Isixhobo soKwemba iLaser yeNanosecond ye-Infrared yeGlasi yoKwemba ubukhulu≤20mm

Isixhobo soKwemba iLaser yeNanosecond yeInfrared yeGlass yoKwemba ubukhulu≤20mm Umfanekiso obonakalayo

Inkcazelo emfutshane:

IsiShwankathelo soBugcisa:
I-Infrared Nanosecond Laser Drilling System sisisombululo somgangatho woshishino esiphuhliswe ngokukodwa ukugrunjwa kwezinto zeglasi. Ukusebenzisa i-1064nm infrared nanosecond laser source (ububanzi bepulse: 10-300ns), le nkqubo ifezekisa ukuchaneka okuphezulu kwe-drilling kwii-substrates zeglasi ezahlukeneyo ezinobunzima ≤20mm ngokusebenzisa ulawulo oluchanekileyo lwamandla kunye nobuchwephesha bokubumba i-beam.
Kwizicelo ezisebenzayo zomgca wemveliso, i-Infrared Nanosecond Laser Drilling System ibonisa iinzuzo zenkqubo ekhethekileyo. Xa kuthelekiswa nokugrumba okuqhelekileyo koomatshini okanye ukusetyenzwa kwe-laser ye-CO₂, inkqubo yokulawula impembelelo yobushushu ephuculweyo yenza ukuba ukugrumba ngokuchanekileyo kunye nobubanzi bomngxuma ukusuka kwi-Φ0.1-5mm kwiglasi ye-soda-lime eqhelekileyo, ngelixa igcina i-taper yodonga ngaphakathi kwe-± 0.5 °. Ngokukodwa kwikhamera ye-smartphone yesapphire cover lens processing, inkqubo inokuvelisa ngokuqhubekayo i-Φ0.3mm micro-hole arrays ngokuchaneka kwendawo ye-±10μm, ukuhlangabezana neemfuno ezingqongqo ze-miniaturization kwi-elektroniki yabathengi. Inkqubo ifika ngokusemgangathweni kunye nokulayisha ngokuzenzekelayo / ukukhulula ujongano lokudibanisa ngokungenamthungo kunye nemigca ekhoyo yokuvelisa.

Thumela i-imeyile kuthi

Iimbonakalo

Eyona parameter

Uhlobo lweLaser	I-infrared nanosecond
Ubungakanani beqonga	*800600(mm)**
	*20001200(mm)**
Ubunzima bokomba	≤20(mm)
Isantya sokomba	0-5000(mm/s)
Drilling edge breakage	<0.5(mm)
Qaphela: Ubungakanani beqonga bungenziwa ngokwezifiso.

ILaser Drilling Principle

Umqa welaser ugxile kwindawo efanelekileyo xa uthelekiswa nobukhulu besixhobo sokusebenza, emva koko uskena ngeendlela ezichazwe kwangaphambili ngesantya esiphezulu. Ngokusebenzisana ne-laser ye-laser ye-eneji ephezulu, izinto ekujoliswe kuzo zisuswa umaleko-ngamaleko ukwenza iitshaneli zokusika, ukuphumeza ukutyhoboza okuchanekileyo (kwisetyhula, isikwere, okanye iijiyometri ezintsonkothileyo) kunye nokwahlulwa kwezinto ezilawulwayo.

I-Laser Drilling Advantages

· Udibaniso oluphezulu oluzenzekelayo kunye nokusetyenziswa kwamandla amancinci kunye nokusebenza lula;

· Ukusetyenzwa okungaqhagamshelwanga kwenza iijiyometri zepateni zingathintelwanga ngaphaya kweendlela eziqhelekileyo;

· Ukusebenza simahla kokusebenziseka kunciphisa iindleko zokusebenza kwaye kuphucule uzinzo lokusingqongileyo;

· Ukuchaneka okuphezulu kunye nokutshiphuzwa komphetho omncinci kunye nokupheliswa komonakalo wesibini wesixhobo;

Isixhobo sokomba i-infrared nanosecond yeglasi 2

Umboniso wesampuli

Inkqubo yezicelo

Inkqubo yenzelwe ukuchaneka kokulungiswa kwezinto ezinqabileyo / ezinzima ezibandakanya ukubhola, ukugoba, ukususwa kwefilimu, kunye nokuthungwa komhlaba. Usetyenziso oluqhelekileyo lubandakanya:

1. Ukwemba kunye nokuqatshelwa kwezixhobo zocango lweshawari

2. Ukugqobhoza ngokuchanekileyo kweepaneli zeglasi yesixhobo

3. Iphaneli yelanga ngokugrunjwa

4. Tshintsha/socket cover plate perforation

5. Ukususwa kwesibuko sokugquma nge-drilling

6. Isiko lokubhaliweyo komhlaba kunye ne-grooving kwiimveliso ezikhethekileyo

Ukulungiswa kwezinto eziluncedo

1. Iqonga elinefomathi enkulu lithatha imilinganiselo eyahlukeneyo yeemveliso kuwo wonke amashishini

2. Ukomba oluntsonkothileyo lwecontour oluphunyeziweyo ekusebenzeni kwepasi enye

3. Ubuncinci be-edge chipping kunye nokugqiba okuphezulu komphezulu (Ra <0.8μm)

4. Utshintsho olungenamthungo phakathi kwenkcazo yemveliso kunye nokusebenza okucacileyo

5. Ukusebenza ngendlela eyongayo equka:

· Izivuno eziphezulu (>99.2%)

· Consumable-free processing

· Azikho izinto ezikhutshwayo ezingcolisayo

I-6.Umsebenzi ongaqhagamshelwanga uqinisekisa ukugcinwa kwengqibelelo yomhlaba

Ezona mpawu

1. ITekhnoloji yoLawulo lweThermal echanekileyo:

· Isebenzisa inkqubo yokomba eqhutywayo ye-multi-pulse ne-adjustable single-pulse energy (0.1–50 mJ)

· Inkqubo yokhuselo yomoya esecaleni yomoya ivala indawo echatshazelwe bubushushu ukuya ngaphakathi kwe-10% yobubanzi bomngxuma.

· Imodyuli yexesha lokwenyani lobushushu be-infrared ibuyekeza ngokuzenzekelayo iiparamitha zamandla (± 2% uzinzo)

2. IQonga lokuLungiselela ngobukrelekrele:

· Ixhotyiswe ngeqonga lemoto elichanekileyo elichanekileyo (phinda ukuchaneka kokumisa: ±2 μm)

· Inkqubo yokulungelelaniswa kombono edibeneyo (iCCD ye-5-megapixel, ukuchaneka kokuqaphela: ±5 μm)

· I-database yenkqubo elayishwe kwangaphambili eneparamitha ezilungiselelwe malunga ne-50+ yeentlobo zemathiriyeli yeglasi

3. Uyilo lweMveliso eFanelekileyo:

· Imowudi yokusebenza enezitishi ezimbini ezitshintshanayo kunye nexesha lokutshintsha kwezinto ≤3 imizuzwana

· Umjikelo wokusetyenzwa osemgangathweni womngxuma om-1/0.5 imizuzwana (Φ0.5 mm ngomngxuma)

· Uyilo lwemodyuli luvumela utshintshiselwano olukhawulezayo lokugxila kwiindibano zelensi (uluhlu lokucubungula: Φ0.1–10 mm)

Ii-Brittle Hard Material Processing Applications

Uhlobo lwezinto eziphathekayo	Imeko yesicelo	Ukuqhubela phambili umxholo
Iglasi yeSoda-yekalika	Iingcango zeshawari	Ukunyuka kwemingxuma kunye nemijelo yokuhambisa amanzi
Iglasi yeSoda-yekalika	Iiphaneli zokulawula izixhobo	Uluhlu lwemingxuma yokuhambisa amanzi
Iglasi epholileyo	Iifestile zokujonga i-oveni	Uluhlu lwemingxuma yokungenisa umoya
Iglasi epholileyo	Ii-cooktops ze-induction	Iitshaneli zokupholisa ezineengile
Iglasi yeBorosilicate	Iiphaneli zelanga	Ukunyuka kwemingxuma
Iglasi yeBorosilicate	Izinto zeglasi zeLabhoratri	Imijelo yokuhambisa amanzi emiselweyo
Iglasi-i-ceramic	Imiphezulu yokupheka	Imingxunya yokubeka isitshisi
Iglasi-i-ceramic	Abapheki bokwazisa	Isivamvo sokunyuswa kwemingxunya uluhlu
Isafire	Iikhava zesixhobo esihlakaniphile	Imingxuma yokungena umoya
Isafire	Iindawo zokujonga kwimizi-mveliso	Imingxuma eyomeleziweyo
Iglasi eqatywe	Izibuko zokuhlambela	Ukunyuka kwemingxuma (ukususwa kokugquma + ukugrumba)
Iglasi eqatywe	Iindonga zamakhethini	Iglasi ye-E ephantsi efihle imingxunya yokuhambisa amanzi
Iglasi yeCeramicized	Tshintsha/izigqubuthelo zesokethi	Iindawo zokubeka ukhuseleko + imingxuma yocingo
Iglasi yeCeramicized	Imiqobo yomlilo	Imingxunya yokunceda uxinzelelo olungxamisekileyo

I-XKH ibonelela ngenkxaso yobugcisa ebanzi kunye neenkonzo ezongeziweyo zexabiso le-infrared nanosecond laser drilling izixhobo zokuqinisekisa ukusebenza ngokupheleleyo kumjikelo wobomi besixhobo. Sinikezela ngeenkonzo zophuhliso lwenkqubo elungiselelweyo apho iqela lethu lobunjineli lisebenzisana ngokusondeleyo nabathengi ukuseka amathala eencwadi epharamitha ethile, kubandakanya neenkqubo ezizodwa zokomba izinto ezicela umngeni njengesafire kunye neglasi epholileyo enoguquko olusuka ku-0.1mm ukuya kwi-20mm. Ukulungelelaniswa kwemveliso, siqhuba ukulungelelaniswa kwezixhobo ze-site kunye neemvavanyo zokuqinisekisa ukusebenza, siqinisekisa iimetriki ezibalulekileyo ezifana nokunyamezela kwedayamitha yomngxuma (± 5μm) kunye nomgangatho we-edge (Ra <0.5μm) ihlangabezana nemigangatho yoshishino.

Ngaphambili: Isixhobo se-laser ye-Microjet se-wafer yokusika ukusetyenzwa kwezinto ze-SiC

Okulandelayo: I-6 ye-intshi e-Conductive ye-SiC eDityanisiweyo yeSulana ye-4H Ububanzi 150mm Ra≤0.2nm Warp≤35μm