Umatshini wokubona idayimani ye-Inverted Swing-Type Multi-Wire Diamond Saw okhawulezayo oluphezulu oluchanekileyo
Umzobo oneenkcukacha
Isishwankathelo seMveliso
I-TJ2000 yisarha yedayimani eneengcingo ezininzi ekhawulezayo nechanekileyo, eyenzelwe ukunqumla ngokuchanekileyo izinto eziqinileyo neziqhekekayo.
Le nkqubo isebenzisa isakhiwo esiguqulweyo apho umsebenzi ujika kwaye wondla ezantsi ukusuka phezulu ukuya ezantsi ngelixa ucingo lwedayimani luhlala lungashukumi.
Le ngcamango yokusika inciphisa ngempumelelo ukungcangcazela kunye neepateni zentambo, ibonelela ngokukhanya okuphezulu kunye nomgangatho ophezulu womphezulu kunye nokuchaneka kobukhulu.
Izixhobo zoSetyenziso kunye nobukhulu boMsebenzi
I-TJ2000 yenzelwe ukusika ngobukhulu obukhulu nobuncinci kakhulu:
I-silicon carbide (i-SiC)
I-Sapphire
Iiseramikhi eziphambili
Iintsimbi ezixabisekileyo
I-Quartz
Izixhobo ze-semiconductor
Iglasi ebonakalayo
Iglasi elaminethiweyo
Ubungakanani obukhulu bomsebenzi:φ204 × 500 mm.
Uluhlu lokusika ubukhulu:0.1 – 20 mm, ngokuchaneka okuqhelekileyo kobukhulu obujikeleze0.01 mm, egubungela ii-wafers eziqhelekileyo kunye ne-substrates ezibhityileyo kakhulu ze:
Ukusikwa kwe-Crystal ingot
Imveliso yesafire substrate
Ukuvulwa kwesiseko se-ceramic
Ukusika izinto ezibonakalayo, njl.
Indlela Yokusika kunye noLawulo Lokuhamba
-
Indlela yokusika:ukusika okujijekileyo okuguqulweyo(ii-workpiece swings, i-diamond wire stationary)
Uluhlu lokujika:±8°
Isantya sokujika:≈ 0.83°/s
Ukuphakamisa ngokuthe nkqo kwetafile yokusebenza:250 mm
Ubunzulu obukhulu bokusika:500 mm
Indlela yokusika etshintsha rhoqo ithintela kakhulu iimpawu zentambo eziphindaphindwayo kunye neepatheni zokuphazamiseka, iphucula ukuthamba komphezulu kunye nokufana kobukhulu.
Uyilo lwe-full-servo drive luqinisekisa intshukumo echanekileyo nephindaphindwayo kuzo zonke ii-axes.

Inkqubo yeWire kunye nokusebenza kokusika
-
Ububanzi bentambo yedayimani exhaswayo:0.1 – 0.5 mm
-
Isantya sentambo: ukuya kuthi ga2000 m/ngomzuzu
-
Isantya sokusika ukutya:0.01 – 10 mm/ngomzuzu
-
Ukusika uluhlu loxinzelelo:10 – 60 N, ehlengahlengiswayo nge0.1 Ninyathelo elincinci
-
Umthamo wokugcina iingcingo: ukuya kuthi ga20 kmyocingo (esekelwe kwi-φ0.25 mm)
Ezi mpawu zivumela:
-
Ukulungiswa kakuhle kweeparamitha zenkqubo kwizixhobo ezahlukeneyo kunye nobubanzi bentambo
-
Ukusikwa okusebenzayo kakhulu ngaphandle kokunciphisa umgangatho womphezulu
-
Ukusika okuqhubekekayo ixesha elide kunye notshintsho oluncinci lwentambo kunye nexesha eliphezulu lokusebenza kwezixhobo
Iinkqubo zokupholisa, zokucoca kunye nezoNcedo
-
Umthamo wetanki yesipholisi:300 L
-
Inkqubo yokujikeleza kolwelo esebenza kakuhle kakhulu, echasene nomhlwa, ezinikele ngokupheleleyo
Le nkqubo ibonelela:
-
Ukupholisa okuzinzileyo kunye nokuthambisa kwindawo yokusika
-
Ukususwa kweetshiphusi ngokufanelekileyo
-
Ukuqhekeka komphetho okunciphileyo, ii-micro-cracks, kunye nomonakalo wobushushu
-
Ixesha elide lenkonzo yocingo lwedayimani kunye neerola ezikhokelayo
Ulwakhiwo loomatshini kunye noqwalaselo lwamandla
-
Ukunikezwa Amandla:I-AC 380 V / 50 Hz, enezigaba ezintathu, enezintambo ezintlanu
-
Amandla apheleleyo afakiweyo:≤ 92 kW
-
Injini ephambili epholiswe ngamanzi, kunye neemoto ezininzi ze-servo ezizimeleyo ze:
-
Ukuqhuba ngentambo kunye nokujikajika
-
Ulawulo loxinzelelo
-
I-swing yetafile yokusebenza
-
Ukuphakamisa iitafile zokusebenza, njl.
-
Ulwakhiwo loomatshini:
-
Ubukhulu obupheleleyo (kubandakanya ibhokisi yengalo ye-rocker):≈ 2850 × 1320 × 3000 mm
-
Ubunzima bomatshini:≈ 8000 kg
Isakhelo esiqinileyo kakhulu kunye noyilo olunzima luqinisekisa ukumelana nokungcangcazela okuhle kakhulu kunye nokuzinza kwexesha elide phantsi kokusebenza komthwalo omninzi, ixesha elide.
I-HMI eguquguqukayo kunye nendawo yokulungisa elungiselelweyo yenza kube lula ukulayisha/ukukhulula izinto ezinkulu zokusebenza kunye nenkonzo yesiqhelo.
Ulwakhiwo loomatshini kunye noqwalaselo lwamandla
| Hayi. | Into | Inkcazo |
|---|---|---|
| 1 | Ubungakanani obukhulu bomsebenzi | Ø204 × 500 mm |
| 2 | Ububanzi bengubo yerola ephambili | Ø240 × 510 mm, iirola ezimbini eziphambili |
| 3 | Isantya sokusebenza kwentambo | 2000 m/min (ubuninzi.) |
| 4 | Ububanzi bentambo yedayimani | 0.1 – 0.5 mm |
| 5 | Umthamo wokugcina umgca wevili lokuhambisa | Iikhilomitha ezingama-20 (zisekelwe kwintambo yedayimani ye-Ø0.25 mm) |
| 6 | Uluhlu lokusika ubukhulu | 0.1 – 20 mm |
| 7 | Ukuchaneka kokusika | 0.01 mm |
| 8 | Ukunyuka okuthe nkqo kwendawo yokusebenza | 250 mm |
| 9 | Indlela yokusika | Isixhobo somsebenzi siyashukuma size sehle ukusuka phezulu ukuya ezantsi ngelixa ucingo lwedayimani luhlala lungashukumi |
| 10 | Isantya sokusika ukutya | 0.01 – 10 mm/ngomzuzu |
| 11 | Itanki yamanzi | 300 L |
| 12 | Ulwelo lokusika | Ulwelo lokusika olusebenza kakuhle kakhulu oluchasene nomhlwa |
| 13 | I-engile yokujika | ±8° |
| 14 | Isantya sokujika | 0.83°/s |
| 15 | Uxinzelelo olukhulu lokusika | 10 - 60 N, iyunithi yokuseta encinci yi-0.1 N |
| 16 | Ubunzulu bokusika (umthamo wokulayisha) | 500 mm |
| 17 | Iibhentshi zomsebenzi | 1 |
| 18 | Ukunikezwa Amandla | I-AC enamaqonga amathathu, enezintambo ezintlanu i-AC 380 V / 50 Hz |
| 19 | Amandla apheleleyo esixhobo somatshini | ≤ 92 kW |
| 20 | Injini ephambili (ukupholisa ukujikeleza kwamanzi) | 22 kW × 2 |
| 21 | Injini yocingo | 2 kW × 1 |
| 22 | Injini yokujika yebhentshi yokusebenza | 1.5 kW × 1 |
| 23 | Injini yokunyuka nokuwa ebhentshini | 0.4 kW × 1 |
| 24 | Injini yokulawula uxinzelelo (ukupholisa ukujikeleza kwamanzi) | 5.5 kW × 2 |
| 25 | Imoto yokukhupha iingcingo kunye nokuqokelela | 15 kW × 2 |
| 26 | Ubukhulu bangaphandle (ngaphandle kwebhokisi yengalo yerocker) | 2660 × 1320 × 2660 mm |
| 27 | Ubukhulu bangaphandle (kubandakanya ibhokisi yengalo yerocker) | 2850 × 1320 × 3000 mm |
| 28 | Ubunzima bomatshini | 8000 kg |
Imibuzo ebuzwa rhoqo ngeeGlasi zeQuartz
Umbuzo 1. Zeziphi izinto ezinokuthi zisikwe yi-TJ2000?
A:
I-TJ2000 yenzelwe ukunqumla ngokuchanekileyo izinto eziqinileyo nezibuthathaka, kuquka:
-
I-silicon carbide (i-SiC)
-
I-Sapphire
-
Iiseramikhi eziphucukileyo / zobugcisa
-
Iintsimbi ezixabisekileyo kunye nee-alloys eziqinileyo (kuxhomekeke kubunzima kunye nenkqubo)
-
I-Quartz kunye neeglasi ezikhethekileyo
-
Izixhobo zekristale ze-semiconductor
-
Iglasi ebonakalayo kunye neglasi elaminethiweyo
Umbuzo 2. Ubungakanani obukhulu bomsebenzi kunye nobubanzi bokusika buthini?
A:
-
Ubungakanani obukhulu bomsebenzi:Ø204 × 500 mm
-
Uluhlu lokusika ubukhulu:0.1 – 20 mm
-
Ukuchaneka kobukhulu obuqhelekileyo:≈ 0.01 mm(kuxhomekeke kwiimeko zezinto kunye nenkqubo)
Oku kuquka ii-wafers eziqhelekileyo kunye nee-substrates ezibhityileyo kakhulu.
Ngathi
I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.








