Izixhobo zokubhola zeLaser ze-Infrared Nanosecond zeGlasi yokubhola ubukhulu≤20mm

Izixhobo zokubhola zeLaser ze-Infrared Nanosecond zokubhola iGlasi ubukhulu≤20mm Umfanekiso obonisiweyo

Inkcazo emfutshane:

Isishwankathelo soBugcisa:
Inkqubo yokubhola iglasi ye-Infrared Nanosecond Laser sisisombululo sokucubungula esikumgangatho wezoshishino esenzelwe ngokukodwa ukubhola ngokuchanekileyo kwezinto zeglasi. Isebenzisa umthombo we-laser ye-infrared nanosecond ye-1064nm (ububanzi be-pulse: 10-300ns), le nkqubo ifezekisa ukubhola ngokuchanekileyo okuphezulu kwiindawo ezahlukeneyo zeglasi ezinobukhulu obuyi-≤20mm ngokusebenzisa ubuchwepheshe bokulawula amandla obuchanekileyo kunye nobuchwepheshe bokubumba imiqadi.
Kwizicelo zemigca yemveliso esebenzayo, i-Infrared Nanosecond Laser Glass Drilling System ibonisa iingenelo zenkqubo ezizodwa. Xa kuthelekiswa nokubhola ngoomatshini okuqhelekileyo okanye ukucutshungulwa nge-laser ye-CO₂, indlela yokulawula isiphumo sobushushu ephuculiweyo yenkqubo ivumela ukubhola ngokuchanekileyo ngedayamitha zemingxuma ukusuka kwi-Φ0.1-5mm kwiglasi ye-soda-lime eqhelekileyo, ngelixa igcina udonga lwemingxuma luthambile ngaphakathi kwe-±0.5°. Ingakumbi kwi-smartphone camera cover lens processing, inkqubo inokuvelisa rhoqo ii-Φ0.3mm micro-hole arrays ezinokuchaneka kwendawo ye-±10μm, ukuhlangabezana neemfuno ezingqongqo ze-miniaturization kwi-electronics zabathengi. Inkqubo iza ne-standard kunye ne-automated loading/downloading interfaces zokudibanisa ngaphandle komthungo kunye nemigca yemveliso ekhoyo.

Thumela i-imeyile kuthi

Iimbonakalo

Ipharamitha ephambili

Uhlobo lwelaser	I-infrared nanosecond
Ubungakanani beplatifomu	*800600(mm)**
	*20001200(mm)**
Ubukhulu bokubhola	≤20(mm)
Isantya sokubhola	0-5000(mm/s)
Ukuqhekeka komphetho wokubhola	<0.5(mm)
Qaphela: Ubungakanani beplatifomu bungenziwa ngokwezifiso.

Umgaqo wokubhola ngeLaser

Umqadi welaser ugxile kwindawo efanelekileyo xa kuthelekiswa nobukhulu bezinto zokusebenza, uze uskene kwiindlela ezichazwe kwangaphambili ngesantya esiphezulu. Ngokusebenzisana nomqadi welaser onamandla aphezulu, izinto ezijoliswe kuzo ziyasuswa umaleko ngomaleko ukuze kwenziwe imijelo yokusika, kufezekisa ukugqobhoka okuchanekileyo (ijiyometri ejikelezayo, enesikwere, okanye eyinkimbinkimbi) ngokwahlukana kwezinto ezilawulwayo.

Iingenelo zokubhola ngeLaser

· Ukuhlanganiswa okuphezulu kokuzenzekelayo kunye nokusetyenziswa kwamandla okuncinci kunye nokusebenza okulula ；

· Ukucutshungulwa okungadibaniyo kwenza ukuba iijometri zepateni zingathintelwanga ngaphaya kweendlela eziqhelekileyo ；

· Ukusebenza ngaphandle kokusetyenziswa kunciphisa iindleko zokusebenza kwaye kuphucula uzinzo lokusingqongileyo;

· Ukuchaneka okuphezulu kunye nokuqhekeka okuncinci komphetho kunye nokususa umonakalo wesibini we-workpiece ；

Izixhobo zokubhola nge-laser zeglasi ye-infrared nanosecond 2

Umboniso wesampulu

Izicelo zeNkqubo

Le nkqubo yenzelwe ukucutshungulwa ngokuchanekileyo kwezinto ezibuthathaka/eziqinileyo kuquka ukubhola, ukugrumba, ukususa ifilimu, kunye nokuthungwa komphezulu. Iindlela eziqhelekileyo zokusetyenziswa ziquka:

1. Ukubhoboza kunye nokufaka izinto zomnyango weshawa

2. Ukugqobhoza ngokuchanekileyo iiphaneli zeglasi zezixhobo

3. Iphaneli yelanga ngokusebenzisa ukubhola

4. Ukugqobhoza kwepleyiti yokugquma iswitshi/isokhethi

5. Ukususa i-mirror coating ngokubhoboza

6. Ukulungisa umphezulu ngokwezifiso kunye nokugoba iimveliso ezikhethekileyo

Iingenelo zokucubungula

1. Iqonga elikhulu lilungelelanisa ubungakanani bemveliso obahlukeneyo kumashishini onke

2. Ukugrumba iikhonto ezintsonkothileyo okuphunyeziweyo ngokusebenza nge-single-pass

3. Ukucofa okuncinci komphetho kunye nokugqitywa okuphezulu komphezulu (Ra <0.8μm)

4. Utshintsho olungenamthungo phakathi kweenkcukacha zemveliso kunye nokusebenza okubonakalayo

5. Ukusebenza kakuhle kweendleko okubonisa:

· Amanani aphezulu esivuno (>99.2%)

· Ukucubungula okungenakusetyenziswa

· Akukho kukhutshwa komoya ongcolileyo

6. Ukulungiswa okungahambelaniyo kuqinisekisa ukugcinwa kobunyulu bomphezulu

Ezona mpawu

1. Iteknoloji yoLawulo loBushushu obuchanekileyo:

· Isebenzisa inkqubo yokubhola eqhubekekayo ye-multi-pulse ene-adjustable single-pulse energy (0.1–50 mJ)

· Inkqubo entsha yokukhusela umkhusane womoya osecaleni ithintela indawo echaphazelekileyo bubushushu ibe ngaphakathi kwe-10% yobubanzi bomngxuma

· Imodyuli yokujonga ubushushu be-infrared yexesha langempela ihlawula ngokuzenzekelayo iiparameter zamandla (± 2% uzinzo)

2. Iqonga Lokucubungula Elikrelekrele:

· Ixhotyiswe ngenqanaba lemoto elichanekileyo nelichanekileyo (ukuchaneka kokubeka kwakhona: ± 2 μm)

· Inkqubo yokulungelelanisa umbono edibeneyo (i-5-megapixel CCD, ukuchaneka kokuqondwa: ± 5 μm)

· Isiseko sedatha senkqubo esilayishwe kwangaphambili esineeparamitha ezilungiselelwe iintlobo ezingaphezu kwama-50 zezinto zeglasi

3. Uyilo lweMveliso oluSebenza kakuhle:

· Imo yokusebenza etshintshana ngezitishi ezimbini enexesha lokutshintsha kwezinto ≤ imizuzwana emi-3

· Umjikelo oqhelekileyo wokucubungula we-1 hole/0.5 sec (Φ0.5 mm through-hole)

· Uyilo lweModular lwenza ukuba kube lula ukutshintshana ngokukhawuleza kweendibano zelensi ezigxile (uluhlu lokucubungula: Φ0.1–10 mm)

Izicelo zokuCwangcisa izinto eziBanzi zeBrittle

Uhlobo lwezinto	Imeko yesicelo	Ukucubungula umxholo
Iglasi yeSoda-lika	Iingcango zeshawa	Imingxunya yokufakela kunye nemijelo yokukhupha amanzi
Iglasi yeSoda-lika	Iiphaneli zokulawula izixhobo	Uluhlu lwemingxunya yokukhupha amanzi
Iglasi enomsindo	Iifestile zokubukela i-oven	Ii-arrays zemingxunya yomoya
Iglasi enomsindo	Izipheko zokupheka ze-induction	Iitshaneli zokupholisa ezine-engile
Iglasi yeBorosilicate	Iiphaneli zelanga	Imingxunya yokufaka
Iglasi yeBorosilicate	Iiglasi zelebhu	Iitshaneli zokukhupha amanzi ezenziwe ngokwezifiso
Iglasi-ceramic	Iindawo zokupheka	Imingxunya yokubeka izitshisi
Iglasi-ceramic	Izipheki zokungenisa umoya	Ii-arrays zemingxunya yokufakelwa kwenzwa
I-Sapphire	Izigqubuthelo zezixhobo ezikrelekrele	Imingxunya yokungenisa umoya
I-Sapphire	Iindawo zokujonga izinto zoshishino	Imingxunya eqinisiweyo
Iglasi egqunyiweyo	Izipili zegumbi lokuhlambela	Imingxunya yokufaka (ukususwa kwengubo + ukubhoboza)
Iglasi egqunyiweyo	Iindonga zekhethini	Imingxunya yokukhupha amanzi efihliweyo ngeglasi esezantsi
Iglasi eCeramicized	Izigqubuthelo zeswitshi/zesokhethi	Iindawo zokhuseleko + imingxunya yentsimbi
Iglasi eCeramicized	Izithintelo zomlilo	Imingxunya yokunceda uxinzelelo olungxamisekileyo

I-XKH inika inkxaso yobugcisa ebanzi kunye neenkonzo ezongeziweyo zexabiso kwizixhobo zokubhola iglasi ye-infrared nanosecond laser ukuqinisekisa ukusebenza kakuhle kulo lonke ixesha lobomi bezixhobo. Sinikezela ngeenkonzo zophuhliso lwenkqubo ezenzelwe wena apho iqela lethu lobunjineli lisebenzisana ngokusondeleyo nabathengi ukuseka iilayibrari zeparameter ezithile zezinto, kubandakanya iinkqubo zokubhola ezikhethekileyo zezixhobo ezinzima ezifana ne-sapphire kunye neglasi eqinisiweyo enobukhulu obahlukeneyo ukusuka kwi-0.1mm ukuya kwi-20mm. Ukuze kuphuculwe imveliso, senza uvavanyo lokulinganisa izixhobo kwindawo kunye nokuqinisekiswa kokusebenza, siqinisekisa ukuba imilinganiselo ebalulekileyo efana nokunyamezelana kobubanzi bemingxuma (±5μm) kunye nomgangatho womphetho (Ra<0.5μm) iyahlangabezana nemigangatho yoshishino.

Ngaphambili: Izixhobo zobuchwepheshe be-laser zeMicrojet ezisikiweyo ukusika i-SiC ukucutshungulwa kwezinto

Okulandelayo: I-Substrate ye-SiC Composite eyi-6 intshi eqhubayo ene-4H ububanzi 150mm Ra≤0.2nm Warp≤35μm