Isigaba Sokuthwala Umoya se-SiC Esichanekileyo Kakhulu

Umfanekiso obonisiweyo weSiC Air-Bearing Stage eNgcono kakhulu

Inkcazo emfutshane:

Ngenxa yotshintsho oluqhubekayo kwishishini le-semiconductor, izixhobo zokucubungula kunye nokuhlola zifuna ukusebenza okuphezulu ngakumbi. Ngokusebenzisa ubuchule obuninzi kulawulo lokuhamba kunye nokubeka inqanaba le-nanometer, siye saphuhlisa inqanaba le-H-type dual-axis ultra-precision air-bearing stage.

Thumela i-imeyile kuthi

Iimbonakalo

Umzobo oneenkcukacha

Isishwankathelo

Yenziwe ngesakhiwo se-ceramic se-silicon carbide (SiC) esilungiselelwe izinto ezilinganiselweyo kunye netekhnoloji yokuthwala umoya ehlawulelwayo, iqonga linika ukuchaneka okugqwesileyo, ukuqina, kunye nokuphendula okuguquguqukayo. Ifanelekile kakhulu kwezi zinto zilandelayo:

Ukucubungula kunye nokuhlola i-semiconductor
Ukwenziwa kwe-micro/nano kunye ne-metrology
Ukusikwa nokupholishwa kweempukane ngesikali se-nanometer
Ukuskena okuchanekileyo ngesantya esiphezulu

Ezona mpawu

Indlela ehamba ngomoya yeSiCngenxa yokuqina okuphezulu kunye nokuchaneka
Amandla aphezulu: isantya ukuya kuthi ga kwi-1 m/s, ukukhawulezisa ukuya kuthi ga kwi-4 g, ukuzinza ngokukhawuleza
I-gantry ye-Y-axis eqhutywa kabiniiqinisekisa umthamo ophezulu womthwalo kunye nozinzo
Iinketho ze-encoder: i-optical grating okanye i-laser interferometer
Ukuchaneka kokubeka indawo: ± 0.15 μm;ukuphindaphindeka: ±75 nm
Indlela yekhebula elungiselelweyoyoyilo olucocekileyo kunye nokuthembeka kwexesha elide
Uqwalaselo olunokwenziwa ngokwezifisokwiimfuno ezithile zesicelo

Uyilo oluchanekileyo kakhulu kunye noyilo oluqhutywa ngqo, olungenanxibelelwano

Isakhelo seCeramic seSiC: ~5 × ukuqina kwe-aluminium alloy kunye ~5 × ukwanda kobushushu obuphantsi, okuqinisekisa uzinzo oluphezulu kunye nokuqina kobushushu.
Ukuthwala Umoya Okuhlawulelwayo: Uyilo lobunini luphucula ukuqina, amandla omthwalo, kunye nokuzinza kwentshukumo.
Ukusebenza okuGuquguqukayo: Ixhasa isantya se-1 m/s kunye nokukhawulezisa kwe-4 g, ilungele iinkqubo zokukhupha amandla aphezulu.
Ukuhlanganiswa Okungenamthungo: Iyahambelana neenkqubo zokwahlulahlula ukungcangcazela, izigaba ezijikelezayo, iimodyuli zokuthambekela, kunye namaqonga okuphatha iiwafer.
Ulawulo lweeCable: Irediyasi egobileyo elawulwayo inciphisa uxinzelelo ixesha elide lokusebenza.

Imoto engenanto yomgca: Intshukumo ethambileyo engenamandla okugoba.
I-Multi-Motor Drive: Ukubekwa kwenjini yomthwalo kuphucula ukuthe tye, ukuba tyaba, kunye nokuchaneka kwe-angular.
Ukuzahlula kubushushuIimoto zahlulwe kwisakhiwo seqonga; umoya okanye amanzi angasetyenziswa ukupholisa imijikelo enzima.

Iinkcukacha

Imodeli	400-400	500-500	600-600
Izembe	X (skena) / Y (inyathelo)	X (skena) / Y (inyathelo)	X (skena) / Y (inyathelo)
Uhambo (mm)	400/400	500/500	600/600
Ukuchaneka (μm)	± 0.15	± 0.2	± 0.2
Ukuphindaphinda (nm)	±75	±100	±100
Isisombululo (nm)	0.3	0.3	0.3
Isantya Esiphezulu (m/s)	1	1	1
Ukukhawulezisa (g)	4	4	4
Ukuthe tye (μm)	± 0.2	± 0.3	± 0.4
Uzinzo (nm)	±5	±5	±5
Umthwalo ophezulu (kg)	20	20	20
Iphimbo/Ukuqengqeleka/Ukugoba (i-arc-sec)	±1	±1	±1

Iimeko zoVavanyo:

Umoya ophumayo: ucocekile, womile; indawo yombethe ≤ 0°F; ukuhluzwa kwamasuntswana ≤ 0.25 μm; okanye i-nitrogen engama-99.99%.
Ukuchaneka okulinganiswe ngama-25 mm ngaphezulu kwesiseko seqonga kuma-20±1 °C, i-40–60% RH.

Izicelo

I-lithography ye-semiconductor, ukuhlolwa, kunye nokuphathwa kwe-wafer
Ukwenziwa kwe-micro/nano kunye ne-metrology echanekileyo
Ukuveliswa kwee-optics eziphezulu kunye ne-interferometry
I-Aerospace kunye nophando lwesayensi oluphambili

Imibuzo Ebuzwa Rhoqo – Inqanaba Lokuthwala Umoya leSilicon Carbide

1. Yintoni inqanaba elithwala umoya?

Iqonga elinomoya lisebenzisa ifilimu encinci yomoya oxinzelelweyo phakathi kweqonga kunye nendlela yokubonisa ukuze kubonelelweayiguquguquki, ayinxibi, kwaye ishukuma kakuhle kakhuluNgokungafaniyo neebheringi zemveli zoomatshini, isusa ukutyibilika kwe-stick-slip, inika ukuchaneka kwinqanaba le-nanometer, kwaye ixhasa ukuthembeka kwexesha elide.

2. Kutheni kufuneka kusetyenziswe i-silicon carbide (SiC) kwisakhiwo seqonga?

Ukuqina okuphezulu: ~5× ye-aluminium alloy, inciphisa ukuguquguquka ngexesha lokushukuma okuguquguqukayo.
Ukwanda okuphantsi kobushushu: ~5× ngaphantsi kune-aluminium, kugcina ukuchaneka phantsi kokutshintsha kobushushu.
Ilula: Uxinano oluphantsi xa luthelekiswa nentsimbi, nto leyo evumela ukusebenza ngesantya esiphezulu nangokukhawuleza okukhulu.
Uzinzo oluhle kakhulu: Ukudambisa okuphezulu kunye nokuqina kokubeka indawo ngokuchanekileyo kakhulu.

3. Ingaba iqonga lifuna ukuthambisa okanye ukulungiswa?

Akukho mfuneko yokuthambisa ngokwesiko kuba kukhoakukho kuthintana ngoomatshiniUlondolozo olucetyiswayo luquka:

Ukubonelelaumoya ococekileyo, owomileyo ocinezelweyo okanye i-nitrogen
Ukuhlolwa rhoqo kwezihluzi kunye nezomisi
Ukubeka iliso kwiintambo kunye neenkqubo zokupholisa

4. Zithini iimfuno zomoya?

Ingongoma yombethe: ≤ 0 °F (≈ –18 °C)
Ukuhluzwa kwamasuntswana: ≤ 0.25 μm
Umoya ococekileyo nowomileyo okanye i-nitrogen ecocekileyo eyi-99.99%
Uxinzelelo oluzinzileyo olunokuguquguquka okuncinci

Ngathi

I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.