Inkqubo yokusika eyi-12intshi ezenzekelayo ngokupheleleyo yezixhobo zokusika ezichanekileyo ze-Si/SiC kunye ne-HBM (Al)

Isixhobo Sokusika Esizii-intshi ezili-12 Esizenzekelayo Ngokugqibeleleyo Esilungelelanisiweyo Sesilayidi Esizii-Wafer Esizinikeleyo SeSi/SiC kunye neHBM (Al) Umfanekiso Ovezweyo

Inkcazo emfutshane:

Izixhobo zokusika ngokuchanekileyo ngokuzenzekelayo ziyinkqubo yokusika echanekileyo kakhulu eyenzelwe ngokukodwa imboni ye-semiconductor kunye nezixhobo ze-elektroniki. Ibandakanya iteknoloji yokulawula intshukumo ephucukileyo kunye nokubekwa kwindawo ebonakalayo ekrelekrele ukuze kufezekiswe ukuchaneka kokucubungula kwinqanaba le-micron. Ezi zixhobo zifanelekile ekusikeni ngokuchanekileyo kwezinto ezahlukeneyo eziqinileyo nezibuthathaka, kubandakanya:
1. Izinto zeSemiconductor: ISilicon (Si), isilicon carbide (SiC), i-gallium arsenide (GaAs), ii-substrates ze-lithium tantalate/lithium niobate (LT/LN), njl.
2. Izinto zokupakisha: Ii-substrates ze-ceramic, iifreyimu ze-QFN/DFN, ii-substrates zokupakisha ze-BGA.
3. Izixhobo ezisebenzayo: Izihluzi ze-surface acoustic wave (SAW), iimodyuli zokupholisa ze-thermoelectric, ii-wafers ze-WLCSP.

I-XKH inikezela ngeenkonzo zovavanyo lokuhambelana kwezinto kunye nokulungisa iinkqubo ukuqinisekisa ukuba izixhobo zihambelana ngokugqibeleleyo neemfuno zemveliso zabathengi, zibonelela ngezisombululo ezifanelekileyo kuzo zombini iisampulu ze-R&D kunye nokulungiswa kwebhetshi.

Thumela i-imeyile kuthi

Iimbonakalo

Iiparameter zobugcisa

Ipharamitha	Inkcazo
Ubungakanani bokusebenza	Φ8", Φ12"
I-Spindle	I-axis ezimbini 1.2/1.8/2.4/3.0, Ubuninzi be-60000 rpm
Ubungakanani beBlade	2" ~ 3"
I-axis Y1 / Y2	Ukunyuka kwenyathelo elinye: 0.0001 mm
	Ukuchaneka kokubekwa: < 0.002 mm
	Uluhlu lokusika: 310 mm
I-X Axis	Uluhlu lwesantya sokutya: 0.1–600 mm/s
I-axis ye-Z1 / Z2	Ukunyuka kwenyathelo elinye: 0.0001 mm
I-axis ye-Z1 / Z2	Ukuchaneka kokubeka indawo: ≤ 0.001 mm
I-axis ye-θ	Ukuchaneka kokubekwa: ± 15"
Isitishi sokucoca	Isantya sokujikeleza: 100–3000 rpm
Isitishi sokucoca	Indlela yokucoca: Hlamba ngokuzenzekelayo uze womise nge-spin
I-Voltage yokusebenza	Isigaba esi-3 se-380V 50Hz
Ubukhulu (W×D×H)	1550×1255×1880 mm
Ubunzima	2100 kg

Umgaqo Wokusebenza

Ezi zixhobo zikwazi ukusika ngokuchanekileyo ngokusebenzisa ezi teknoloji zilandelayo:
1. Inkqubo yeSpindle eQiniseka kakhulu: Isantya sokujikeleza ukuya kuthi ga kwi-60,000 RPM, ixhotyiswe ngeebhlayi zedayimani okanye iintloko zokusika nge-laser ukuze zilungelelanise iipropati ezahlukeneyo zezinto.

2. Ulawulo lokuHamba oluneMigca emininzi: Ukuchaneka kokubekwa kwe-X/Y/Z-axis ye-±1μm, kudityaniswe nezikali zokugalela ezichanekileyo ukuqinisekisa iindlela zokusika ezingenasiphambuko.

3. Ulungelelwaniso olubonakalayo olukrelekrele: I-CCD enesisombululo esiphezulu (ii-megapixel ezi-5) iyaziqonda ngokuzenzekelayo izitalato ezinqumlayo kwaye ilungisa ukugoba okanye ukungalungelelani kwezinto.

4. Ukususa ukupholisa nothuli: Inkqubo yokupholisa amanzi acocekileyo edibeneyo kunye nokususwa kothuli olufunxayo ukuze kuncitshiswe impembelelo yobushushu kunye nongcoliseko lwamasuntswana.

Iindlela zokusika

1. Ukusika iiBlade: Ifanelekile kwizixhobo ze-semiconductor zemveli ezifana neSi kunye neGaAs, ezinobubanzi be-kerf obuyi-50–100μm.

2. I-Stealth Laser Dicing: Isetyenziselwa ii-wafers ezibhityileyo kakhulu (<100μm) okanye izinto ezibuthathaka (umz., i-LT/LN), nto leyo evumela ukwahlukana okungenaxinzelelo.

Izicelo eziqhelekileyo

Izinto ezihambelanayo	Intsimi yesicelo	Iimfuneko zokuSebenza
I-Silicon (Si)	Ii-IC, ii-sensors ze-MEMS	Ukusika ngokuchanekileyo, ukuqhekeza <10μm
I-Silicon Carbide (i-SiC)	Izixhobo zamandla (MOSFET/diode)	Ukusika okonakala kancinci, ukulungiswa kolawulo lobushushu
IGallium Arsenide (GaAs)	Izixhobo ze-RF, iitships ze-optoelectronic	Ukuthintela ukuqhekeka okuncinci, ulawulo lococeko
Iisubstrates ze-LT/LN	Izihluzi ze-SAW, ii-modulators ze-optical	Ukusika okungenaxinzelelo, ukugcina iipropati ze-piezoelectric
Ii-substrates zeCeramic	Iimodyuli zamandla, ukupakishwa kwe-LED	Ukucubungula izinto ezinobunzima obuphezulu, ukuthamba komphetho
Iifreyimu ze-QFN/DFN	Ukupakisha okuphambili	Ukusika ii-chip ezininzi ngaxeshanye, ukulungiswa kokusebenza kakuhle
IiWafers zeWLCSP	Ukupakisha okusemgangathweni we-wafer	Ukusikwa kwee-wafers ezibhityileyo kakhulu (50μm) okungenamonakalo

Iingenelo

1. Ukuskena iifreyimu zekhasethi ezinesantya esiphezulu kunye nee-alamu zokuthintela ukungqubana, indawo yokudlulisa ngokukhawuleza, kunye nokukwazi ukulungisa iimpazamo ngamandla.

2. Imo yokusika enezikhonkwane ezimbini ephuculweyo, iphucula ukusebenza kakuhle malunga ne-80% xa kuthelekiswa neenkqubo ze-single-spindle.

3. Izikrufu zebhola ezingeniswe ngokuchanekileyo, izikhokelo ezithe ngqo, kunye nolawulo lwe-Y-axis grating scale closed-loop control, ukuqinisekisa uzinzo lwexesha elide lwe-high-precision machining.

4. Ukulayisha/ukukhulula umthwalo ngokuzenzekelayo, ukubeka indawo yokudlulisa, ukusika ulungelelwaniso, kunye nokuhlolwa kwe-kerf, okunciphisa kakhulu umthwalo womsebenzi womqhubi (OP).

5. Ulwakhiwo lokufakelwa kwe-spindle olufana ne-gantry, olunesithuba esincinci se-dual-blade se-24mm, okuvumela ukuba kube lula ngakumbi kwiinkqubo zokusika ze-dual-spindle.

Iimbonakalo

1. Umlinganiselo wokuphakama ongangqalanga ngokuchanekileyo.

2. Ukusika ii-multi-wafer ezimbini-blade kwitreyi enye.

3. Ukulinganisa ngokuzenzekelayo, ukuhlolwa kwe-kerf, kunye neenkqubo zokufumanisa ukwaphuka kweeblade.

4. Ixhasa iinkqubo ezahlukeneyo ezine-algorithms zokulungelelanisa ngokuzenzekelayo ezikhethiweyo.

5. Ukusebenza kokuzilungisa iimpazamo kunye nokubeka esweni iindawo ezininzi ngexesha langempela.

6. Uvavanyo olukhawulezileyo olukwaziyo ukunqunyulwa emva kokusika kokuqala.

7. Iimodyuli zokwenza izinto ngokuzenzekelayo ezenziwe ngokwezifiso kunye neminye imisebenzi ongayikhetha.

Izixhobo ezihambelanayo

Iinkonzo zezixhobo

Sibonelela ngenkxaso epheleleyo ukusuka ekukhetheni izixhobo ukuya kulondolozo lwexesha elide:

(1) Uphuhliso Olulungiselelwe Ngokwezifiso
· Cebisa izisombululo zokusika iiblade/laser ngokusekelwe kwiimpawu zezinto (umz., ubulukhuni beSiC, ukubuthathaka kweGaAs).

· Nika uvavanyo lwesampulu yasimahla ukuqinisekisa umgangatho wokusika (kubandakanya ukuqhekeza, ububanzi be-kerf, uburhabaxa bomphezulu, njl.njl.).

(2) Uqeqesho loBugcisa
· Uqeqesho oluSisiseko: Ukusebenza kwezixhobo, ukulungiswa kweparameter, ukugcinwa rhoqo.
· Izifundo Eziphambili: Ukulungiswa kwenkqubo yezinto ezintsonkothileyo (umz., ukunqunyulwa kwe-LT substrates ngaphandle koxinzelelo).

(3) Inkxaso Emva Kokuthengisa
· Impendulo engama-24/7: Ukuxilongwa okukude okanye uncedo olufumaneka kwindawo.
· Ubonelelo lweeNdawo eziSiseko: Iispindle ezigcweleyo, iiblade, kunye nezinto ezibonakalayo ukuze zitshintshwe ngokukhawuleza.
· Ukugcinwa Kokuthintela: Ukulungiswa rhoqo ukuze kugcinwe ukuchaneka nokwandisa ubomi benkonzo.

Iingenelo Zethu

✔ Amava kuShishino: Ukukhonza abavelisi abangaphezu kwama-300 behlabathi be-semiconductor kunye ne-elektroniki.
✔ Ubuchwepheshe obuPhezulu: Izikhokelo ezichanekileyo kunye neenkqubo ze-servo ziqinisekisa uzinzo oluphambili kushishino.
✔ Inethiwekhi yeNkonzo yeHlabathi: Uncedo oluvela eAsia, eYurophu, naseMntla Melika ukuze kufumaneke inkxaso yasekuhlaleni.
Ukuba ufuna uvavanyo okanye imibuzo, nxibelelana nathi!