I-silicon dioxide wafer ye-SiO2 etyebileyo, ekhazimlisiweyo, i-Prime kunye ne-Test Grade

Inkcazo emfutshane:

I-oxidation yobushushu yimiphumo yokuveza i-silicon wafer kudibaniso lwee-oxidizing agents kunye nobushushu ukuze kwenziwe umaleko we-silicon dioxide (SiO2). Inkampani yethu ingenza ngokwezifiso ii-silicon dioxide oxide flakes ngeeparameter ezahlukeneyo kubathengi, ngomgangatho ogqwesileyo; ubukhulu be-oxide layer, ubuncinci, ukufana kunye nokujonga ikristale yokumelana nazo zonke ezi zinto zisetyenziswa ngokuhambelana nemigangatho yesizwe.


Iimbonakalo

Yazisa ngebhokisi ye-wafer

Imveliso Iiwafer zeThermal Oxide (Si+SiO2)
Indlela yoMveliso I-LPCVD
Ukupolisha umphezulu I-SSP/DSP
Ububanzi 2intshi / 3intshi / 4intshi / 5intshi / 6intshi
Uhlobo Uhlobo lwe-P / Uhlobo lwe-N
Ubukhulu be-Oxidation Layer 100nm ~ 1000nm
Ukuqhelaniswa <100> <111>
Ukumelana nombane 0.001-25000(Ω•cm)
Isicelo Isetyenziselwa ukuthwala isampuli yemitha ye-synchrotron, i-PVD/CVD coating njenge-substrate, isampuli yokukhula kwe-magnetron sputtering, i-XRD, i-SEM,Amandla e-athomu, i-infrared spectroscopy, i-fluorescence spectroscopy kunye nezinye ii-substrates zovavanyo lohlalutyo, ii-substrates zokukhula kwe-epitaxial ye-molecular beam, uhlalutyo lwe-X-ray lwee-semiconductors ze-crystalline

Ii-wafer ze-silicon oxide ziifilimu ze-silicon dioxide ezikhuliswe phezu kwee-wafer ze-silicon ngokusebenzisa i-oksijini okanye umphunga wamanzi kumaqondo obushushu aphezulu (800°C ~ 1150°C) kusetyenziswa inkqubo ye-thermal oxidation enezixhobo ze-atmospheric pressure furnace tube. Ubukhulu benkqubo buqala kwii-nanometers ezingama-50 ukuya kwi-2 microns, ubushushu benkqubo bufikelela kwi-1100 degrees Celsius, indlela yokukhula yahlulwe yaba ziintlobo ezimbini "ze-oxygen emanzi" kunye "ne-oxygen eyomileyo". I-Thermal Oxide lulwahlulo lwe-oxide "olukhulileyo", olune-uniformity ephezulu, i-density engcono kunye namandla aphezulu e-dielectric kunee-CVD deposited oxide layers, nto leyo ebangela umgangatho ophezulu.

Uxinzelelo lweOksijini eyomileyo

I-Silicon isabela kwi-oxygen kwaye umaleko we-oxide uhlala usiya kumaleko we-substrate. I-oxidation eyomileyo kufuneka yenziwe kumaqondo obushushu ukusuka kwi-850 ukuya kwi-1200°C, kunye namazinga okukhula aphantsi, kwaye ingasetyenziselwa ukukhula kwesango eligqunywe yi-MOS. I-oxidation eyomileyo ikhethwa kune-oxidation emanzi xa kufuneka umaleko we-silicon oxide osemgangathweni ophezulu, obhityileyo kakhulu. Umthamo we-oxidation eyomileyo: 15nm ~ 300nm.

2. Ukukhupha i-Oxidation emanzi

Le ndlela isebenzisa umphunga wamanzi ukwenza umaleko we-oxide ngokungena kwityhubhu yesithando phantsi kweemeko zobushushu obuphezulu. Uxinano lwe-oxidation ye-oxygen emanzi lubi kancinci kune-oxidation ye-oxygen eyomileyo, kodwa xa ithelekiswa ne-oxidation ye-oxygen eyomileyo inzuzo yayo kukuba inesantya esiphezulu sokukhula, esifanelekileyo ukukhula kwefilimu engaphezulu kwe-500nm. Umthamo we-oxidation emanzi: 500nm~2µm.

Ityhubhu ye-oxidation furnace ye-AEMD yoxinzelelo lomoya yityhubhu ye-Czech ethe tyaba ye-furnace, ebonakaliswa kukuzinza okuphezulu kwenkqubo, ukufana okuhle kwefilimu kunye nolawulo oluphezulu lwamasuntswana. Ityhubhu ye-silicon oxide furnace inokucubungula ukuya kuthi ga kwii-wafers ezingama-50 ngetyhubhu nganye, kunye nokufana okuhle kakhulu ngaphakathi nangaphakathi kwee-wafers.

Umzobo oneenkcukacha

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IMG_1589(1)

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