I-Dia50.8mm yeSapphire Wafer Window yeSapphire High Optical Transmittance DSP/SSP
Kutheni iSapphire?
Iimpawu zesafire enye yekristale
1. I-Sapphire ine-optical transmittance ephezulu, ngoko isetyenziswa ngokubanzi njenge-microelectronic tube dielectric material, i-ultrasonic conduction element, i-waveguide laser cavity, kunye nezinye izinto ezibonakalayo, njengezinto zefestile zezixhobo zemikhosi ye-infrared, izithuthi zesithuba, i-laser ephezulu kunye nonxibelelwano lwe-optical.
2. Isafire inobungqongqo obuphezulu, amandla aphezulu, ubushushu obuphezulu bokusebenza, ukuxhathisa kwe-abrasion, ukuchasana nokugqwala, ngoko ke isafire substrate isoloko isetyenziswa kwiindawo ezirhabaxa, ezifana nebhoyila amanzi gauge (ubushushu obuphezulu ukumelana), ibar code scanner, ukuthwala, kunye nezinye izinto ngokuchanekileyo (ukunxiba ukumelana), amalahle, igesi, ukubona kakuhle iifestile zokubona i-corrosion sensors (i-anti-corrosion sensors).
3. I-Sapphire ineempawu ze-insulation zombane, ukukhanya, ukuhanjiswa kakuhle kwe-thermal, kunye nokuqina okuphezulu, ngoko ingasetyenziselwa njenge-substrate impahla yeesekethe ezidibeneyo, ezifana ne-LED kunye ne-microelectronic circuits, i-ultra-high-speed integrated circuit.
Inkcazo
| Ububanzi | 50.8mm +/-0.1mm okanye +/-0.02mm |
| Ukutyeba | 0.43mm± 0.1mm okanye +/-0.02mm |
| Ukuqhelaniswa | I-C-plane/A-Plane/M-Plane/R-Plane |
| Umgangatho womphezulu (ukukrwela & grumba) | 60/40, 40/20 okanye ngcono |
| Ukuchaneka komphezulu | λ/10, λ/2, λ |
| Umngxuma ocacileyo | >85%, >90% |
| Ukufana | +/-3', +/-30'' |
| Bevel | 0.1 ~ 0.3mm×45 isidanga |
| Ukwaleka | AR, BBAR okanye ngesicelo somthengi (UV, VIS, IR) |
| Hayi | Iipropati | Ekujoliswe kuko | Ukunyamezelana | Amagqabantshintshi | |
| 1 | Ububanzi | 50.8mm | ± 0.1mm | ||
| 2 | Ukutyeba | 430μm | ±15μm | ||
| 3 | Ukuqhelaniswa nomphezulu we-C-plane | ukusuka kwi-C-axis ukuya kwi-M0.2 ° | ± 0.1° | ||
| 4 | Ubude beflethi bokuqala | 16mm | ±11mm | ||
| 5 | Ukuqhelaniswa neflethi ephambili | Inqwelomoya (11-20) | ±0.1° | ||
| 6 | Ngasemva icala Uburhabaxa | 0.8~1.2um | |||
| 7 | Front icala Uburhabaxa | <0.3nm | |||
| 8 | Umphetho we-wafer | R-udidi | |||
| 9 | Ukwahluka koButyebe ngokupheleleyo, iTTV | ≤ 10μm(LTV≤5μm, 5*5) | |||
| 10 | I-SORI | ≤10μm | |||
| 11 | Ukuqubuda | -10 μm ≤ ISIQEPHU ≤ 0 | |||
| 12 | Laser uphawu | N / A | akanayo | ||
| Iphakheji | 25 izonka kwikhasethi enye | ||||
| Ukukwazi ukulandelela | Iiwafers ziyakulandeleka ngokubhekiselele kwinombolo yekhasethi | ||||
FAQ
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