Umatshini wokuRhomba we-CNC Ingot (weSapphire, iSiC, njl.njl.)

Inkcazo emfutshane:

Isishwankathelo:

Umatshini wokuRhomba we-CNC Ingot sisisombululo sokucubungula esichanekileyo nesikrelekrele esenzelwe ukuphinda sakhe izixhobo zekristale eqinileyo ezifana ne-sapphire (Al₂O₃), i-silicon carbide (SiC), i-YAG, nezinye. Esi sixhobo siphucukileyo senzelwe ukuguqula ii-ingots zekristale ezingaqhelekanga okanye ezikhuliswe njengeemilo ze-cylindrical eziqhelekileyo ezinobukhulu obuchanekileyo kunye nokugqitywa komphezulu. Sinenkqubo yokulawula eqhutywa yi-servo enobuchule kunye neeyunithi zokugaya ezenziwe ngokwezifiso, inika ukwenziwa okuzenzakalelayo okupheleleyo, kubandakanya ukugxila ngokuzenzekelayo, ukugaya, kunye nokulungiswa kobukhulu. Ifanelekile ukucubungula okuphezulu kwimizi-mveliso ye-LED, i-optics, kunye ne-semiconductor.

Thumela i-imeyile kuthi

Iimbonakalo

Ezona mpawu

Iyahambelana nezixhobo ezahlukeneyo zekristale

Iyakwazi ukucubungula i-sapphire, i-SiC, i-quartz, i-YAG, kunye nezinye izinto zekristale eziqinileyo kakhulu. Uyilo oluguquguqukayo ukuze kuhambelane nezinto ezininzi.

Ulawulo lwe-CNC oluchanekileyo kakhulu

Ixhotyiswe ngeqonga le-CNC eliphambili elivumela ukulandelelwa kwendawo ngexesha langempela kunye nokubuyiselwa ngokuzenzekelayo. Ukunyamezelana kobubanzi emva kokucubungula kunokugcinwa ngaphakathi kwe-±0.02 mm.

Ukubeka Emaphakathini Nokulinganisa Okuzenzakalelayo

Idityaniswe nenkqubo yombono ye-CCD okanye imodyuli yokulungelelanisa i-laser ukuze ifake i-ingot ngokuzenzekelayo ize ibone iimpazamo zokulungelelanisa i-radial. Yonyusa i-first-pass yield kwaye inciphise ukungenelela ngesandla.

Iindlela Zokugaya Ezinokucwangciswa

Ixhasa amaqhinga amaninzi okujikelezisa: ukubumba okuqhelekileyo kwesilinda, ukuthambisa iziphene zomphezulu, kunye nokulungiswa kwe-contour ngokwezifiso.

Uyilo lweModular Mechanical

Yakhiwe ngezinto ezisetyenziswa kwiimodyuli kunye nendawo encinci. Isakhiwo esilula siqinisekisa ukugcinwa okulula, ukutshintshwa kwezinto ngokukhawuleza, kunye nexesha elincinci lokungasebenzi.

Ukuqokelelwa kokupholisa kunye nothuli oludibeneyo

Inenkqubo enamandla yokupholisa amanzi edityaniswe neyunithi yokutsala uthuli oluxineneyo oluvalekileyo. Inciphisa ukugqwetheka kobushushu kunye neenxalenye eziphuma emoyeni ngexesha lokusila, iqinisekisa ukusebenza okukhuselekileyo nokuzinzileyo.

Iindawo zoSetyenziso

Ukulungiswa kwangaphambili kweSapphire Wafer ye-LEDs

Isetyenziselwa ukubumba ii-ingots ze-sapphire ngaphambi kokuba zinqunqwe zibe zii-wafers. Ukujikelezisa okufanayo kuphucula kakhulu isivuno kwaye kunciphisa umonakalo we-wafer edge ngexesha lokusika okulandelayo.

Ukusila iSiC Rod ukuze isetyenziswe kwiSemiconductor

Kubalulekile ekulungiseleleni ii-ingots ze-silicon carbide kwizicelo ze-elektroniki ezinamandla. Ivumela ububanzi obuhambelanayo kunye nomgangatho womphezulu, kubalulekile kwimveliso ye-wafer ye-SiC evelisa kakhulu.

Ukubumba iCrystal ye-Optical kunye ne-Laser

Ukujikeleziswa ngokuchanekileyo kwe-YAG, Nd:YVO₄, kunye nezinye izixhobo ze-laser kuphucula ulungelelwaniso lwe-optical kunye nokufana, okuqinisekisa ukuphuma kwemitha efanayo.

Uphando kunye noLungiselelo lwezinto zovavanyo

Ithenjwa ziiyunivesithi kunye neelabhoratri zophando ekubumbeni iikristale ezintsha ngokoqobo ukuze kuhlalutywe ukuqhelaniswa kunye novavanyo lwesayensi yezinto eziphathekayo.

Inkcazo ye

Inkcazo	Ixabiso
Uhlobo lweLaser	I-DPSS Nd:YAG
Ubude bamaza buxhasiwe	532nm / 1064nm
Iinketho zamandla	50W / 100W / 200W
Ukuchaneka kokubeka indawo	±5μm
Ububanzi boMgca obuphantsi	≤20μm
Indawo Echaphazeleka Bubushushu	≤5μm
Inkqubo yokuHamba	Imoto eqhutywa ngokuthe ngqo/ngomgca
Ubuninzi bamandla	Ukuya kuthi ga kwi-10⁷ W/cm²

Isiphelo

Le nkqubo yelaser ye-microjet ichaza ngokutsha imida yomatshini welaser kwizixhobo eziqinileyo, ezibuthathaka, nezinobushushu. Ngokudityaniswa kwayo okwahlukileyo kwelaser namanzi, ukuhambelana kwamaza amabini, kunye nenkqubo yokuhamba eguquguqukayo, inika isisombululo esilungiselelwe abaphandi, abavelisi, kunye nabahlanganisi beenkqubo abasebenza ngezinto ezisemgangathweni. Nokuba isetyenziswa kwi-semiconductor fabs, kwiilebhu zeenqwelo moya, okanye kwimveliso yeephaneli zelanga, le platform inika ukuthembeka, ukuphindaphindwa, kunye nokuchaneka okunika amandla ukucutshungulwa kwezinto zesizukulwana esilandelayo.