I-4inch Silicon wafer FZ CZ N-Type DSP okanye ibakala lovavanyo lwe-SSP

I-4inch Silicon wafer FZ CZ N-Type DSP okanye iSSP ibakala loVavanyo loMfanekiso obonakalayo

Inkcazelo emfutshane:

I-silicon wafer lishiti elicekethekileyo elisikwe kwisilicon enye yekristale.Ii-Silicon wafers zifumaneka kwii-intshi ezi-2, i-3-intshi, i-4-intshi, i-6-intshi, kunye ne-8-intshi ye-diameter, kwaye zisetyenziselwa ukuvelisa iisekethe ezidibeneyo.Ii-Silicon wafers zizinto nje eziluhlaza kwaye iitshiphusi ziyimveliso egqityiweyo.Ii-Silicon wafers zizinto ezibalulekileyo zokwenza iisekethe ezidibeneyo, kwaye izixhobo ezahlukeneyo ze-semiconductor zingenziwa ngokusebenzisa i-photolithography kunye nokufakelwa kwe-ion kwi-silicon wafers.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Ukwazisa ngebhokisi ye-wafer

Ii-silicon wafers ziyinxalenye yecandelo letekhnoloji ekhulayo yanamhlanje.Imakethi yezixhobo ze-semiconductor ifuna iiwafers zesilicon ezineenkcukacha ezichanekileyo ukuvelisa inani elikhulu lezixhobo ezitsha ezidibeneyo zesekethe.Siyaqonda ukuba njengoko iindleko zokwenziwa kwe-semiconductor zinyuka, ngokunjalo neendleko zezo zixhobo zokuvelisa, ezifana ne-silicon wafers.Siyakuqonda ukubaluleka komgangatho kunye nokusebenza kweendleko kwiimveliso esizinikezela kubathengi bethu.Sinikezela ngee-wafers ezinexabiso elisebenzayo kunye nomgangatho ongaguqukiyo.Sivelisa kakhulu ii-silicon wafers kunye ne-ingots (CZ), ii-epitaxial wafers, kunye ne-SOI wafers.

Ububanzi	Ububanzi	Ilungisiwe	Doped	Ukuqhelaniswa	Ukuxhathisa/Ω.cm	Ukutyeba/um
2 intshi	50.8±0.5mm	SSP I-DSP	P/N	100	1-20	200-500
3intshi	76.2±0.5mm	SSP I-DSP	P/B	100	NA	525±20
4	101.6±0.2 101.6±0.3 101.6±0.4	SSP I-DSP	P/N	100	0.001-10	200-2000
6	152.5±0.3	SSP I-DSP	P/N	100	1-10	500-650
8	200±0.3	I-DSP SSP	P/N	100	0.1-20	625

Ukusetyenziswa kwamaqhekeza e-silicon

I-Substrate: I-PECVD / i-LPCVD yokugqoka, i-magnetron sputtering

I-Substrate: i-XRD, i-SEM, i-atomic force infrared spectroscopy, i-electron microscopy yokudluliselwa, i-fluorescence spectroscopy kunye nezinye iimvavanyo zohlalutyo, ukukhula kwe-molecular beam epitaxial, uhlalutyo lwe-X-ray ye-crystal microstructure processing: ukuthunga, ukubopha, izixhobo ze-MEMS, izixhobo zamandla, izixhobo ze-MOS kunye nezinye. ukuqhubekeka

Ukususela ngo-2010, Shanghai XKH Material Tech.I-Co., Ltd izibophelele ekuboneleleni abathengi ngezisombululo ezibanzi ze-4-intshi ye-Silicon Wafer, ukusuka kwi-debugging level wafers i-Dummy Wafer, i-wafers yenqanaba lokuvavanya i-Wafers Test Wafers, ukuya kwii-wafers zenqanaba lemveliso i-Prime Wafer, kunye nee-wafers ezikhethekileyo, i-Oxide wafers Oxide, I-Nitride wafers i-Si3N4, ii-wafers ze-Aluminiyam ezicwecwe, ii-wafers ze-silicon ezityalwe nge-Copper, i-SOI Wafer, i-MEMS Glass, ii-wafers ezicwangcisiweyo eziphezulu kunye ne-ultra-flat, njl. /ukupholishwa kwamacala amabini, ukubhitya, ukudayela, i-MEMS kunye nezinye iinkonzo zokusetyenzwa kunye nokwenza ngokwezifiso.