I-Silicon Wafer ene-Ti/Cu ene-Metal-Coated (Titanium/Copper)

Umfanekiso obonisiweyo we-Ti/Cu Metal-Coated Silicon Wafer (Titanium/Copper)

Inkcazo emfutshane:

ZethuIiwafer zesilicon ezigqunywe ngesinyithi zeTi/Cuine-substrate ye-silicon esemgangathweni ophezulu (okanye iglasi/i-quartz ekhethiweyo) egqunywe nge-umaleko wokuncamathela we-titaniumkunyeumaleko wokuqhuba ubheduukusebenzisaukutshiza okuqhelekileyo kwemagnetron.Umaleko we-Ti uphucula kakhulu ukunamathela kunye nokuzinza kwenkqubo, ngelixa umaleko we-Cu top unikezela ngomphezulu onganyangekiyo, ofanayo ofanelekileyo ekunxibelelaneni kombane kunye nokufakelwa kwezinto ezincinci ngezantsi.

Thumela i-imeyile kuthi

Iimbonakalo

Umzobo oneenkcukacha

I-Ti/Cu Metal-Coated Silicon Wafer (Titanium/Copper)6

Isishwankathelo

Ezi wafers zenzelwe zombini uphando kunye nokusetyenziswa kwesikali sovavanyo, zifumaneka ngobukhulu obahlukeneyo kunye nobubanzi bokumelana, kunye nokulungiswa okuguquguqukayo kobukhulu, uhlobo lwesiseko, kunye noqwalaselo lwengubo.

Ezona mpawu

Ukunamathela okuqinileyo kunye nokuthembeka: Umaleko we-Ti bonding uphucula ukunamathela kwefilimu kwi-Si/SiO₂ kwaye uphucula ukuqina kokuphatha
Umphezulu wokuqhuba okuphezulu: I-Cu coating inika ukusebenza kakuhle kombane kwiindlela zonxibelelwano kunye nezakhiwo zovavanyo
Uluhlu olubanzi lokwenza ngokwezifiso: ubungakanani be-wafer, ukumelana noxinzelelo, ukujongwa, ubukhulu be-substrate, kunye nobukhulu befilimu ziyafumaneka xa ziceliwe
Ii-substrates ezilungele inkqubo: iyahambelana nemisebenzi eqhelekileyo yelabhoratri kunye nemisebenzi ye-fab (i-lithography, ukwakheka kwe-electroplating, i-metrology, njl.njl.)
Uthotho lwezinto ezikhoyo ziyafumaneka: ngaphandle kweTi/Cu, sikwabonelela ngee-wafers ze-Au, Pt, Al, Ni, Ag ezineentsimbi

Ulwakhiwo oluqhelekileyo kunye nokubekwa

Isitaki: I-substrate + umaleko wokunamathela we-Ti + umaleko wokugquma we-Cu
Inkqubo eqhelekileyo: Ukutshiza kweMagnetron
Iinkqubo ezikhethiweyo: Ukufuma kwe-thermal / Ukufakelwa kwe-Electroplating (kwiimfuno ze-Cu ezityebileyo)

Iipropati zoomatshini zeGlasi yeQuartz

Into	Iinketho
Ubungakanani be-wafer	2", 4", 6", 8"; 10×10 mm; ubungakanani bokusika ngokwezifiso
Uhlobo lokuqhuba	Uhlobo lwe-P / Uhlobo lwe-N / Ukumelana okuphezulu kwangaphakathi (i-Un)
Ukuqhelaniswa	<100>, <111>, njl. njl.
Ukuxhathisa	<0.0015 Ω·cm; 1–10 Ω·cm; >1000–10000 Ω·cm
Ubukhulu (µm)	2": 200/280/400/500; 4": 450/500/525; 6": 625/650/675; 8": 650/700/725/775; ngokwezifiso
Izinto ze-substrate	I-Silicon; i-quartz ekhethiweyo, iglasi ye-BF33, njl.
Ubukhulu befilimu	10 nm / 50 nm / 100 nm / 150 nm / 300 nm / 500 nm / 1 µm (ingenziwa ngokwezifiso)
Iinketho zefilimu yesinyithi	Ti/Cu; kwakhona Au, Pt, Al, Ni, Ag ekhoyo

I-Ti/Cu Metal-Coated Silicon Wafer (Titanium/Copper)4

Izicelo

Izinto zokunxibelelana ze-Ohmic kunye nezinto eziqhuba umbaneyovavanyo lwezixhobo kunye nophuhliso kunye novavanyo lombane
Iileya zembewu zokufakelwa nge-electroplating(I-RDL, izakhiwo ze-MEMS, ukwakheka kwe-Cu etyebileyo)
I-Sol-gel kunye ne-nanomaterial growth substratesuphando lwe-nano kunye ne-thin-film
I-Microscopy kunye ne-metrology yomphezulu(Ukulungiselela kunye nokulinganisa isampuli ye-SEM/AFM/SPM)
Imiphezulu yebhayoloji/yekhemikhaliezifana namaqonga okukhulisa iiseli, ii-microarray zeproteni/i-DNA, kunye nee-substrates ze-reflectometry

I-FAQ (I-Ti/Cu i-Metal-Coated Silicon Wafers)

Umbuzo 1: Kutheni kusetyenziswa umaleko we-Ti phantsi kwe-Cu coating?
A: I-Titanium isebenza njengesixhoboumaleko wokuncamathela (wokubopha), ukuphucula ukunamathela kobhedu kwi-substrate kunye nokuphucula uzinzo lwe-interface, nto leyo enceda ekunciphiseni ukuxobuka okanye ukususwa kwe-delination ngexesha lokuphathwa kunye nokucubungula.

Q2: Ithini indlela eqhelekileyo yokumisela ubukhulu beTi/Cu?
A: Iindidi eziqhelekileyo ziqukaI-Ti: amashumi e-nm (umz., 10–50 nm)kwayeI-Cu: 50–300 nmkwiifilimu ezitshileyo. Iileya ze-Cu ezityebileyo (µm-level) zihlala zifezekiswaukufakelwa nge-electroplating kumaleko wembewu ye-Cu etshiziweyo, kuxhomekeke kwisicelo sakho.

Umbuzo 3: Ngaba ungawugquma omabini amacala e-wafer?
A: Ewe.Ukwambathisa icala elinye okanye icala eliphindwe kabiniiyafumaneka xa iceliwe. Nceda ucacise imfuneko yakho xa uodola.

Ngathi

I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.