Izinto zeSapphire zeTGV ngokusebenzisa iGlasi ngeGlasi BF33 Quartz JGS1 JGS2
Intshayelelo yeMveliso yeTGV
Izisombululo zethu ze-TGV (Through Glass Via) ziyafumaneka kwiindidi ezahlukeneyo zezinto ezikumgangatho ophezulu kuquka iglasi ye-borosilicate ye-BF33, i-quartz exutyiweyo, i-JGS1 kunye ne-JGS2 fused silica, kunye ne-sapphire (ikristale enye i-Al₂O₃). Ezi zinto zikhethwe ngenxa yeempawu zazo ezibalaseleyo ze-optical, thermal, kunye ne-mechanical, nto leyo eyenza zibe zizinto ezifanelekileyo zokupakisha i-semiconductor eziphambili, i-MEMS, i-optoelectronics, kunye nezicelo ze-microfluidic. Sinikezela ngokucubungula ngokuchanekileyo ukuhlangabezana neemfuno zakho zobukhulu kunye ne-metallization.
Itheyibhile yezinto zeTGV kunye neePropati
| Izinto eziphathekayo | Uhlobo | Iipropati eziqhelekileyo |
|---|---|---|
| BF33 | Iglasi yeBorosilicate | I-CTE ephantsi, uzinzo oluhle lobushushu, kulula ukugrumba nokupolisha |
| I-Quartz | I-Fused Silica (SiO₂) | I-CTE ephantsi kakhulu, ukubonakala okuphezulu, ubushushu bombane obuhle kakhulu |
| JGS1 | Iglasi yeQuartz ebonakalayo | Ukuhanjiswa okuphezulu ukusuka kwi-UV ukuya kwi-NIR, akukho maqamza, ubumsulwa obuphezulu |
| I-JGS2 | Iglasi yeQuartz ebonakalayo | NjengeJGS1, ivumela amaqamza amancinci |
| I-Sapphire | Ikristale enye i-Al₂O₃ | Ubulukhuni obuphezulu, ukuqhuba okuphezulu kobushushu, ubushushu obuhle kakhulu beRF |
Isicelo se-TGV
Izicelo ze-TGV:
Itekhnoloji ye-Through Glass Via (TGV) isetyenziswa kakhulu kwi-microelectronics eziphambili kunye ne-optoelectronics. Izicelo eziqhelekileyo ziquka:
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I-3D IC kunye nokupakishwa kwinqanaba le-wafer— ukuvumela uqhagamshelo lombane oluthe nkqo ngokusebenzisa ii-substrates zeglasi ukuze kudityaniswe umbane omncinci noxineneyo.
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Izixhobo ze-MEMS— ukubonelela ngee-interposer zeglasi ezigqunywe nge-hermetic ezinee-through-vias zee-sensors kunye nee-actuators.
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Izixhobo zeRF kunye neemodyuli ze-antenna— ukusebenzisa ilahleko ephantsi yeglasi ye-dielectric ukuze isebenze rhoqo.
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Ukuhlanganiswa kwe-Optoelectronic— njengee-micro-lens arrays kunye nee-photonic circuits ezifuna ii-substrates ezicacileyo nezikhuselayo.
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Iitships ze-Microfluidic— ukufaka imingxunya echanekileyo yokungena kwiitshaneli zolwelo kunye nokufikelela kumbane.
Malunga neXINKEHUI
IShanghai Xinkehui New Material Co., Ltd. yenye yezona nkampani zinkulu zokubonelela nge-optical kunye ne-semiconductor eTshayina, eyasekwa ngo-2002. Apha eXKH, sineqela elinamandla le-R&D eliqulunqwe ngoososayensi abanamava kunye neenjineli abazinikele kuphando nophuhliso lwezixhobo ze-elektroniki eziphambili.
Iqela lethu ligxile kakhulu kwiiprojekthi ezintsha ezifana netekhnoloji ye-TGV (Through Glass Via), ebonelela ngezisombululo ezenzelwe wena kwiintlobo ngeentlobo zezicelo ze-semiconductor kunye ne-photonic. Sisebenzisa ubuchule bethu, sixhasa abaphandi bezemfundo kunye namaqabane emizi-mveliso kwihlabathi liphela ngee-wafers ezikumgangatho ophezulu, ii-substrates, kunye nokulungiswa kweglasi ngokuchanekileyo.
Amaqabane eHlabathi
Ngobuchule bethu obuphambili kwizixhobo ze-semiconductor, i-XINKEHUI yakhe ubudlelwane obubanzi kwihlabathi liphela. Siyazingca ngokusebenzisana neenkampani eziphambili kwihlabathi ezifana neICorningkwayeIglasi yeSchott, esivumela ukuba siqhubeke nokuphucula izakhono zethu zobugcisa kwaye siqhubele phambili uphuhliso kwiindawo ezifana ne-TGV (Through Glass Via), izixhobo ze-elektroniki ezisebenza ngamandla, kunye nezixhobo ze-optoelectronic.
Ngala mahlakani ehlabathi, asixhasi nje kuphela usetyenziso lwemizi-mveliso oluphambili kodwa sikwabandakanyeka ngokukhutheleyo kwiiprojekthi zophuhliso ezidibeneyo ezityhala imida yetekhnoloji yezinto eziphathekayo. Ngokusebenzisana ngokusondeleyo nala mahlakani ahloniphekileyo, i-XINKEHUI iqinisekisa ukuba sihlala siphambili kushishino lwe-semiconductor kunye ne-electronics eziphambili.










