I-12inch 300mm enye ibhokisi ye-wafer substrate ye-PC kunye ne-PP
Ukwazisa ngebhokisi ye-wafer
Ibhokisi ye-wafer ye-intshi eyi-12 yenziwe nge-PC (polycarbonate) imathiriyeli. Inamandla amakhulu, ubushushu obuphezulu kunye nezinto ezixhathisa iikhemikhali ezinokungafihli kakuhle kunye neempawu zokugquma umbane.
Imveliso isetyenziswa ngokuyintloko kwimveliso ye-semiconductor kunye namashishini esekethe adibeneyo njengesitya sokugquma i-wafer encapsulation kunye nokhuseleko. Iyakwazi ukwahlula ngokufanelekileyo ukhukuliseko kunye nokungcoliswa kwendalo yangaphandle kwi-wafer, kwaye iqinisekise umgangatho kunye nokuzinza kwe-wafer.
Izinto eziluncedo ziquka
Amandla aphezulu: Izixhobo zePC zinamandla aphezulu kunye nokuqina, ezinokukhusela ama-wafers kwizothuso zangaphandle kunye nokuguqulwa.
Ukumelana nobushushu obuphezulu: Izinto zePC zinokumelana nobushushu obuphezulu kwaye zinokusetyenziswa phantsi kweemeko ezahlukeneyo zobushushu ukulungelelanisa iimfuno zenkqubo yokwenziwa kwe-semiconductor.
Ukungafihli: Izinto zePC zinokucaca kakuhle, ezinokujonga ngokucacileyo imeko ye-wafer kwaye zibone ukusebenza.
Ukumelana neekhemikhali: Izixhobo zePC zinokuxhathisa okugqwesileyo kweekhemikhali kwaye zinokukhusela ii-wafers kwi-corrosion kunye nokungcoliseka.
Iibhokisi ze-12-intshi ze-monolithic ngokubanzi zineenkcukacha ezilandelayo:
Imilinganiselo yangaphandle: Ngokwesiqhelo malunga ne-300mm x 300mm (12 "x 12"), kodwa ingalungiswa ngokweemfuno.
Izinto eziphathekayo: Izinto ezisetyenziswa ngokuqhelekileyo ziyi-PC (i-polycarbonate), i-PP (i-polypropylene), njl. Ukukhethwa kwezinto ngokubanzi kuxhomekeke kwimeko ethile yesicelo kunye neemfuno.
Ubunzima bodonga: Ubukhulu bodonga lwebhokisi ye-monolithic ngokuqhelekileyo yi-2-3mm, inamandla okwaneleyo kunye nokuqina ukukhusela i-wafer yangaphakathi.
Ifom yokupakisha: Iibhokisi ze-Monolithic zihlala zine-design evaliweyo ukukhusela uthuli, umswakama, kunye nezinye izinto ezingcolileyo ekungeneni kwibhokisi kunye nokuchaphazela umgangatho we-wafer.