuthi ga kwi-10⁷ W/cm²

Isiphelo

Le nkqubo yelaser ye-microjet ichaza ngokutsha imida yomatshini welaser kwizixhobo eziqinileyo, ezibuthathaka, nezinobushushu. Ngokudityaniswa kwayo okwahlukileyo kwelaser namanzi, ukuhambelana kwamaza amabini, kunye nenkqubo yokuhamba eguquguqukayo, inika isisombululo esilungiselelwe abaphandi, abavelisi, kunye nabahlanganisi beenkqubo abasebenza ngezinto ezisemgangathweni. Nokuba isetyenziswa kwi-semiconductor fabs, kwiilebhu zeenqwelo moya, okanye kwimveliso yeephaneli zelanga, le platform inika ukuthembeka, ukuphindaphindwa, kunye nokuchaneka okunika amandla ukucutshungulwa kwezinto zesizukulwana esilandelayo.