Izixhobo Zokusika Indandatho Ze-Wafer Ezizenzekelayo Ngokupheleleyo Ubungakanani Bokusebenza 8inch/12inch Wafer Ring Cutting

Izixhobo Zokusika Indandatho Ze-Wafer Ezizenzekelayo Ngokupheleleyo Ubungakanani Bokusebenza 8inch/12inch Ukusika Indandatho Ye-Wafer Umfanekiso Obonakalayo

Inkcazo emfutshane:

I-XKH izenzele ngokwayo inkqubo yokucheba umphetho we-wafer ezenzekelayo ngokupheleleyo, emele isisombululo esiphambili esenzelwe iinkqubo zokwenziwa kwe-semiconductor engaphambili. Esi sixhobo siquka itekhnoloji yokulawula ehambelanayo ye-multi-axis entsha kwaye sinenkqubo ye-spindle enobungqongqo obuphezulu (isantya esiphezulu sokujikeleza: 60,000 RPM), enikezela ngokucheba umphetho ngokuchanekileyo ngokucheba ngokuchanekileyo ukuya kuthi ga kwi-±5μm. Inkqubo ibonisa ukuhambelana okuhle kakhulu ne-substrates ezahlukeneyo ze-semiconductor, kuquka kodwa kungaphelelanga apho:
1. Ii-silicon wafers (Si): Zifanelekile ukucutshungulwa komphetho wee-wafers eziyi-8-12 intshi;
2. Ii-semiconductors ezidityanisiweyo: Izixhobo ze-semiconductor zesizukulwana sesithathu ezifana neGaAs kunye neSiC；
3. Ii-substrates ezikhethekileyo: Ii-piezoelectric material wafers kuquka i-LT/LN；

Uyilo lwemodyuli luxhasa ukutshintshwa ngokukhawuleza kwezinto ezininzi ezisetyenziswayo kuquka iiblade zedayimani kunye neentloko zokusika nge-laser, kunye nokuhambelana okugqitha imigangatho yoshishino. Kwiimfuno zenkqubo ezikhethekileyo, sinikezela ngezisombululo ezipheleleyo eziquka:
· Ukubonelela ngezinto ezisetyenziswayo zokusika ezinikezelweyo
· Iinkonzo zokucubungula ngokwezifiso
· Izisombululo zokuphucula iiparameter zenkqubo

Thumela i-imeyile kuthi

Iimbonakalo

Iiparameter zobugcisa

Ipharamitha	Iyunithi	Inkcazo
Ubungakanani obukhulu boMsebenzi	mm	ø12"
I-Spindle	Uqwalaselo	I-Spindle enye
	Isantya	3,000–60,000 ngomzuzu
	Amandla okuphuma	1.8 kW (2.4 ungazikhethela) kwi-30,000 min⁻¹
	UMax Blade Dia.	Ø58 mm
I-X-Axis	Uluhlu lokuSika	310 mm
I-Y-Axis	Uluhlu lokuSika	310 mm
	Ukunyuka kweNyathelo	0.0001 mm
	Ukuchaneka kokubeka indawo	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (impazamo enye)
I-Z-Axis	Isisombululo seNtshukumo	0.00005 mm
I-Z-Axis	Ukuphindaphinda	0.001 mm
I-θ-Axis	Ujikelezo oluPhezulu	380 deg
Uhlobo lwe-Spindle		I-spindle enye, exhotyiswe nge-blade eqinileyo yokusika indandatho
Ukuchaneka kokusika iringi	μm	±50
Ukuchaneka kokubeka iWafer	μm	±50
Ukusebenza kakuhle kwe-Single-Wafer	umzuzu/isitya esincinci	8
Ukusebenza kakuhle kweWafer ezininzi		Ukuya kuthi ga kwiiwafers ezi-4 ezicutshungulwayo ngaxeshanye
Ubunzima bezixhobo	kg	≈3,200
Ubukhulu beZixhobo (W×D×H)	mm	2,730 × 1,550 × 2,070

Umgaqo-nkqubo Wokusebenza

Le nkqubo ifezekisa ukusebenza okugqwesileyo kokunciphisa ngokusebenzisa ezi teknoloji ziphambili:

1. Inkqubo yoLawulo lweNtshukumo eNgqondi:
· I-drive yemoto echanekileyo kakhulu (ukuchaneka kokubeka kwakhona: ± 0.5μm)
· Ulawulo oluhambelanayo olune-axis ezintandathu oluxhasa ucwangciso oluntsonkothileyo lwendlela
· Ii-algorithms zokunciphisa ukungcangcazela ngexesha langempela eziqinisekisa ukuzinza kokusika

2. Inkqubo yokuFumanisa ePhambili:
· Isenzi sokuphakama se-laser ye-3D esidibeneyo (ukuchaneka: 0.1μm)
· Indawo ebonakalayo ye-CCD enesisombululo esiphezulu (ii-megapixel ezi-5)
· Imodyuli yokuhlola umgangatho kwi-intanethi

3. Inkqubo Ezenzekelayo Ngokupheleleyo:
· Ukulayisha/ukukhulula ngokuzenzekelayo (i-interface ye-FOUP eqhelekileyo iyahambelana)
· Inkqubo yokuhlela ekrelekrele
· Iyunithi yokucoca evaliweyo (ucoceko: Iklasi ye-10)

Izicelo eziqhelekileyo

Esi sixhobo sibonelela ngexabiso elibalulekileyo kuzo zonke izicelo zokwenziwa kwee-semiconductor:

Intsimi yesicelo	Izixhobo zeNkqubo	Iingenelo zobugcisa
Ukuveliswa kwe-IC	IiWafer zeSilicon eziyi-8/12"	Iphucula ulungelelwaniso lwe-lithography
Izixhobo zamandla	IiWafers zeSiC/GaN	Ithintela iziphene zomphetho
IiSensors zeMEMS	IiWafers zeSOI	Iqinisekisa ukuthembeka kwesixhobo
Izixhobo zeRF	IiWafers zeGaAs	Iphucula ukusebenza rhoqo
Ukupakisha Okuphambili	IiWafers Ezilungisiweyo	Yonyusa isivuno sokupakisha

Iimbonakalo

1. Uqwalaselo lwesitishi esine-four ukuze kube nokusebenza okuphezulu kokucubungula;
2. Ukususwa kunye nokususwa kwendandatho yeTAIKO ezinzileyo;
3. Ukuhambelana okuphezulu nezinto ezisetyenziswayo ezingundoqo ；
4. Itekhnoloji yokucheba ehambelanayo ye-Multi-axis iqinisekisa ukusika umphetho ngokuchanekileyo;
5. Ukuhamba kwenkqubo ngokuzenzekelayo ngokupheleleyo kunciphisa kakhulu iindleko zabasebenzi;
6. Uyilo lwetafile yokusebenza olulungiselelwe ngokwezifiso lwenza ukuba kuqhutyekwe ngokuzinzileyo kwezakhiwo ezikhethekileyo;

Imisebenzi

1. Inkqubo yokufumanisa iRing-drop ；
2. Ukucoca itafile yokusebenza ngokuzenzekelayo ；
3. Inkqubo yokukhupha i-UV ekrelekrele ；
4. Ukurekhoda kwelog yokusebenza ；
5. Ukuhlanganiswa kwemodyuli yokuzenzekela kwefektri ；

Ukuzibophelela kwiNkonzo

I-XKH ibonelela ngeenkonzo zenkxaso ezipheleleyo nezipheleleyo ezenzelwe ukwandisa ukusebenza kwezixhobo kunye nokusebenza kakuhle kulo lonke uhambo lwakho lokuvelisa.
1. Iinkonzo zokwenza ngokwezifiso
· Uqwalaselo lweZixhobo eziHleliweyo: Iqela lethu lobunjineli lisebenzisana ngokusondeleyo nabathengi ukuze kuphuculwe iiparameter zenkqubo (isantya sokusika, ukukhethwa kweeblade, njl.njl.) ngokusekelwe kwiimpawu ezithile zezinto (iSi/SiC/GaAs) kunye neemfuno zenkqubo.
· Inkxaso yoPhuhliso lweNkqubo: Sinikezela ngokucubungula iisampulu ngeengxelo zohlalutyo oluneenkcukacha eziquka ukulinganiswa koburhabaxa kunye nokubonisa iziphene.
· Uphuhliso oluBambiseneyo lweeMveliso ezisetyenziswayo: Kwizixhobo ezintsha (umz., iGa₂O₃), sisebenzisana nabavelisi abaphambili abasetyenziswayo ukuphuhlisa iiblade/i-laser optics ezihambelana nesicelo.

2. Inkxaso yoBugcisa boBugcisa
· Inkxaso Ezinikeleyo Kwindawo: Nika iinjineli eziqinisekisiweyo izithuba ezibalulekileyo zokunyuka (ngesiqhelo iiveki ezi-2-4), eziquka:
Ukulungiswa kwezixhobo kunye nokulungiswa kweenkqubo
Uqeqesho lobuchule bomqhubi
Isikhokelo sokudibanisa amagumbi okucoca e-ISO Class 5
· Ukugcinwa kwangaphambili: Ukuhlolwa kwempilo rhoqo ngekota ngohlalutyo lokungcangcazela kunye nokuxilongwa kwe-servo motor ukuthintela ixesha lokungasebenzi elingalindelekanga.
· Ukubeka esweni kude: Ukulandelela ukusebenza kwezixhobo ngexesha langempela ngeqonga lethu le-IoT (JCFront Connect®) kunye nezilumkiso ezizenzekelayo ezingaqhelekanga.

3. Iinkonzo ezongezelelekileyo
· Isiseko soLwazi lweNkqubo: Fikelela kwiiresiphi zokusika eziqinisekisiweyo ezingaphezu kwama-300 zezinto ezahlukeneyo (zihlaziywa rhoqo ngekota).
· Ulungelelwaniso lweNdlela yoBugcisa: Ukukhusela utyalo-mali lwakho kwixesha elizayo ngeendlela zokuphucula izixhobo zekhompyutha/isoftware (umz., imodyuli yokufumanisa iziphene esekwe kwi-AI).
· Impendulo engxamisekileyo: Ukuxilongwa okuqinisekisiweyo kweeyure ezi-4 kude kunye nokungenelela kwindawo (ukugubungela ihlabathi).

4. Iziseko zoPhuhliso lweNkonzo
· Isiqinisekiso sokusebenza: Ukuzibophelela ngokwesivumelwano kwixesha lokusebenza kwezixhobo ezingama-≥98% kunye namaxesha okuphendula axhaswa yi-SLA.

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