I-4intshi ye-Silicon wafer FZ CZ N-Type DSP okanye i-SSP Test grade

I-wafer ye-silicon ye-intshi ezi-4 FZ CZ N-Type DSP okanye i-SSP yovavanyo oluphezulu Umfanekiso obonisiweyo

Inkcazo emfutshane:

I-silicon wafer yilaphu elincinci elisikwe kwi-silicon enye yekristale. Ii-silicon wafers zifumaneka ngobubanzi obuyi-2 intshi, 3 intshi, 4 intshi, 6 intshi, kunye ne-8 intshi, kwaye zisetyenziselwa kakhulu ukuvelisa iisekethe ezidibeneyo. Ii-silicon wafers zizinto eziluhlaza kuphela kwaye iitships ziyimveliso egqityiweyo. Ii-silicon wafers zizinto ezibalulekileyo zokwenza iisekethe ezidibeneyo, kwaye izixhobo ezahlukeneyo ze-semiconductor zinokwenziwa nge-photolithography kunye ne-ion implantation kwii-silicon wafers.

Thumela i-imeyile kuthi

Iimbonakalo

Yazisa ngebhokisi ye-wafer

Ii-wafer ze-silicon ziyinxalenye ebalulekileyo yecandelo lobuchwepheshe elikhulayo namhlanje. Imarike yezinto ze-semiconductor ifuna ii-wafer ze-silicon ezineenkcazo ezichanekileyo ukuvelisa inani elikhulu lezixhobo ezintsha zesekethe ezidibeneyo. Siyaqonda ukuba njengoko iindleko zokwenziwa kwee-semiconductor zisanda, neendleko zezo zinto zokwenza, ezifana nee-wafer ze-silicon ziyanda. Siyaqonda ukubaluleka komgangatho kunye nokusebenza kakuhle kweendleko kwiimveliso esizibonelela abathengi bethu. Sinikezela ngee-wafers ezingabizi kakhulu kwaye zisemgangathweni ofanayo. Ngokuyintloko sivelisa ii-wafer ze-silicon kunye nee-ingots (CZ), ii-wafers ze-epitaxial, kunye nee-wafers ze-SOI.

Ububanzi	Ububanzi	Ipolished	I-Doped	Ukuqhelaniswa	Ukumelana/Ω.cm	Ubukhulu/um
2intshi	50.8±0.5mm	I-SSP I-DSP	I-P/N	100	1-20	200-500
3intshi	76.2±0.5mm	I-SSP I-DSP	I-P/B	100	NA	525±20
4intshi	101.6±0.2 101.6±0.3 101.6±0.4	I-SSP I-DSP	I-P/N	100	0.001-10	200-2000
6intshi	152.5±0.3	I-SSPI-DSP	I-P/N	100	1-10	500-650
8intshi	200±0.3	I-DSPI-SSP	I-P/N	100	0.1-20	625

Ukusetyenziswa kwee-wafers ze-silicon

I-substrate: I-PECVD/LPCVD coating, i-magnetron sputtering

I-Substrate: XRD, SEM, i-atomic force infrared spectroscopy, i-transmission electron microscopy, i-fluorescence spectroscopy kunye nezinye iimvavanyo zohlalutyo, ukukhula kwe-molecular beam epitaxial, uhlalutyo lwe-X-ray lwe-crystal microstructure processing: etching, bonding, izixhobo ze-MEMS, izixhobo zamandla, izixhobo ze-MOS kunye nezinye iinkqubo

Ukususela ngo-2010, iShanghai XKH Material Tech. Co.,Ltd izibophelele ekuboneleleni abathengi ngezisombululo zeSilicon Wafer ezipheleleyo ze-4-intshi, ukusuka kwi-debugging level wafers Dummy Wafer, i-test level wafers Test Wafer, ukuya kwi-product level wafers Prime Wafer, kunye ne-special wafers, i-Oxide wafers Oxide, i-Nitride wafers Si3N4, i-aluminium plated wafers, i-Copper plated silicon wafers, i-SOI Wafer, i-MEMS Glass, i-customized ultra-thick and ultra-flat wafers, njl.njl., ezinobukhulu obuqala kwi-50mm-300mm, kwaye singabonelela nge-semiconductor wafers nge-single-side/double-side polishing, thinning, dicing, MEMS kunye nezinye iinkonzo zokucubungula kunye nokwenza ngokwezifiso.