I-12inch ngokuPheleleyo ngokuSebenzayo ngokuNgcaciswayo kweSaw yeSixhobo seWafer eZinikezelweyo zokusika iSi/SiC & HBM (Al)

I-12inch ngokuPheleleyo ngokuSebenzayo ngokuQelekileyo kokuDitywa kweSaw yeSixhobo seWafer eZinikezelweyo zokuSika iSi/SiC kunye ne-HBM (Al) Umfanekiso obonakalayo

Inkcazelo emfutshane:

Izixhobo zokudayela ezichanekileyo ngokuzenzekelayo yinkqubo yokusika ephezulu echanekileyo ephuhliswe ngokukodwa kwi-semiconductor kunye ne-electronic components industry. Ibandakanya itekhnoloji yokulawula intshukumo ephezulu kunye nokubekwa okubonakalayo okunengqondo ukufezekisa ukuchaneka kwenqanaba le-micron. Esi sixhobo silungele ukudaywa ngokuchanekileyo kwezixhobo ezahlukeneyo eziqinileyo kunye nezinqabileyo, kubandakanya:
I-1.Izixhobo ze-Semiconductor: I-Silicon (Si), i-silicon carbide (SiC), i-gallium arsenide (i-GaAs), i-lithium tantalate / i-lithium niobate (LT / LN) substrates, njl.
I-2.Izinto zokuPakisha: I-Ceramic substrates, iifreyimu ze-QFN / DFN, i-BGA yokupakisha i-substrates.
I-3.Izixhobo eziSebenzayo: Izihlungi ze-acoustic wave (SAW), iimodyuli zokupholisa i-thermoelectric, ii-wafers ze-WLCSP.

I-XKH ibonelela ngovavanyo lokuhambelana kwezinto kunye neenkonzo zokwenza ngokwezifiso ukuqinisekisa ukuba izixhobo zihambelana ngokugqibeleleyo neemfuno zemveliso yabathengi, ukuhambisa izisombululo ezifanelekileyo kuzo zombini iisampulu ze-R&D kunye nokusetyenzwa kwebhetshi.

Thumela i-imeyile kuthi

Iimbonakalo

Iiparamitha zobugcisa

Ipharamitha	Inkcazo
Ubungakanani bokusebenza	Φ8", Φ12"
I-spindle	I-Dual-axis 1.2/1.8/2.4/3.0, Max 60000 rpm
Ubungakanani beBlade	2" ~ 3"
Umgca we-Y1 / Y2	Inyathelo elinye lokunyuka: 0.0001 mm
	Ukumisa ukuchaneka: <0.002 mm
	Uluhlu lokusika: 310 mm
X Axis	Uluhlu lwesantya sokutya: 0.1–600 mm/s
Umgca we-Z1 / Z2	Inyathelo elinye lokunyuka: 0.0001 mm
Umgca we-Z1 / Z2	Ukumisa ukuchaneka: ≤ 0.001 mm
θ I-axis	Ukuma kokuchaneka: ±15"
Isitishi sokucoca	Isantya sokujikeleza: 100-3000 rpm
Isitishi sokucoca	Indlela yokucoca: Sula ngokuzenzekela kwaye usomise
I-Voltage yokusebenza	I-3-isigaba 380V 50Hz
Imilinganiselo (W×D×H)	1550×1255×1880 mm
Ubunzima	2100 kg

UmGaqo wokuSebenza

Isixhobo sifezekisa ukusika okuphezulu ngokuchaneka kobu buchwepheshe bulandelayo:
I-1.I-High-Rigidity Spindle System: Isantya sokujikeleza ukuya kwi-60,000 RPM, exhotywe ngamacangci edayimane okanye iintloko zokusika i-laser ukulungelelanisa kwiipropati zezinto ezahlukeneyo.

I-2.Ulawulo lwe-Multi-Axis Motion Control: I-X / Y / Z-i-axis yokuchaneka kokuchaneka kwe-± 1μm, idibaniswe nezikali ezichanekileyo zokugaya ukuqinisekisa ukuphambuka kweendlela zokusika.

3. Ulungelelwaniso olubonakalayo oluBukrelekrele: I-CCD enokulungiswa okuphezulu (iimegapikseli ezi-5) ibona ngokuzenzekelayo izitrato ezisikiweyo kwaye ihlawule ukujija okanye ukungahambi kakuhle.

I-4.Ukupholisa kunye nokususwa kothuli: Inkqubo edibeneyo yokupholisa amanzi acocekileyo kunye nokususwa kwe-vacuum suction uthuli ukunciphisa impembelelo ye-thermal kunye nokungcoliswa kwamasuntswana.

Iindlela zokusika

I-1.Blade Dicing: Ifanelekile kwizinto zemveli ze-semiconductor ezifana ne-Si kunye ne-GaAs, kunye nobubanzi be-kerf ye-50-100μm.

2.I-Stealth Laser Dicing: Isetyenziselwa ii-wafers ezi-ultra-thin (<100μm) okanye izinto ezibuthathaka (umzekelo, i-LT / LN), eyenza ukuhlukana ngaphandle koxinzelelo.

Usetyenziso oluqhelekileyo

Izinto Ezihambelanayo	Indawo yosetyenziso	IiMfuno zokuSebenza
Isilicon (Si)	Ii-ICs, ii-MEMS sensors	Ukusika okuphezulu, ukusika <10μm
I-Silicon Carbide (SiC)	Izixhobo zamandla (MOSFET/diodes)	Ukusika umonakalo ophantsi, ukulungiswa kokulawulwa kwe-thermal
I-Gallium Arsenide (GaAs)	Izixhobo zeRF, iitshiphusi ze-optoelectronic	Uthintelo lwe-Micro-crack, ulawulo lokucoceka
LT/LN Substrates	Izihluzi ze-SAW, iimodyuli zamehlo	Ukusika okungenaxinzelelo, ukugcina iimpawu ze-piezoelectric
IiSubstrates zeCeramic	Iimodyuli zamandla, ukupakishwa kwe-LED	Ukulungiswa kwezinto ezinobunzima obuphezulu, ukunyanzeliswa komphetho
Izakhelo ze-QFN/DFN	Ukupakishwa okuphezulu	Ukusikwa kwe-Multi-chip ngaxeshanye, ukwenziwa kakuhle
WLCSP Wafers	Ukupakishwa kwenqanaba le-wafer	Ukudaywa okungenakonakala kweewafers ezibhityileyo kakhulu (50μm)

Iingenelo

1. Isantya esiphezulu sokuskena isakhelo sekhasethi yekhasethi kunye neealam zokuthintela ukungqubana, indawo yokudluliselwa ngokukhawuleza, kunye nokukwazi ukulungisa iimpazamo.

2. Imowudi yokusika ephuculwe kabini, iphucula ukusebenza kakuhle malunga ne-80% xa kuthelekiswa neenkqubo zokusonta enye.

3. Izikrufu zebhola ezifakwe ngokuchanekileyo, izikhokelo zomgca, kunye ne-Y-axis grating scale control-loop control-loop control, ukuqinisekisa ukuzinza kwexesha elide lokuchaneka okuphezulu.

4. Ukulayishwa / ukukhulula ngokuzenzekelayo, ukubeka indawo yokudlulisa, ukusika ukulungelelanisa, kunye nokuhlolwa kwe-kerf, ukunciphisa kakhulu umthwalo womsebenzi (OP) womsebenzi.

I-5.I-Gantry-style yokuxhoma i-spindle, kunye ne-spacing encinci ye-dual-blade ye-24mm, eyenza ukulungelelaniswa okubanzi kwiinkqubo zokusika ezimbini.

Iimbonakalo

1.Umlinganiselo wobude obuchanekileyo obuchanekileyo.

2.I-Multi-wafer-dual-blade ukusika kwitreyi enye.

I-3.Ukulinganisa okuzenzekelayo, ukuhlolwa kwe-kerf, kunye neenkqubo zokubona ukuphulwa kwe-blade.

I-4.Ixhasa iinkqubo ezahlukeneyo kunye ne-algorithms yokulungelelanisa okuzenzekelayo.

I-5.I-Fault self-correction functionality kunye nexesha langempela lokubeka iliso kwiindawo ezininzi.

6.Ikhono lokuqala lokuhlola i-post-initial dicing.

I-7.Iimodyuli ezizenzekelayo zefektri ezizenzekelayo kunye neminye imisebenzi ekhethiweyo.

Izinto ezihambelanayo

Iinkonzo zeZixhobo

Sinikezela ngenkxaso ebanzi ukusuka ekukhethweni kwezixhobo ukuya kulondolozo lwexesha elide:

(1) Uphuhliso olulungiselelweyo
· Cebisa izisombululo zokusika iiblade/laser ezisekelwe kwiimpawu zemathiriyeli (umzekelo, ubulukhuni beSiC, ubuqhophololo beGaAs).

· Nikeza ngovavanyo lwesampulu yasimahla ukuqinisekisa umgangatho wokusika (kubandakanya ukutshiphuza, ububanzi be-kerf, uburhabaxa bomphezulu, njl. njl.).

(2) Uqeqesho lobuGcisa
· Uqeqesho olusisiseko: Ukusebenza kwezixhobo, ukulungiswa kweparameter, ukugcinwa kwesiqhelo.
· Izifundo ezikwinqanaba eliphezulu: Ukulungiswa kwenkqubo yezinto ezintsonkothileyo (umzekelo, ukusika okungenaxinzelelo lwe-LT substrates).

(3) Emva koThengiso lweNkxaso
· 24/7 Impendulo: Uxilongo olukude okanye uncedo kwisiza.
· Ubonelelo lwaMalungu aSpare: ama-spindles agcweleyo, iibhleyidi, kunye namalungu optical ukuze atshintshwe ngokukhawuleza.
· ULondolozo loThintelo: Ulungelelwaniso lwarhoqo ukugcina ukuchaneka nokwandisa ubomi benkonzo.

Izinto Eziluncedo Zethu

✔ Amava eShishini: Ukukhonza i-300+ ye-semiconductor yehlabathi jikelele kunye nabavelisi bezinto zombane.
✔ Itekhnoloji ye-Cutting-Edge: Izikhokelo ezichanekileyo ezichanekileyo kunye neenkqubo ze-servo ziqinisekisa uzinzo oluhamba phambili kwishishini.
✔ Uthungelwano lweNkonzo yeHlabathi: Ukugubungela e-Asia, eYurophu, naseMntla Melika ngenkxaso yendawo.
Ukuvavanya okanye imibuzo, qhagamshelana nathi!