I-Dia50.8mm yeSapphire Wafer yeSapphire Window ye-Optical Transmittance ephezulu DSP/SSP

I-Dia50.8mm yeSapphire Wafer yeSapphire Window ye-Optical Optical Transmittance ye-DSP/SSP eFakelweyo nguMfanekiso

Inkcazelo emfutshane:

Ngenxa yeleti engahambelaniyo engahambelaniyo kunye neekhemikhali ezizinzileyo kunye neempawu ezibonakalayo, isafire(Al2O3) iwafer yeyona ndawo idumileyo ye-III-V nitrides, superconductor kunye nemagnethi epi-film. Zisetyenziswa kakhulu kwi-GaN kunye nokukhula kwe-epitaxial yefilimu encinci, i-silicon kwisafire, imarike ye-LED kunye noshishino lwe-optics.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Kutheni iSapphire?

Iimpawu zesafire enye yekristale
1. I-Sapphire ine-optical transmittance ephezulu, ngoko isetyenziswa ngokubanzi njenge-microelectronic tube dielectric material, i-ultrasonic conduction element, i-waveguide laser cavity, kunye nezinye izinto ezibonakalayo, njengempahla yefestile yezixhobo zomkhosi ze-infrared, izithuthi zendawo, i-laser ephezulu kunye ne-optical. unxibelelwano.

2. I-Sapphire inobungqongqo obuphezulu, amandla aphezulu, ubushushu obuphezulu bokusebenza, ukuxhathisa kwe-abrasion, iimpawu zokuxhathisa i-corrosion, ngoko ke i-sapphire substrate isoloko isetyenziselwa kwiindawo ezinzima, ezifana ne-boiler gauge yamanzi (ukumelana nokushisa okuphezulu), i-barcode scanner yempahla, ukuthwala, kunye nokunye ukuveliswa ngokuchanekileyo (ukumelana nokunxiba), amalahle, igesi, izixhobo zokubona kakuhle kunye neefestile ze-detector (anti-corrosion).

3. I-Sapphire ineempawu ze-insulation zombane, ukukhanya, ukuhanjiswa kakuhle kwe-thermal, kunye nokuqina okuphezulu, ngoko ingasetyenziselwa njenge-substrate impahla yeesekethe ezidibeneyo, ezifana ne-LED kunye ne-microelectronic circuits, i-ultra-high-speed integrated circuit.

Inkcazo

Ububanzi	50.8mm +/-0.1mm okanye +/-0.02mm
Ukutyeba	0.43mm± 0.1mm okanye +/-0.02mm
Ukuqhelaniswa	I-C-plane/A-Plane/M-Plane/R-Plane
Umgangatho womphezulu (ukukrwela & grumba)	60/40, 40/20 okanye ngcono
Ukuchaneka komphezulu	λ/10, λ/2, λ
Umngxuma ocacileyo	>85%, >90%
Ukufana	+/-3', +/-30''
Bevel	0.1 ~ 0.3mm×45 isidanga
Ukwaleka	AR, BBAR okanye ngesicelo somthengi (UV, VIS, IR)

Hayi	Iipropati	Ekujoliswe kuko	Ukunyamezelana	Amagqabantshintshi
1	Ububanzi	50.8mm	± 0.1mm
2	Ukutyeba	430μm	±15μm
3	Ukuqhelaniswa nomphezulu we-C-plane	ukusuka kwi-C-axis ukuya kwi-M0.2 °	± 0.1°
4	Ubude beflethi bokuqala	16mm	±11mm
5	Ukuqhelaniswa neflethi ephambili	Inqwelomoya (11-20)	±0.1°
6	Ngasemva icala Uburhabaxa	0.8~1.2um
7	Front icala Uburhabaxa	<0.3nm
8	Umphetho we-wafer	R-udidi
9	Ukwahluka koButyebe ngokupheleleyo, iTTV	≤ 10μm(LTV≤5μm, 5*5)
10	I-SORI	≤10μm
11	Ukuqubuda	-10 μm ≤ ISIQEPHU ≤ 0
12	Laser uphawu	N / A		akanayo
	Iphakheji	25 izonka kwikhasethi enye
	Ukukwazi ukulandelela	Iiwafers ziyakulandeleka ngokubhekiselele kwinombolo yekhasethi

FAQ

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