I-12inch yeSapphire Wafer C-Plane SSP / DSP

12inch Sapphire Wafer C-Plane SSP/DSP Featured Umfanekiso

Inkcazelo emfutshane:

Ngokuqinisekileyo i-12-intshi ye-sapphire wafers luhlobo lwe-substrate esetyenziswa kwishishini le-semiconductor.Ezi ziqwenga zenziwe ngesafire yekristale enye, eluhlobo lwecrystalline ye-aluminiyam oxide (Al2O3) eyaziwa ngoomatshini bayo abagqwesileyo, abashushu, kunye neempawu zokukhanya.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Ukwazisa ngebhokisi ye-wafer

Ukuveliswa kwe-12-intshi ye-sapphire wafers yinkqubo enzima kunye neyodwa.Nanga amanye amanyathelo aphambili abandakanyekayo ekuvelisweni kwee-12-intshi zesapphire wafers:

Ukulungiswa kweCrystal yeMbewu: Inyathelo lokuqala kukulungiselela ikristale yembewu, esebenza njengetemplate yokukhulisa isafire yekristale enye.Ikristale yembewu ibunjwe ngononophelo kwaye ikhazimlisiwe ukuqinisekisa ukulungelelaniswa okufanelekileyo kunye nokugudiswa komphezulu.

I-Aluminiyam i-Oxide yokunyibilika: I-aluminium oxide ephezulu ecocekileyo (i-Al2O3) iyancibilika kwi-crucible.I-crucible ngokuqhelekileyo yenziwe ngeplatinum okanye ezinye izinto ezingasebenziyo ezinokumelana nokushisa okuphezulu.

Ukukhula kweCrystal: I-aluminiyam oxide enyibilikisiweyo igawulwa ngekristale yembewu elungisiweyo kwaye iphole kancinci ngelixa igcina umoya olawulayo.Le nkqubo ivumela ikristale yesafire ukuba ikhule ngokwemaleko, yenze i-crystal ingot enye.

Ukubunjwa kwe-Ingot: Emva kokuba i-crystal ikhulile ukuya kubukhulu obufunwayo, iyasuswa kwi-crucible kwaye ifakwe kwi-cylindrical boule.I-boule inqunyulwa ngononophelo ibe ngamaqhekeza amancinci.

Ukusetyenzwa kweWafer: Iiwafers ezisikiweyo ziphantsi kweenkqubo ezahlukeneyo ukufezekisa ubukhulu obufunwayo, ukugqiba umphezulu, kunye nomgangatho.Oku kubandakanya i-lapping, polishing, kunye ne-chemical-mechanical planarization (CMP) ukususa iziphene zomhlaba kunye nokufezekisa ukucaca okufunekayo kunye nokugudiswa.

Ukucocwa nokuHlolwa: Iiwafers ezicwangcisiweyo zicocwa ngokucokisekileyo ukuze zisuse naziphi na izinto ezingcolisayo.Emva koko ziye zihlolwe iziphene ezinje ngeentanda, imikrwelo, nokungcola.

Ukupakishwa kunye nokuThuthwa: Okokugqibela, ii-wafers ezihloliweyo zipakishwe kwaye zilungiselelwe ukuthunyelwa kubathengi, ngokuqhelekileyo kwii-wafer carriers ezibonelela ngokhuseleko ngexesha lokuthutha.

Kubalulekile ukuqaphela ukuba ukuveliswa kwee-12-intshi ze-sapphire wafers kunokufuna izixhobo ezikhethekileyo kunye nezibonelelo xa kuthelekiswa neesayizi ezincinci ze-wafer.Inkqubo inokubandakanya ubuchule obuphambili obufana nokungabandakanyi emphethweni kunye nolawulo loxinzelelo ukuze kuqinisekiswe ukuthembeka kunye nomgangatho weewafers ezinkulu.

Ukuba unesidingo sesapphire substrates, nceda uzive ukhululekile ukuqhagamshelana:

imeyile:eric@xkh-semitech.com+86 158 0194 2596 /doris@xkh-semitech.com+86 187 0175 6522

Siza kubuyela kuwe ngokukhawuleza!