I-CNC Ingot Yokujikeleza Umatshini (yeSapphire, iSiC, njl.)
Ezona mpawu
Iyahambelana nezinto ezahlukeneyo zeCrystal
Iyakwazi ukucubungula isafire, iSiC, iquartz, YAG, kunye nezinye iintonga zekristale ezilukhuni. Uyilo oluguquguqukayo lokuhambelana kwezinto ezibanzi.
Ulawulo oluchanekileyo lweCNC
Ixhotyiswe ngeqonga eliphezulu le-CNC elenza ukulandelwa kwexesha lokwenyani kunye nembuyekezo ezenzekelayo. Ukunyamezelwa kwedayamitha emva kokucubungula kunokugcinwa ngaphakathi kwe-± 0.02 mm.
Uzinziso oluSebenzayo kunye neMilinganiselo
Idityaniswe nenkqubo yombono weCCD okanye imodyuli yolungelelwaniso lwelaser ukumisa ngokuzenzekelayo ingot kwaye ibone iimpazamo zolungelelwaniso lweradial. Yandisa isivuno sempumelelo yokuqala kwaye inciphisa ungenelelo lwezandla.
Iindlela zokuSila eziCwangcisiweyo
Ixhasa izicwangciso ezininzi zokujikeleza: ukubunjwa kwe-cylindrical okusemgangathweni, ukugudiswa kwesiphene somgangatho, kunye nezilungiso ezenziwe ngokwezifiso.
Uyilo lweModyuli yoomatshini
Yakhiwe ngamacandelo emodyuli kunye neenyawo ezihlangeneyo. Ulwakhiwo olulula luqinisekisa ukugcinwa lula, ukutshintshwa kwecandelo ngokukhawuleza, kunye nexesha elincinci lokuphumla.
Ukupholisa okuDityanisiweyo kunye nokuqokelelwa kothuli
Ifaka inkqubo enamandla yokupholisa amanzi edityaniswe neyunithi etywiniweyo yokukhupha uthuli olubi. Ukunciphisa ukuphazamiseka kwe-thermal kunye ne-airborne particulates ngexesha lokugaya, ukuqinisekisa ukusebenza okukhuselekileyo kunye nokuzinza.
IiNdawo zokuSebenza
ISapphire Wafer Pre-processing yee-LEDs
Isetyenziselwa ukwenza ii-ingots zesafire ngaphambi kokusikwa kwii-wafers. Ukujikeleza okulinganayo kwandisa kakhulu isivuno kwaye kunciphisa umonakalo we-wafer edge ngexesha lokusika okulandelayo.
I-SiC Rod yokuSila ukwenzela ukusetyenziswa kweSemiconductor
Ibalulekile ekulungiseleleni i-silicon carbide ingots kwizicelo zombane wombane. Yenza i-diameter engaguqukiyo kunye nomgangatho womphezulu, ibaluleke kakhulu kwimveliso ye-SiC ye-wafer ephezulu.
I-Optical kunye neLaser Crystal Shaping
Ukujikeleza okuchanekileyo kwe-YAG, i-Nd: i-YVO₄, kunye nezinye izinto ze-laser ziphucula i-symmetry ye-optical kunye nokufana, ukuqinisekisa ukukhutshwa kwe-beam okungaguqukiyo.
UPhando noLungiselelo lweMathiriyeli
Ithenjwe ziiyunivesithi kunye neelebhu zophando zokumila ngokwasemzimbeni iikristale zenoveli kuhlalutyo lokuqhelaniswa kunye novavanyo lwesayensi yezinto.
Inkcazo ye
Inkcazo | Ixabiso |
Uhlobo lweLaser | DPSS Nd:YAG |
I-Wavelengths exhaswayo | 532nm / 1064nm |
Iinketho zamandla | 50W / 100W / 200W |
Ukubeka Ukuchaneka | ±5μm |
Ubuncinci bobubanzi bomgca | ≤20μm |
Indawo echatshazelwe bubushushu | ≤5μm |
Inkqubo eshukumayo | I-Linear / i-Direct-drive motor |
Ukuxinana kwamandla aphezulu | Ukuya kuthi ga kwi-10⁷ W/cm² |
Ukuqukumbela
Le nkqubo ye-laser ye-microjet ichaza kwakhona imida ye-laser machining kwizinto ezinzima, ezinqabileyo, kunye nezixhobo ezibuthathaka. Ngokudityaniswa kwayo okukhethekileyo kwe-laser-amanzi, ukuhambelana kwe-wavelength kabini, kunye nenkqubo yentshukumo eguquguqukayo, ibonelela ngesisombululo esilungiselelwe abaphandi, abavelisi, kunye nabahlanganisi benkqubo abasebenza ngezinto zokusika. Nokuba isetyenziswa kwiilaphu ze-semiconductor, iilebhu ze-aerospace, okanye imveliso yephaneli yelanga, eli qonga lizisa ukuthembeka, ukuphindaphinda, kunye nokuchaneka okuxhobisa ukusetyenzwa kwezinto kwisizukulwana esilandelayo.
Idayagram eneenkcukacha


