Itafile encinci ye-Laser Pipching 1000W-6000W ubuncinci ubuncinci be-Aperture 0.1MMM inokusetyenziselwa izixhobo ze-ceramic zentsimbi
Izixhobo ezifanelekileyo
I-1. Izinto zentsimbi: ezinje nge-aluminium, ubhedu, i-titanium alloy, intsimbi engenanto, njl.
2. Izinto ezingezizo ezingesosinyithi: ezinje ngeplastiki (kubandakanywa i-Polyethylene P, i-Polypropylene PP, iglasi ye-piles, iglasi enesilwanyana, i-certz, i-certz, iphepha, isikhumba, isikhumba.
I-3. Izixhobo ezihlanganisiweyo: ziqulunqwe ngezinto ezimbini okanye ezingaphezulu kunye neepropathi ezahlukeneyo ngeendlela zomzimba okanye zekhemikhali, kunye neepropathi ezigqibeleleyo.
Izixhobo zeSiseko: kwiindawo ezithile, oomatshini bokutsala i-laser enukayo nako kungasetyenziselwa ukuqhubela phambili izixhobo ezithile ezizodwa.
Iiparamitha zenkcazo
| Igama | Idatha |
| Amandla e-laser: | I-1000W-6000W |
| Ukunqunyulwa ngokuchanekileyo: | ± 0.03mm |
| Ubuncinci bexabiso le-Aperture: | I-0.1mm |
| Ubude bokusika: | I-650mm × 800mm |
| Ukuchaneka kwendawo: | ≤ ± 0.008mm |
| Ukuchaneka okuphindaphindiweyo: | 0.008mm |
| Ukusika igesi: | Umoya |
| Imodeli emiselweyo: | I-Pneumatic Edge, inkxaso ye-fit |
| Inkqubo yokuqhuba: | Umgca wokumiswa komgca we-Magnetic |
| Ukusika ubukhulu | I-0.01mm-3mm |
Izibonelelo zobugcisa
1.Ukubaleka okusebenzayo: Ukusetyenziswa kwe-Leser ephezulu ye-leser yokuqhubela phambili kwengqungquthela, ngokukhawuleza, i-1 yesibini ukugqiba ukuqhubekeka kwemingxunya encinci.
2.Ukubangelwa ngokuchanekileyo: Ngokulawula ngokuchanekileyo amandla, ukucofa rhoqo kunye nokugxila kwe-laser, ukusebenza ngokucutha kunye nokuchaneka kom-Micron kuya kufezekiswa.
3. Kusebenza ngokubanzi: Unokucwangcisa iintlobo ezahlukeneyo ze-brittle, kunzima ukuqhubekeka nezixhobo ezizodwa, ezifana neplastiki, irabha, i-altin, i-Alunium, i-titanium, njalo njalo.
4. Ugqirha oKrelekrele: Umatshini wokuThubela i-Laserching ixhotywe ngenkqubo yolawulo yamanani aphezulu, elula ukuyidibanisa nendlela yekhompyuter kunye nenkqubo yokufumana ikhompyutha yekhompyuter yokufezekisa inkqubo ekhawulezayo kunye nendlela yokusebenza esebenzayo.
Iimeko zomsebenzi
1.Umyalezo: Unokwenza iintlobo ezahlukeneyo zokulungisa umngxunya wokuhambahamba, ezinjengeemingxunya ezijikelezileyo, imingxunya yesikwere, imingxunya yenxantathu kunye neminye imingxunya enemingxunya ekhethekileyo.
I-2.High yomgangatho: Umgangatho weHole uphakame, umda ugudileyo, akukho mvakalelo gwenxa, kwaye ukungcungcuthekiswa kuncinci.
3.Ukuhlala: Ingayigqiba i-Micro-Hole yokuHamba kunye nobungakanani obulinganayo kunye nokunikezelwa kwe-nye ngexesha, kunye nokuxhasa ukulungiswa kweqela ngaphandle kweqela ngaphandle kokungenelela kweqela.
Iimpawu zesixhobo
■ Ubuncinci besixhobo, ukusombulula ingxaki yendawo emxinwa.
■ Ukuchaneka okuphezulu, owona mngxunya uphezulu unokufikelela kwi-0.005mm.
Izixhobo kulula ukusebenza kwaye kulula ukuzisebenzisa.
■ Umthombo wokukhanya unokutshintshwa ngokwezixhobo ezahlukeneyo, kwaye ukungqinelana komelele.
■ Indawo encinci yobushushu, i-oxidation encinci ejikeleze imingxunya.
Ifildi yesicelo
1. Ishishini le-elektroniki
● IBhodi yeSekethe eprintiweyo (i-PCB) ityhala:
I-Microhole Mat: isetyenziselwa imicroholes kamatshini ene-diameter engaphantsi kwe-0.1mm kwi-PCBS ukuze ifezekise iidiliya zoxinizelelo eziphezulu (HDI).
Iimfama ezingaboniyo nezingcwaba: Mayib ezimfamayo kunye nemingxunya yokungcwaba kwii-PCB ze-pribbs ezahlukeneyo ukuphucula ukusebenza nokudityaniswa kweBhodi.
● Iphakheji ye-semiconductor:
Ukuqhutywa kwesakhelo sesakhelo: Imingxunya yokuchanekayo yenziwa kwi-semiconductor ye-semicondcuctor ekhokelela kwi-chip kwisekethe yangaphandle.
Uncedo lokusika i-wanch
2. Oomatshini bokucacisa
● Amacandelo e-Micro Reple:
Ukucuthwa kokuchaneka kweGear: Matye eNgcaciso Ngokubanzi kwiiHoles ezincinci kwiigiya ezincinci kwiinkqubo zothumelo ezichanekileyo.
Inqaku le-Ensor
● Ukwenza imveliso yomnyama:
Umngxunya wokupholisa opholileyo: Matening Hole Hole kwinaliti okanye ekufeni ukuphosa imbumbulu yokukhuthaza ukusebenza kobushushu bokwenza ubushushu.
Ukulungiswa kwe-vent: Mactuding vents ezincinci kwi-mold ukunciphisa isiphene.
3. Izixhobo zonyango
● Ukuhlaselwa kwezixhobo zokuhlikisela kancinci:
Ukungakhathalelwa kwe-Catheter: Imicroholes iqhubekisiwe ekuhlaseleni amathayitha ahlukumezi ekuhanjisweni kweziyobisi okanye i-fluid drainage.
Iindawo ze-endoscope: Imingxunya yokuchaneka idityaniswe kwilensi okanye isixhobo sentloko ye-endoscope ukuphucula ukusebenza kwesixhobo.
● Inkqubo yokuhanjiswa kweziyobisi:
I-Microneelele ye-Dringling ye-Drill: Matshini imicroholes kwi-patch yeziyobisi okanye i-microneelelere yokulawula izinga lokukhutshwa ngamachiza.
I-biochip iqhuba: Imicroholes iqhutywa kwii-biochips zenkcubeko okanye imvume.
I-4. Izixhobo ze-Optical
● I-fiber optic dibanisa:
I-filical fible hole yokuqhuba: Imicroting microholes kubuso obungapheliyo yokuqhagamshelwa kokuphuma ekuphuculeni ukusebenza ngempumelelo kwendlela yokutshintsha.
I-Fiber Accoul Matenal: Mate ezikhethekileyo zibonisa imingxunya yokuchaneka kwe-fiber ye-fiber ye-fiber ye-fiberneli yonxibelelwano lwe-pirennel.
● Isihluzi sefilitha:
Icebo lokucoca icebo lokucoca: Imicroting Matholes kwi-filter yolondolozo ukufezekisa ukhetho lweendawo ezithile zavevength.
Amalungu e-Eassing Acping: Maccound microholes kwizinto ezingafaniyo ze-laser beam yokwahlula okanye ukubumba.
I-5. Umveliso weMoto
● Inkqubo yenaliti ye-Wool:
Inaliti ye-nozzle evuthayo: Ukulungisa imingxunya yemicros kwinaliti yokufumana amandla e-aullis kunye nokuphucula ukusebenza kakuhle.
● Imveliso yeSonver:
I-Solsor yoFundo ye-Denerling: Imicroting ye-Matelas kwi-Diappragy diaphragm yokuphucula ubuntununtunu kunye nokuchaneka kwesenzi.
● Ibhetri yamandla:
Ibhetri ye-chip ye-chip ye-chip ye-chip: i-microholes yomatshini kwibhedi yebhere ye-lithium ye-chips yokuphucula ukungenisa i-electrolyte.
I-XKH ibonelela ngoluhlu olupheleleyo lweenkonzo zokumisa enye zetafile encinci yasetafileni, kubandakanya kodwa ithethwano lwenkqubo ephezulu, ukuqinisekisa ukuba abathengi bafumana amava asebenza ngokufanelekileyo, echanekileyo kunye nononophelo.
Umzobo oneenkcukacha
