I-12inch 300mm enye ibhokisi ye-wafer substrate ye-PC kunye ne-PP

Inkcazelo emfutshane:

Inkampani yethu ibonelela nge-intshi e-1, i-intshi ezi-2, i-intshi ezi-3, i-intshi ezi-4, i-intshi ezi-6, i-intshi ezi-8, i-intshi ezili-10, i-intshi ye-12 yebhokisi ye-wafer enye, ibhokisi ye-wafer enye, ibhokisi ye-wafer enye, i-chip yokupakisha itreyi ye-IC, iye yasebenzisana neeyunivesithi ezininzi zamazwe ngamazwe. kunye namaziko ophando lwenzululwazi, umgangatho ophezulu, ixabiso eliphantsi yinjongo yethu yoshishino, wamkelekile abathengi ukuthenga!


Iinkcukacha zeMveliso

Iithegi zeMveliso

Ukwazisa ngebhokisi ye-wafer

Ibhokisi ye-wafer ye-intshi eyi-12 yenziwe nge-PC (polycarbonate) imathiriyeli. Inamandla amakhulu, ubushushu obuphezulu kunye nezinto ezixhathisa iikhemikhali ezinokungafihli kakuhle kunye neempawu zokugquma umbane.

Imveliso isetyenziswa ngokuyintloko kwimveliso ye-semiconductor kunye namashishini esekethe adibeneyo njengesitya sokugquma i-wafer encapsulation kunye nokhuseleko. Iyakwazi ukwahlula ngokufanelekileyo ukhukuliseko kunye nokungcoliswa kwendalo yangaphandle kwi-wafer, kwaye iqinisekise umgangatho kunye nokuzinza kwe-wafer.

Izinto eziluncedo ziquka

Amandla aphezulu: Izixhobo zePC zinamandla aphezulu kunye nokuqina, ezinokukhusela ama-wafers kwizothuso zangaphandle kunye nokuguqulwa.

Ukumelana nobushushu obuphezulu: Izinto zePC zinokumelana nobushushu obuphezulu kwaye zinokusetyenziswa phantsi kweemeko ezahlukeneyo zobushushu ukulungelelanisa iimfuno zenkqubo yokwenziwa kwe-semiconductor.

Ukungafihli: Izinto zePC zinokucaca kakuhle, ezinokujonga ngokucacileyo imeko ye-wafer kwaye zibone ukusebenza.

Ukumelana neekhemikhali: Izixhobo zePC zinokuxhathisa okugqwesileyo kweekhemikhali kwaye zinokukhusela ii-wafers kwi-corrosion kunye nokungcoliseka.

Iibhokisi ze-12-intshi ze-monolithic ngokubanzi zineenkcukacha ezilandelayo:

Imilinganiselo yangaphandle: Ngokwesiqhelo malunga ne-300mm x 300mm (12 "x 12"), kodwa ingalungiswa ngokweemfuno.

Izinto eziphathekayo: Izinto ezisetyenziswa ngokuqhelekileyo ziyi-PC (i-polycarbonate), i-PP (i-polypropylene), njl. Ukukhethwa kwezinto ngokubanzi kuxhomekeke kwimeko ethile yesicelo kunye neemfuno.

Ubunzima bodonga: Ubukhulu bodonga lwebhokisi ye-monolithic ngokuqhelekileyo yi-2-3mm, inamandla okwaneleyo kunye nokuqina ukukhusela i-wafer yangaphakathi.

Ifom yokupakisha: Iibhokisi ze-Monolithic zihlala zine-design evaliweyo ukukhusela uthuli, umswakama, kunye nezinye izinto ezingcolileyo ekungeneni kwibhokisi kunye nokuchaphazela umgangatho we-wafer.

Idayagram eneenkcukacha

I-12inch 300mm enye ibhokisi ye-wafer substrate ye-PC kunye ne-PP (1)
I-12inch 300mm enye ibhokisi ye-wafer substrate ye-PC kunye ne-PP (2)
I-12inch 300mm enye ibhokisi ye-wafer substrate ye-PC kunye ne-PP (3)
I-12inch 300mm enye ibhokisi ye-wafer substrate ye-PC kunye ne-PP (4)

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