Multi-Wire Diamond Sawing Machine for SiC Sapphire Ultra-Hard Brittle Materials
Intshayelelo kumatshini wokuSarha weDayimane oManyeneyo
Umatshini wokusarha wedayimani oneentambo ezininzi yinkqubo yangoku yokusika eyilelwe ukusetyenzwa nzima kakhulu kunye nemathiriyeli enqabileyo. Ngokufaka iingcingo ezininzi ezinxuseneyo ezigqunywe ngedayimani, umatshini unokusika ngaxeshanye iiwafa ezininzi kumjikelo omnye, uphumeza zombini ukuphumela okuphezulu kunye nokuchaneka. Le teknoloji iye yaba sisixhobo esibalulekileyo kumashishini afana ne-semiconductors, i-photovoltaics yelanga, ii-LED, kunye neekeramics eziphambili, ngakumbi kwizinto ezifana ne-SiC, isafire, i-GaN, i-quartz, kunye ne-alumina.
Xa kuthelekiswa nokusika okuqhelekileyo kocingo olunye, ukucwangciswa kweengcingo ezininzi kuzisa amashumi kumakhulu ezilayi kwibhetshi nganye, ukunciphisa kakhulu ixesha lomjikelo ngelixa ugcina ukucaba okugqwesileyo (Ra <0.5 μm) kunye nokuchaneka kwe-dimensional (± 0.02 mm). Uyilo lwayo oluyimodyuli ludibanisa ukucinezelwa kocingo oluzenzekelayo, iinkqubo zokuphatha izixhobo zokusebenza, kunye nokubeka iliso kwi-intanethi, ukuqinisekisa ixesha elide, elizinzileyo, kunye nemveliso ezenzekelayo ngokupheleleyo.
IiParameters zobuGcisa beMulti-Wire Diamond Sawing Machine
| Into | Inkcazo | Into | Inkcazo |
|---|---|---|---|
| Obona bukhulu bobungakanani bomsebenzi (Isikwere) | 220 × 200 × 350 mm | Qhuba injini | 17.8 kW × 2 |
| Obona bukhulu bobungakanani bomsebenzi (Umjikelo) | Φ205 × 350 mm | Injini yokuqhuba ucingo | 11.86 kW × 2 |
| Izithuba zespindle | Φ250 ±10 × 370 × 2 umgca osembindini (mm) | Injini yokunyusa esebenzayo | 2.42 kW × 1 |
| Umgca ohamba phambili | 650 mm | Ujingi injini | 0.8 kW × 1 |
| Isantya sokubaleka kocingo | 1500 m/min | Injini yokulungelelanisa | 0.45 kW × 2 |
| Idayamitha yocingo | Φ0.12–0.25 mm | Injini yoxinzelelo | 4.15 kW × 2 |
| Phakamisa isantya | 225 mm/min | Injini ethambileyo | 7.5 kW × 1 |
| Max. ukujikeleza kwetafile | ±12° | Umthamo wetanki eludaka | 300 L |
| I-engile yokujingi | ±3° | Ukuhamba okupholileyo | 200 L/min |
| Ujingi rhoqo | ~ 30 amaxesha/min | Temp. ukuchaneka | ±2 °C |
| Izinga lokutya | 0.01–9.99 mm/min | Ukunikezwa Amandla | 335+210 (mm²) |
| wire feed rate | 0.01–300 mm/min | Umoya oxinanisiweyo | 0.4–0.6 MPa |
| Ubungakanani bomatshini | 3550 × 2200 × 3000 mm | Ubunzima | 13,500 kg |
Umatshini wokuSebenza weMulti-Wire Diamond Sawing Machine
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Multi-Wire Cutting Motion
Iingcingo ezininzi zedayimani zihamba ngesantya esidityanisiweyo ukuya kuthi ga kwi-1500 m/min. Iipuli ezikhokelwa ngokuchanekileyo kunye nokulawula ukunyanzeliswa kwe-loop evaliweyo (15-130 N) zigcina iingcingo zizinzileyo, zinciphisa ithuba lokuphambuka okanye ukuphuka. -
Ukutya okuchanekileyo kunye nokumiswa
Ukuma okuqhutywa yi-Servo kuphumelela ±0.005 mm ukuchaneka. I-laser yokuzikhethela okanye ukulungelelaniswa kokuncedisa umbono kuphucula iziphumo zeemilo ezinzima. -
Ukupholisa kunye nokususwa kobutyobo
Ukupholisa koxinzelelo oluphezulu ngokuqhubekayo kususa iitshiphusi kunye nokupholisa indawo yokusebenza, ukuthintela ukonakala kwe-thermal. Ukuhluzwa kwamanqanaba amaninzi kwandisa ubomi bokupholisa kwaye kunciphisa ixesha lokuphumla. -
I-Smart Control Platform
Abaqhubi be-servo abaphendulayo ephezulu (<1 ms) bahlengahlengisa ngokutshintsha ukutya, uxinzelelo, kunye nesantya socingo. Ulawulo oludityanisiweyo lweresiphi kunye nokucofa-kanye iparamitha ukutshintshela imveliso yobuninzi.
IiNzuzo ezingundoqo zeMulti-Wire Diamond Sawing Machine
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Imveliso ephezulu
Iyakwazi ukusika i-50-200 wafers ngokubaleka, kunye nelahleko ye-kerf <100 μm, ukuphucula ukusetyenziswa kwezinto ukuya kwi-40%. I-Input yi-5–10× leyo yeenkqubo zesithethe zocingo olunye. -
Ulawulo oluchanekileyo
Uzinzo lwentambo yocingo ngaphakathi kwe ±0.5 N iqinisekisa iziphumo ezingaguqukiyo kwizinto ezahlukeneyo ezibrittle. Ukubeka iliso okwexesha lokwenyani kwi-10" ye-HMI yojongano ixhasa ukugcinwa kweresiphi kunye nokusebenza kude. -
I-Flexible, iModyuli yoKwakha
Ihambelana nocingo lweediameters ukusuka kwi-0.12-0.45 mm kwiinkqubo ezahlukeneyo zokusika. Ukusingatha i-robotic yokuzikhethela ivumela imigca yemveliso ezenzekelayo ngokupheleleyo. -
Ukuthembeka kweBanga loShishino
Iifreyimu ezinobunzima obunzima/ezibunjiweyo zinciphisa ukonakala (<0.01 mm). Iipuli zesikhokelo ezineceramic okanye i-carbide coatings zibonelela ngeeyure ezingama-8000 zobomi benkonzo.
Iinkalo zeSicelo zeMulti-Wire Diamond Sawing Machine
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Iisemiconductors: Ukusika i-SiC yeemodyuli zamandla e-EV, i-GaN substrates yezixhobo ze-5G.
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Iifotovoltaics: Ukusikwa kwe-silicon yesantya esiphezulu kunye ne-±10 μm efanayo.
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I-LED kunye ne-Optics: I-Sapphire substrates ye-epitaxy kunye ne-precision optical elements kunye ne-<20 μm edge chipping.
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Advanced Ceramics: Ukulungiswa kwe-alumina, i-AlN, kunye nezixhobo ezifanayo ze-aerospace kunye namacandelo olawulo lwe-thermal.
I-FAQ-Umatshini wokuSarha weDayimane oManinzi-Wire
I-Q1: Zeziphi iingenelo zokusarha iintambo ezininzi xa kuthelekiswa noomatshini bocingo olunye?
A: Iisistim zocingo ezininzi zinokucanda amashumi ukuya kumakhulu ee-wafers ngaxeshanye, zikhulisa ukusebenza kakuhle nge-5-10×. Ukusetyenziswa kwezinto eziphathekayo kukwaphezulu ngelahleko ye-kerf engaphantsi kwe-100 μm, iyenza ilungele imveliso yobuninzi.
I-Q2: Ziziphi iintlobo zezinto ezinokuqhutyelwa phambili?
A: Umatshini wenzelwe izinto ezinzima kunye neziqhekezayo, ezibandakanya i-silicon carbide (SiC), isafire, i-gallium nitride (i-GaN), i-quartz, i-alumina (Al₂O₃), kunye ne-aluminium nitride (AlN).
I-Q3: Yintoni ukuchaneka okufikelelekayo kunye nomgangatho womphezulu?
A: Uburhabaxa bomphezulu bunokufikelela kwi-Ra <0.5 μm, ngokuchaneka kwe-dimensional ± 0.02 mm. I-Edge chipping inokulawulwa kwi-<20 μm, ukuhlangabezana ne-semiconductor kunye nemigangatho yoshishino lwe-optoelectronic.
I-Q4: Ngaba inkqubo yokusika ibangela ukuqhekeka okanye umonakalo?
A: Ngoxinzelelo oluphezulu lokupholisa kunye nolawulo lokuxinezeleka oluvaliweyo, umngcipheko wokuqhekeka kancinci kunye nomonakalo woxinzelelo uyancitshiswa, uqinisekisa ingqibelelo ebalaseleyo ye-wafer.
