IsiXhobo esiSetyenziswayo ngokuPheleleyo se-wafer-Catting Ubungakanani obuSebenzayo 8inch/12inch Wafer Ring Cutting

Okuzenzekelayo ngokuzeleyo iWafer Ring-Cutting Isixhobo soBubungakanani bokusebenza 8inch/12inch Wafer Ring Cutting Featured Image

Inkcazelo emfutshane:

I-XKH iye yaphuhlisa ngokuzimeleyo inkqubo yokucheba umphetho we-wafer, emele isisombululo esiphuhlileyo esilungiselelwe iinkqubo zokwenziwa kwe-semiconductor yangaphambili. Esi sixhobo sibandakanya iteknoloji yokulawula i-multi-axis ye-synchronous kunye ne-high-rigidity spindle system (isantya esiphezulu sokujikeleza: i-60,000 RPM), ihambisa i-edge trimming ngokuchaneka kokusika ukuya kwi-± 5μm. Inkqubo ibonisa ukuhambelana okugqwesileyo kunye neendawo ezahlukeneyo ze-semiconductor, kubandakanywa kodwa kungaphelelanga apho:
1.Silicon wafers (Si): Ilungele edge processing of 8-12 intshi wafers;
I-2.I-semiconductors ye-Compound: Izinto ze-semiconductor zesizukulwana sesithathu ezifana ne-GaAs kunye ne-SiC;
3.Iinxalenye ezikhethekileyo: Iziqwenga zezinto zombane zePiezoelectric kuquka iLT/LN;

Uyilo lwemodyuli luxhasa ukutshintshwa ngokukhawuleza kwezinto ezininzi ezisetyenziswayo ezibandakanya iiblades zedayimane kunye neentloko zokusika i-laser, kunye nokuhambelana okudlula imigangatho yoshishino. Kwiimfuno zenkqubo ekhethekileyo, sibonelela ngezisombululo ezibanzi ezibandakanya:
· Unikezelo lwezixhobo ezisetyenziswayo zokusika ezinikezelweyo
· Iinkonzo zokulungisa ngokwesiko
· Izisombululo zeparameter yenkqubo

Thumela i-imeyile kuthi

Iimbonakalo

Iiparamitha zobugcisa

Ipharamitha	Iyunithi	Inkcazo
Ubungakanani obukhulu boMsebenzi	mm	ø12"
I-spindle	Uqwalaselo	I-Spindle enye
	Isantya	3,000-60,000 rpm
	Amandla emveliso	1.8 kW (2.4 ungazikhethela) ku-30,000 min⁻¹
	UMax Blade Dia.	Ø58 mm
I-X-Axis	Uluhlu lokusika	310 mm
I-Y-Axis	Uluhlu lokusika	310 mm
	Inyathelo lokunyuswa	0.0001 mm
	Ukubeka Ukuchaneka	≤0.003 mm/310 mm, ≤0.002 mm/5 mm (impazamo enye)
Z-Axis	ISigqibo seMovement	0.00005 mm
Z-Axis	Ukuphindaphinda	0.001 mm
θ-Umgca	Ukujikeleziswa okukhulu	380 deg
Uhlobo lweSpindle		I-spindle enye, ixhotyiswe ngencakuba eqinileyo yokusika iringi
Ring-Cutting Ukuchaneka	μm	±50
IWafer Positioning Ukuchaneka	μm	±50
I-Single-Wafer Efficiency	min/isiqwengana esisicaba	8
I-Multi-Wafer Efficiency		Ukuya kuthi ga kwii-wafers ezi-4 eziqhutywe ngaxeshanye
Ubunzima beZixhobo	kg	≈3,200
Imilinganiselo yesiXhobo (W×D×H)	mm	2,730 × 1,550 × 2,070

Umgaqo wokuSebenza

Inkqubo ifezekisa ukusebenza okuncomekayo kokucutha ngezi teknoloji zingundoqo:

1.Inkqubo yoLawulo lweNtshukumo ekrelekrele:
· Ukuchaneka okuphezulu komgca wemoto wokuqhuba (phinda ukuchaneka kokumisa: ±0.5μm)
· Ulawulo oluhambelanayo lwe-axis emithandathu oluxhasa isicwangciso sendlela enzima
· Ii-algorithms zoxinzelelo lwexesha lokwenyani ziqinisekisa uzinzo lokusika

2.Isixokelelwano esiPhambili sokuFumana:
· Inzwa yobude belaser edibeneyo ye-3D (ukuchaneka: 0.1μm)
· Ukubekwa kwembonakalo yeCCD enesoso esiphezulu (5 megapixels)
· Imodyuli yokuhlola umgangatho kwi-Intanethi

3.Inkqubo Ezenzekela Ngokupheleleyo:
· Ukulayisha/ukukhuphela ngokuzenzekelayo (ujongano olusemgangathweni lweFOUP luyahambelana)
· Inkqubo ekrelekrele yokuhlela
· Iyunithi yokucoca iluphu evaliweyo (ucoceko: Udidi lwe-10)

Usetyenziso oluqhelekileyo

Esi sixhobo sinikezela ngexabiso elibalulekileyo kuzo zonke izicelo zokwenziwa kwe-semiconductor:

Indawo yosetyenziso	Izinto eziphathekayo	Izinto eziluncedo kwezobuGcisa
IC Manufacturing	8/12 "Ii-Silicon Wafers	Ukuphucula ulungelelwaniso lwelithography
Izixhobo zamandla	IiWafers zeSiC/GaN	Ikhusela iziphene ezisecaleni
Iinzwa zeMEMS	Ii-wafers ze-SOI	Iqinisekisa ukuthembeka kwesixhobo
Izixhobo zeRF	GaAs Wafers	Ukuphucula ukusebenza kwe-high-frequency
UkuPakisha okuPhezulu	IiWafers ezihlaziyiweyo	Yandisa isivuno sokupakisha

Iimbonakalo

Uqwalaselo lwesikhululo se-1.
2.Stable TAIKO ring debonding kunye nokususwa;
3.Ukuhambelana okuphezulu kunye nezinto ezisetyenziswayo eziphambili;
I-4.I-Multi-axis yokucutha itekhnoloji yokuvumelanisa iqinisekisa ukusika okuchanekileyo komphetho;
5.Ukuhamba kwenkqubo ezenzekelayo ngokupheleleyo kunciphisa kakhulu iindleko zabasebenzi;
I-6.Uyilo lwe-worktable olulungiselelweyo luvumela ukuqhutyelwa kwezakhiwo ezikhethekileyo;

Imisebenzi

1.Iringi-ithontsi inkqubo yokufumanisa;
2.Ukucoca okuzenzekelayo kwitafile yokusebenza;
3.Intelligent UV inkqubo debonding;
4.Ukurekhoda kwelog yokusebenza;
5.Factory automation imodyuli udibaniso;

UkuZibophelela ngeNkonzo

I-XKH ibonelela ngeenkonzo ezibanzi, ezipheleleyo zenkxaso yendlela yokuphila eyilelwe ukwandisa ukusebenza kwezixhobo kunye nokusebenza kakuhle kulo lonke uhambo lwakho lokuvelisa.
1. Iinkonzo zokuLungisa
· Ulungelelwaniso lweSixhobo esiQinisekisiweyo: Iqela lethu lobunjineli lisebenzisana ngokusondeleyo nabathengi ukuze kuphuculwe iiparameters zenkqubo (isantya sokusika, ukukhetha i-blade, njl. njl.) ngokusekelwe kwiipropati ezithile zezinto (Si / SiC / GaAs) kunye neemfuno zenkqubo.
· INkxaso yoPhuhliso lweNkqubo: Sinikezela ngokusetyenzwa kwesampulu ngeengxelo zohlalutyo oluneenkcukacha ezibandakanya umlinganiselo woburhabaxa kunye nemephu yesiphene.
· Uphuhliso oluhlangeneyo lwezinto ezisetyenziswayo: Kwimathiriyeli yenoveli (umzekelo, i-Ga₂O₃), sisebenzisana nabenzi bezinto ezityiwayo abakhokelayo ukuphuhlisa iiblades/i-laser optics.

2. Inkxaso yobuGcisa kwezobuGcisa
· INkxaso eMiselweyo kwiNdawo: Yabela iinjineli eziqinisekisiweyo kwizigaba ezibalulekileyo zokunyuka (ngokuqhelekileyo iiveki ezi-2-4), eziquka:
Ulungelelwaniso lwezixhobo & inkqubo yokulungisa kakuhle
Uqeqesho lobuchule bokusebenza
ISO Class 5 isikhokelo sokudityaniswa kwegumbi lokucoca
· Ugcino oluqikelelwayo: Ukuhlolwa kwezempilo ngekota ngohlalutyo lokungcangcazela kunye nokuxilongwa kweemoto ze-servo ukuthintela ixesha lokuphumla elingacwangciswanga.
· Ukujongwa okukude: Ukulandelela ukusebenza kwezixhobo zexesha langempela ngeqonga lethu le-IoT (JCFront Connect®) enezilumkiso ezizenzekelayo ezingaqhelekanga.

3. Iinkonzo ezongeziweyo kwixabiso
· Isiseko soLwazi lweNkqubo: Ukufikelela ku-300+ kwiiresiphi zokusika eziqinisekisiweyo zezixhobo ezahlukeneyo (zihlaziywa ngekota).
· Ulungelelwaniso lweMephu yeTekhnoloji: Ubungqina bexesha elizayo botyalo-mali lwakho ngehardware/isoftware yokuphucula iindlela (umzekelo, imodyuli yokufumanisa isiphene esekwe kwi-AI).
· Iimpendulo eziNgxamisekileyo: Uxilongo oluqinisekisiweyo lweeyure ezi-4 ezikude kunye nongenelelo lweeyure ezingama-48 kwindawo (i-global coverage).

4. Iziseko zoncedo zenkonzo
· Isiqinisekiso sokuSebenza: Ukuzibophelela kwikhontrakthi kwi-≥98% yezixhobo zokusebenza kunye namaxesha okuphendula axhaswa yi-SLA.

Uphuculo oluqhubekayo

Senza uphando lokwaneliseka kwabathengi rhoqo kabini ngonyaka kwaye siphumeza amalinge eKaizen ukomeleza unikezelo lwenkonzo. Iqela lethu le-R&D liguqulela ulwazi kwinkalo yokuphuculwa kwezixhobo - i-30% yokuphuculwa kwe-firmware isuka kwiingxelo zabaxumi.