Ii-substrates zeGlasi zeTGV 12inch wafer Ukubhoboza ngeglasi

Ii-substrates zeglasi zisebenza ngcono ngokweempawu zobushushu, uzinzo lomzimba, kwaye azinawo ubushushu kwaye azinangxaki yokugoba okanye yokuguquka ngenxa yobushushu obuphezulu;

Ukongeza, iipropati zombane ezikhethekileyo zesiseko seglasi zivumela ukulahleka okuphantsi kwe-dielectric, okuvumela ukuhanjiswa kwesignali kunye namandla okucacileyo. Ngenxa yoko, ukulahleka kwamandla ngexesha lokudluliselwa kwesignali kuyancitshiswa kwaye ukusebenza kakuhle kwetshiphusi kwandiswa ngokwendalo. Ubukhulu besiseko seglasi bunokuncipha malunga nesiqingatha xa kuthelekiswa neplastiki ye-ABF, kwaye ukuncitshiswa kuphucula isantya sokudluliselwa kwesignali kunye nokusebenza kakuhle kwamandla.

Itekhnoloji yokwenza imingxunya ye-TGV:

Indlela yokugrumba ebangelwa yilaser isetyenziselwa ukukhuthaza indawo eqhubekekayo yokuguguleka kwesikhumba nge-pulsed laser, ize emva koko iglasi ephathwe ngelaser ifakwe kwisisombululo se-hydrofluoric acid ukuze igrumbe. Izinga lokugrumba kweglasi yendawo yokuguguleka kwesikhumba kwi-hydrofluoric acid likhawuleza kuneleglasi engagugulekanga ukuba iphume ngemingxuma.

Ukuzaliswa kwe-TGV:

Okokuqala, kwenziwa imingxunya engaboniyo ye-TGV. Okwesibini, umaleko wembewu ubekwe ngaphakathi kwingxunya engaboniyo ye-TGV ngokuyibeka kwi-physical vapor (PVD). Okwesithathu, i-electroplating esezantsi ukuya phezulu ifezekisa ukugcwaliswa okungenamthungo kwe-TGV; Okokugqibela, ngokubopha okwethutyana, ukugawula umqolo, ukupholisha ubhedu ngekhemikhali (CMP), ukuqhaqha, ukwenza ipleyiti yokudlulisa ezaliswe yintsimbi ye-TGV.