I-substrate ye-SiC uhlobo lwe-P 4H/6H-P 3C-N ubukhulu obuyi-4inch obuyi-350um Ibanga lemveliso Ibanga elingaqhelekanga
I-4inch SiC substrate P-type 4H/6H-P 3C-N parameter table
4 ububanzi be-intshiIsiseko seCarbide (SiC) Inkcazo
| Ibanga | Imveliso ye-MPD engekhoyo Ibanga (Z) Ibanga) | Imveliso Esemgangathweni Ibanga (P) Ibanga) | Ibanga elingeyonyani (D Ibanga) | ||
| Ububanzi | 99.5 mm~100.0 mm | ||||
| Ubukhulu | 350 μm ± 25 μm | ||||
| Uqeqesho lweWafer | I-axis engaphandle: 2.0°-4.0°ukuya [11]20] ± 0.5° kwi-4H/6H-P, Oi-n axis:〈111〉± 0.5° ye-3C-N | ||||
| Uxinano lweeMipayipi ezincinci | 0 cm-2 | ||||
| Ukuxhathisa | uhlobo lwe-p 4H/6H-P | ≤0.1 Ωꞏcm | ≤0.3 Ωꞏcm | ||
| uhlobo lwe-n 3C-N | ≤0.8 mΩꞏcm | ≤1 m Ωꞏcm | |||
| Uqhelaniso oluPhambili oluSicaba | 4H/6H-P | - {1010} ± 5.0° | |||
| 3C-N | - {110} ± 5.0° | ||||
| Ubude obuPhambili obuSicaba | 32.5 mm ± 2.0 mm | ||||
| Ubude obuSicaba beSibini | 18.0 mm ± 2.0 mm | ||||
| Ulwazelelelo lweSibini oluSicaba | I-silicon ijonge phezulu: 90° CW. ukusuka kwiPrime flat±5.0° | ||||
| Ukukhutshwa komda | 3 mm | 6 mm | |||
| I-LTV/TTV/Isaphetha/I-Warp | ≤2.5 μm/≤5 μm/≤15 μm/≤30 μm | ≤10 μm/≤15 μm/≤25 μm/≤40 μm | |||
| Uburhabaxa | I-Polish Ra≤1 nm | ||||
| I-CMP Ra≤0.2 nm | I-Ra≤0.5 nm | ||||
| Iimfanta zoMphetho ngokukhanya okuphezulu | Akukho nanye | Ubude obuqokelelweyo ≤ 10 mm, ubude obunye ≤2 mm | |||
| Iipleyiti zeHex Ngokukhanya Okuphezulu Kobungqingqwa | Indawo eqokelelweyo ≤0.05% | Indawo eqokelelweyo ≤0.1% | |||
| Iindawo zePolytype Ngokukhanya Okuphezulu | Akukho nanye | Indawo eqokelelweyo≤3% | |||
| Izinto ezibandakanyiweyo zeCarbon ezibonakalayo | Indawo eqokelelweyo ≤0.05% | Indawo eqokelelweyo ≤3% | |||
| Imikrwelo yomphezulu weSilicone Ngokukhanya Okuphezulu | Akukho nanye | Ubude obuqokelelweyo ≤1 × ububanzi besitya esisicaba | |||
| Iitships zomphetho eziphezulu ngokukhanya okunamandla | Akukho kuvunyelweyo ububanzi nobunzulu obuyi-≥0.2mm | 5 zivumelekile, ≤1 mm nganye | |||
| Ukungcoliswa komphezulu weSilicon Ngumandla aphezulu | Akukho nanye | ||||
| Ukupakisha | Ikhasethi yeewafer ezininzi okanye isitya sewafer esinye | ||||
Amanqaku:
※Imida yeziphene isebenza kumphezulu we-wafer yonke ngaphandle kwendawo engafakwanga umphetho. # Imikrwelo mayijongwe ebusweni be-Si kuphela.
I-substrate ye-P-type 4H/6H-P 3C-N 4-intshi SiC enobukhulu obuyi-350 μm isetyenziswa kakhulu kwimveliso yezixhobo ze-elektroniki nezisebenzisa amandla. Ngombane ogqwesileyo wokushisa, i-voltage ephezulu yokuqhekeka, kunye nokumelana okunamandla kwiindawo ezishushu kakhulu, le substrate ifanelekile kwizixhobo ze-elektroniki ezisebenzisa amandla aphezulu ezifana nezitshintshi ze-voltage ephezulu, ii-inverters, kunye nezixhobo ze-RF. Izixhobo ze-substrate ezisebenzisa amandla aphezulu zisetyenziswa kwimveliso enkulu, ukuqinisekisa ukusebenza kwezixhobo okuthembekileyo nokuchanekileyo, okubaluleke kakhulu kwizixhobo ze-elektroniki ezisebenzisa amandla aphezulu kunye nezicelo ze-frequency ephezulu. Kwelinye icala, izixhobo ze-dummy-grade zisetyenziswa kakhulu ekulinganisweni kwenkqubo, ukuvavanywa kwezixhobo, kunye nophuhliso lweeprototype, ukunceda ukugcina ulawulo lomgangatho kunye nokuhambelana kwenkqubo kwimveliso ye-semiconductor.
IinkcukachaIingenelo ze-N-type SiC composite substrates ziquka
- Ukuqhuba okuphezulu kobushushu: Ukuchithwa kobushushu ngokufanelekileyo kwenza isiseko sibe sesona sifanelekileyo kwiindlela zokusebenzisa ubushushu obuphezulu kunye namandla aphezulu.
- I-Voltage ephezulu yokuphazamiseka: Ixhasa ukusebenza kwe-high-voltage, iqinisekisa ukuthembeka kwezixhobo ze-elektroniki kunye nezixhobo ze-RF.
- Ukuchasana neemeko ezinzima: Ihlala ixesha elide kwiimeko ezinzima ezifana namaqondo obushushu aphezulu kunye neendawo ezingcolisayo, okuqinisekisa ukusebenza okuhlala ixesha elide.
- Ukuchaneka kweMpahla yeMveliso: Iqinisekisa ukusebenza okusemgangathweni ophezulu nokuthembekileyo kwimveliso enkulu, ifanelekile kwiindlela eziphambili zombane kunye nezicelo zeRF.
- Uvavanyo lweBanga eliyiMboniso: Ivumela ukulinganiswa kweenkqubo ngokuchanekileyo, uvavanyo lwezixhobo, kunye nomzekelo ngaphandle kokubeka emngciphekweni ii-wafers zezinga lokuvelisa.
Ngokubanzi, i-substrate ye-P-type 4H/6H-P 3C-N 4-intshi SiC enobukhulu obuyi-350 μm inika iingenelo ezibalulekileyo kwizicelo ze-elektroniki ezisebenzayo kakhulu. Ukuqhuba kwayo okuphezulu kobushushu kunye ne-voltage yokuqhekeka kwenza ukuba ilungele iindawo ezinamandla aphezulu kunye nobushushu obuphezulu, ngelixa ukumelana kwayo neemeko ezinzima kuqinisekisa ukuqina kunye nokuthembeka. I-substrate yenqanaba lokuvelisa iqinisekisa ukusebenza ngokuchanekileyo nangokuhambelanayo kwimveliso enkulu yezixhobo ze-elektroniki zamandla kunye ne-RF. Okwangoku, i-substrate yenqanaba eliyi-dummy ibalulekile ekulinganisweni kwenkqubo, ukuvavanywa kwezixhobo, kunye nokwenza iiprototyping, ixhasa ulawulo lomgangatho kunye nokuhambelana kwimveliso ye-semiconductor. Ezi mpawu zenza i-substrates ze-SiC zibe luncedo kakhulu kwizicelo eziphambili.
Umzobo oneenkcukacha




