6inch GaN-On-Sapphire
150mm 6inch GaN kwiSilicon/Sapphire/SiC Epi-layer wafer Gallium nitride epitaxial wafer
I-6-intshi ye-sapphire substrate wafer yimathiriyeli ye-semiconductor ekumgangatho ophezulu equka umaleko we-gallium nitride (GaN) ekhuliswe kwisapphire substrate. Izinto eziphathekayo zineempawu ezibalaseleyo zothutho lwe-elektroniki kwaye zilungele ukwenza izixhobo zombane eziphezulu kunye ne-high-frequency semiconductor.
Indlela yokuvelisa: Inkqubo yokwenziwa kwemveliso ibandakanya ukukhulisa iileya ze-GaN kwi-substrate yesafire kusetyenziswa ubuchule obuphambili obufana nesinyithi-organic chemical vapor deposition (MOCVD) okanye molecular beam epitaxy (MBE). Inkqubo yokubeka iqhutyelwa phantsi kweemeko ezilawulwayo ukuze kuqinisekiswe umgangatho ophezulu we-crystal kunye nefilimu efanayo.
Izicelo ze-6inch ze-GaN-On-Sapphire: Ii-chips ze-sapphire substrate ze-6 intshi zisetyenziswa ngokubanzi kwii-microwave zonxibelelwano, iinkqubo ze-radar, iteknoloji engenazintambo kunye ne-optoelectronics.
Ezinye izicelo eziqhelekileyo ziquka
1. I-amplifier yamandla e-Rf
2. Ishishini lokukhanyisa i-LED
3. Izixhobo zonxibelelwano zenethiwekhi ezingenazingcingo
4. Izixhobo zombane kwindawo yobushushu obuphezulu
5. Izixhobo ze-Optoelectronic
Iimpawu zemveliso
- Ubungakanani: I-substrate diameter yi-6 intshi (malunga ne-150 mm).
- Umgangatho womphezulu: Umphezulu ugudiswe kakuhle ukunika umgangatho obalaseleyo wesipili.
- Ukutyeba: Ubukhulu bomaleko we-GaN bunokwenziwa ngokweemfuno ezithile.
- Ukupakishwa: I-substrate ihlanganiswe ngokucophelela kunye nezinto ezichasene ne-static ukukhusela umonakalo ngexesha lokuthutha.
- Imiphetho yokuma: I-substrate inemida ethile yokumisa eququzelela ulungelelwaniso kunye nokusebenza ngexesha lokulungiswa kwesixhobo.
-Ezinye iiparamitha: Iiparamitha ezithile ezinjengokubhitya, ukumelana noxinzelelo kunye noxinzelelo lwe-doping zinokuhlengahlengiswa ngokweemfuno zabathengi.
Ngeempawu zabo eziphathekayo eziphezulu kunye nezicelo ezahlukeneyo, i-6-intshi ye-sapphire substrate wafers yinto ethembekileyo yokuphuhliswa kwezixhobo eziphezulu ze-semiconductor kumashishini ahlukeneyo.
ISubstrate | 6” 1mm <111> p-uhlobo Si | 6” 1mm <111> p-uhlobo Si |
Epi ThickAvg | ~5um | ~7um |
Epi ThickUnif | <2% | <2% |
Ukuqubuda | +/-45um | +/-45um |
Ukuqhekeka | <5mm | <5mm |
I-BV ethe nkqo | >1000V | >1400V |
HEMT Al% | 25-35% | 25-35% |
HEMT ThickAvg | 20-30nm | 20-30nm |
I-SiN Cap | 5-60nm | 5-60nm |
2DEG ikhonkotha. | ~1013cm-2 | ~1013cm-2 |
Ukushukuma | ~ 2000cm2/Vs (<2%) | ~ 2000cm2/Vs (<2%) |
Rsh | <330ohm/sq (<2%) | <330ohm/sq (<2%) |