Umatshini wokuPolisha we-Ion Beam we-sapphire SiC Si
Umzobo oneenkcukacha
Isishwankathelo seMveliso yoMshini wokuPolisha we-Ion Beam
Umatshini wokulinganisa nokupholisha i-Ion Beam usekelwe kumgaqo wokutshiza i-ion. Ngaphakathi kwigumbi eline-vacuum ephezulu, umthombo we-ion uvelisa i-plasma, ekhawuleziswa ibe yi-ion beam enamandla aphezulu. Lo mqadi uqhuma kumphezulu we-optical component, ususa izinto kwisikali se-athomu ukuze kufezekiswe ukulungiswa komphezulu ngokuchanekileyo kunye nokugqitywa kwawo.
Njengenkqubo engabandakanyi unxibelelwano, ukupolisha ngemitha ye-ion kususa uxinzelelo loomatshini kwaye kuthintele umonakalo ongaphantsi komhlaba, okwenza kube yeyona nto ifanelekileyo ekuveliseni ii-optics ezichanekileyo ezisetyenziswa kwi-astronomy, kwi-aerospace, kwi-semiconductors, nakwizicelo zophando eziphambili.
Umgaqo oSebenzayo woMshini wokuPolisha we-Ion Beam
Isizukulwana se-Ion
Igesi engasebenziyo (umz., i-argon) ifakwa kwigumbi le-vacuum kwaye i-ionized ngokukhupha umbane ukuze yenze i-plasma.
Ukukhawulezisa kunye noKwakha imisebe
Ii-ion zikhawuleziswa ukuya kwii-electron volts (eV) ezingamakhulu okanye amawaka kwaye zenziwe zibe yindawo ezinzileyo, egxile kwimitha.
Ukususwa kwezinto
Umqadi we-ion ukhupha ii-athomu ngokwasemzimbeni ngaphandle kokuqalisa ii-chemical reactions.
Ukufumanisa Iimpazamo kunye nokuCwangcisa Indlela
Ukuphambuka komfanekiso womphezulu kulinganiswa nge-interferometry. Imisebenzi yokususa isetyenziswa ukumisela amaxesha okuhlala kunye nokwenza iindlela zezixhobo ezilungiselelweyo.
Ukulungiswa kweLoop eValiweyo
Imijikelo yokuphinda-phinda yokucubungula nokulinganisa iyaqhubeka ide kufikelelwe kwiithagethi zokuchaneka kwe-RMS/PV.
Iimpawu eziphambili zoMshini wokuPolisha we-Ion Beam
Ukuhambelana koMphezulu weNdawo yonke– Isebenza ngemiphezulu ethe tyaba, engqukuva, ejikelezileyo, nekhululekileyo
Izinga lokususa elizinzileyo kakhulu- Ivumela ukulungiswa kwesibalo se-sub-nanometer
Ukucubungula Okungenamonakalo– Akukho ziphene okanye utshintsho kwisakhiwo esingaphantsi komhlaba
Ukusebenza Okuqhubekayo– Isebenza kakuhle ngokulinganayo kwizinto ezinobunzima obahlukeneyo
Ukulungiswa kweFrequency ephantsi/ephakathi- Isusa iimpazamo ngaphandle kokuvelisa izinto ezisetyenziswa rhoqo/ezisetyenziswa rhoqo
Imfuneko Yokugcinwa Ephantsi– Ukusebenza ixesha elide rhoqo kunye nexesha elincinci lokungasebenzi
Iinkcukacha eziphambili zobugcisa zoMshini wokuPolisha we-Ion Beam
| Into | Inkcazo |
| Indlela Yokucubungula | I-ion itshiza kwindawo ene-vacuum ephezulu |
| Uhlobo Lokucubungula | Ukulinganisa kunye nokupolisha umphezulu ongadibaniyo |
| Ubungakanani boMsebenzi oMkhulu | Φ4000 mm |
| Ii-Axes zeMotion | I-axis ezi-3 / i-axis ezi-5 |
| Uzinzo lokususa | ≥95% |
| Ukuchaneka komphezulu | I-PV < 10 nm; I-RMS ≤ 0.5 nm (i-RMS eqhelekileyo < 1 nm; I-PV < 15 nm) |
| Ubuchule boLungiso lweeFrequency | Isusa iimpazamo zefrikhwensi ephantsi-phakathi ngaphandle kokufaka iimpazamo zefrikhwensi ephakathi/phezulu |
| Ukusebenza Okuqhubekayo | Iiveki ezi-3–5 ngaphandle kokugcinwa kwe-vacuum |
| Iindleko Zokulungisa | Iphantsi |
Ubuchule bokucubungula boMshini wokuPolisha we-Ion Beam
Iintlobo zomphezulu ezixhaswayo
Elula: Ithe tyaba, ingqukuva, iprism
I-Complex: I-asphere elinganayo/engalinganiyo, i-asphere engaphandle kwe-axis, i-cylindrical
Ezikhethekileyo: Ii-optics ezibhityileyo kakhulu, ii-slat optics, ii-hemispherical optics, ii-conformal optics, ii-phase plates, iindawo ezizimeleyo
Izixhobo ezixhaswayo
Iglasi ebonakalayo: I-Quartz, i-microcrystalline, i-K9, njl.
Izinto ze-infrared: iSilicon, iGermanium, njl.
Iintsimbi: I-aluminium, intsimbi engatyiwayo, i-titanium alloy, njl.
Iikristale: YAG, i-single-crystal silicon carbide, njl.
Izinto eziqinileyo/ezibuthathaka: iSilicon carbide, njl.
Umgangatho womphezulu / ukuchaneka
I-PV < 10 nm
I-RMS ≤ 0.5 nm
Ukucubungula Izifundo zeTyala loMatshini wokuPolisha we-Ion Beam
Ityala 1 - Isipili Esithe tyaba Esiqhelekileyo
Umsebenzi: I-quartz flat D630 mm
Isiphumo: PV 46.4 nm; RMS 4.63 nm
Ityala lesi-2 - Isibuko esiKhangelayo se-X-ray
Umsebenzi: 150 × 30 mm i-silicon flat
Isiphumo: PV 8.3 nm; RMS 0.379 nm; Ithambeka 0.13 µrad
Ityala lesi-3 - Isibuko esingekho kwi-axis
Umsebenzi: Isibuko somhlaba esingekho axis D326 mm
Isiphumo: PV 35.9 nm; RMS 3.9 nm
Imibuzo ebuzwa rhoqo ngeeGlasi zeQuartz
Imibuzo Ebuzwa Rhoqo - Umatshini Wokupolisha we-Ion Beam
Q1: Yintoni ukupholisha imisebe ye-ion?
A1:Ukupolisha imisebe ye-ion yinkqubo engadibaniyo esebenzisa umqadi ogxile kwi-ion (ezifana ne-argon ions) ukususa izinto kumphezulu wezinto zokusebenza. Ii-ion ziyakhawuleziswa kwaye zijoliswe kumphezulu, nto leyo ebangela ukususwa kwezinto kwinqanaba le-athomu, nto leyo ebangela ukugqitywa okugudileyo kakhulu. Le nkqubo isusa uxinzelelo loomatshini kunye nomonakalo ongaphantsi komhlaba, nto leyo eyenza ukuba ilungele izinto ezibonakalayo ngokuchanekileyo.
Umbuzo 2: Zeziphi iintlobo zeendawo ezisetyenziswa yi-Ion Beam Polishing Machine?
A2:IUmatshini wokupolisha we-Ion Beaminokucubungula iindawo ezahlukeneyo, kuquka izinto ezilula ezibonakalayo ezifanaiiflethi, iisphere, kunye neeprismkunye nejometri ezintsonkothileyo ezifanaii-aspheres, ii-aspheres ezingaphandle kwe-axiskunyeimiphezulu ekhululekileyoIsebenza ngakumbi kwizinto ezifana neglasi ye-optical, i-infrared optics, iimetali, kunye nezinto eziqinileyo/ezibuthathaka.
Umbuzo 3: Zeziphi izinto ezingasetyenziswa ngumatshini wokupholisha we-Ion Beam?
A3:IUmatshini wokupolisha we-Ion Beamingapolisha uluhlu olubanzi lwezixhobo, kuquka:
-
Iglasi ebonakalayo: I-Quartz, i-microcrystalline, i-K9, njl.
-
Izinto ze-infrared: I-Silicon, i-germanium, njl.
-
Iintsimbi: I-aluminium, intsimbi engatyiwayo, i-titanium alloy, njl.
-
Izinto zekristale: YAG, i-single-crystal silicon carbide, njl.njl.
-
Ezinye izinto eziqinileyo/ezibuthathaka: I-silicon carbide, njl.njl.
Ngathi
I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.















