Isisombululo esidibeneyo sokugquma imbewu yeSiC–Bonding–Sintering

Isisombululo Esidibeneyo Sokugquma Imbewu yeSiC–Ukubophelela–Ukusila Umfanekiso Obonisiweyo

Inkcazo emfutshane:

Guqula ukubophelela imbewu ye-SiC ukusuka kumsebenzi oxhomekeke kumqhubi ukuya kwinkqubo ephindaphindwayo, eqhutywa ziiparameter: ubukhulu bomaleko oncamathelayo obulawulwayo, ulungelelwaniso oluphakathi kunye nokucinezelwa kwe-airbag, ukucoca nge-vacuum, kunye nokuhlanganiswa kwe-carbonization ehlengahlengiswayo kubushushu/uxinzelelo. Yakhelwe iimeko zemveliso ze-6/8/12-intshi.

Thumela i-imeyile kuthi

Iimbonakalo

Umzobo oneenkcukacha

SiC晶体生长炉 SiC Crystal Growth Furnace SiC Seed Coating–Bonding–Sintering Integrated Solution

Umatshini wokugquma weSiC Coating–Bonding–Sintering Integrated Solution

Isitshizi Esichanekileyo • Ukudibanisa Ulungelelwaniso Lweziko • Ukususa iVacuum Debubbling • Ukudibanisa iCarbonization/Sintering

Isishwankathelo seMveliso

Yintoni

Esi sisombululo sidibeneyo senzelwe inyathelo elingaphezulu lokukhula kwekristale yeSiC apho imbewu/i-wafer ibotshelelwe kwi-graphite paper/graphite plate (kunye neendawo ezinxulumene nayo). Sivala i-process loop enqumlayo:

Ukwaleka (i-spray adhesive) → Ukubopha (ukulungelelanisa + ukucinezela + ukususa i-vacuum cleaner) → Ukucoca/Ukufaka i-carbonization (ukudibanisa kunye nokulungisa)

Ngokulawula ukwakheka kweglue, ukususwa kweebhamuza, kunye nokuhlanganiswa kokugqibela njengetyathanga elinye, isisombululo siphucula ukuhambelana, ukwenziwa, kunye nokukhula.

Isisombululo esidibeneyo seSiC Seed Coating–Bonding–Sintering 1

Iinketho zoBumbeko

A. Umgca ozenzekelayo
Umatshini wokuGcoba iSiC Spray → Umatshini wokuBopha iSiC → Isithando somlilo seSiC Sintering

B. Umgca ozenzekelayo ngokupheleleyo
Umatshini wokutshiza ozenzekelayo kunye nomatshini wokubophelela → Isithando somlilo seSiC
Ukudibanisa okukhethwayo: ukuphathwa kwerobhothi, ukulinganisa/ukulungelelanisa, ukufundwa kwe-ID, ukufunyanwa kwebhamuza

Isisombululo esidibeneyo seSiC Seed Coating–Bonding–Sintering 2

Iingenelo eziphambili

• Ubukhulu kunye nophahla lwe-glue olulawulwayo ukuze kube lula ukuphinda-phinda
• Ukulungelelaniswa embindini kunye nokucinezelwa kwe-airbag ukuze kudityaniswe rhoqo kwaye kusasazwe uxinzelelo
• Ukucoca nge-vacuum ukunciphisa amaqamza/imingxuma ngaphakathi komaleko wokuncamathelisa
• Ukuhlanganiswa kwekhabhoni yobushushu/uxinzelelo oluhlengahlengiswayo ukuze kuzinziswe ibhondi yokugqibela
• Iindlela zokwenza izinto ngokuzenzekelayo zexesha elizinzileyo lomjikelo, ukulandeleka, kunye nolawulo lomgangatho olukwi-intanethi

Umgaqo

Kutheni iindlela zemveli zinzima
Ukusebenza kokubopha imbewu kudla ngokulinganiselwa ziinguqu ezintathu ezidityanisiweyo:

Ukuqina komaleko oncamathelayo (ubukhulu kunye nokufana)
Ulawulo lwebhamuza/olungenanto (umoya uvaleleke kumaleko wokuncamathelisa)
Uzinzo emva kokubopha emva kokulungiswa/ukufakwa kwikhabhoni

Ukwambatha ngesandla kudla ngokukhokelela ekungahambelani kobukhulu, ubunzima bokuhluza amagwebu, umngcipheko ophezulu we-inside void, ukukrweleka okunokwenzeka kwemiphezulu yegrafiti, kunye nokukhula okungekuhle ukuze kuveliswe ngobuninzi.

I-spin coating ingabangela ukutyeba okungazinziyo ngenxa yokuziphatha kokuhamba kwe-glue, uxinzelelo lomphezulu, kunye namandla e-centrifugal. Isenokujongana nongcoliseko olusecaleni kunye nemida yokufakela kwi-graphite paper/plates, kwaye kunokuba nzima ukuba i-glue enomxholo oqinileyo igqunywe ngokulinganayo.

Isisombululo esidibeneyo seSiC Seed Coating–Bonding–Sintering 3

Indlela esebenza ngayo le ndlela idibeneyo

Ukwaleka: Ukwaleka okutshizwayo kwenza ubukhulu bomaleko wokuncamathelisa obulawulekayo kunye nokugquma kwiindawo ekujoliswe kuzo (imbewu/isonka esisikiweyo, iphepha legrafiti/ipleyiti).

Ukubopha: Ukulungelelaniswa embindini + ukucinezelwa kwe-airbag kuxhasa ukudibana rhoqo; ukucoca nge-vacuum kunciphisa umoya ovalelekileyo, amaqamza, kunye ne-voids kumaleko we-adhesive.

Ukusila/Ukufaka iCarbonization: Ukuhlanganiswa kobushushu obuphezulu kunye nobushushu obuhlengahlengiswayo kunye noxinzelelo kuzinzisa ujongano lokugqibela oludibeneyo, kujoliswe kwiziphumo ezingenamaqamza kunye nokucinezela okufanayo.

Ingxelo yokusebenza ebhekisayo
Isivuno sokubopha i-carbonization sinokufikelela kwi-90%+ (ireferensi yenkqubo). Iireferensi zesivuno sokubopha eziqhelekileyo zidweliswe kwicandelo le-Classic Cases.

Inkqubo

A. Ukuhamba komsebenzi ozenzekelayo

Inyathelo 1 — Ukutshiza (Ukugquma)
Faka iglu nge-spray coating kwiindawo ekujoliswe kuzo ukuze ufumane ubukhulu obuzinzileyo kunye nokugquma okufanayo.

Inyathelo lesi-2 — Ulungelelwaniso kunye nokuBopha (UkuBopha)
Yenza ulungelelwaniso oluphakathi, sebenzisa ukucinezela i-airbag, kwaye usebenzise i-vacuum debubbling ukususa umoya ovalelekileyo kumaleko we-adhesive.

Inyathelo lesi-3 — Ukudibanisa iCarbonization (Ukusila/Ukufaka iCarbonization)
Dlulisa iindawo ezibotshelelweyo kwisithando somlilo esitshisayo uze usebenzise ukuhlanganiswa kwekhabhoni yobushushu obuphezulu kunye nobushushu obuhlengahlengiswayo kunye noxinzelelo ukuze uzinzise ukubopha kokugqibela.

B. Ukuhamba komsebenzi ngokuzenzekelayo ngokupheleleyo

Umatshini wokutshiza ozenzekelayo kunye nomatshini wokubopha udibanisa imisebenzi yokubopha kunye neyokubopha kwaye ungabandakanya ukuphathwa kwerobhothi kunye nokulinganisa. Iinketho ezikwi-line zingabandakanya ukufundwa kwe-ID kunye nokufunyanwa kwamaqamza ukuze kulandelelwe kwaye kulawulwe umgangatho. Iinxalenye emva koko ziqhubekela kwisithando somlilo ukuze kuhlanganiswe i-carbonization.

Ukuguquguquka kwendlela yenkqubo
Ngokuxhomekeke kwizixhobo zomdibaniso kunye nendlela ekhethwayo yokusebenza, inkqubo inokuxhasa ulandelelwano olwahlukeneyo lokugquma kunye neendlela zokutshiza ezimacala omabini okanye amacala amabini ngelixa igcina injongo efanayo: umaleko wokuncamathelisa ozinzileyo → ukucoca okusebenzayo → ukuhlanganiswa okufanayo.

Isisombululo esidibeneyo seSiC Seed Coating–Bonding–Sintering 4

Izicelo

Isicelo esiphambili
Ukukhula kwekristale ye-SiC ukudityaniswa kwembewu phezulu: ukuhlanganiswa kwembewu/isitya kwi-graphite paper/graphite plate kunye neendawo ezinxulumene nayo, kulandele ukuhlanganiswa kwe-carbonization.

Iimeko zobungakanani
Ixhasa usetyenziso lwe-bonding lwe-intshi eziyi-6/8/12 ngokukhetha uqwalaselo kunye ne-process routing eqinisekisiweyo.

Iimpawu eziqhelekileyo zokulingana
• Ukwaleka ngesandla kubangela ukuguquguquka kobukhulu, amaqamza/imingxuma, imikrwelo, kunye nokuguquguquka komgangatho
• Ubukhulu be-spin coating abuzinzanga okanye bunzima kwiphepha/iipleyiti zegrafiti; kukho imida yongcoliseko/yokulungisa ecaleni
• Ufuna imveliso enokwandiswa enokuphinda-phinda okuqinileyo kwaye ixhomekeke kancinci kubasebenzisi
• Ufuna ukuzenzekela, ukulandeleka, kunye neenketho ze-QC ezikwi-intanethi (ID + ukufunyanwa kweqamza)

Amatyala Aqhelekileyo (Iziphumo Eziqhelekileyo)

Qaphela: Ezi zilandelayo ziinkcukacha zesalathiso/iireferensi zenkqubo eziqhelekileyo. Ukusebenza kokwenyani kuxhomekeke kwinkqubo yokuncamathisela, iimeko zezinto ezingenayo, iwindow yenkqubo eqinisekisiweyo, kunye nemigangatho yokuhlolwa.

Ityala 1 — 6/8-intshi Ukubopha Imbewu (Umphumo kunye nesalathiso sesivuno)
Akukho plate yegrafayithi: 6 iipcs/iyunithi/ngosuku
Ngepleyiti yegrafayithi: 2.5 iipcs/iyunithi/ngosuku
Isivuno sokubopha: ≥95%

Ityala lesi-2 — Ukubopha Imbewu eyi-12-intshi (Isiphumo kunye nesalathiso sesivuno)
Akukho plate yegrafayithi: 5 iipcs/iyunithi/ngosuku
Ngepleyiti yegrafayithi: 2 ii-pcs/iyunithi/ngosuku
Isivuno sokubopha: ≥95%

Ityala lesi-3 — Isalathiso seNzala yokuHlanganisa iCarbonization
Isivuno sokubopha i-carbonization: 90%+ (isalathisi senkqubo)
Iziphumo ekujoliswe kuzo: Iziphumo ezingenamaqamza kunye nokucinezela okufanayo (kuxhomekeke kwiikhrayitheriya zokuqinisekiswa kunye nokuhlolwa)

Isisombululo esidibeneyo seSiC Seed Coating–Bonding–Sintering 5

FAQ

Q1: Yeyiphi ingxaki ephambili esi sisombululo esijongana nayo?
A: Iqinisa ukubopha imbewu ngokulawula ubukhulu/ukugquma kweglue, ukusebenza kokulungisa amaqhuma, kunye nokuhlanganiswa emva kokubopha—iguqula inyathelo elixhomekeke kwizakhono libe yinkqubo yokuvelisa ephindaphindwayo.

Umbuzo 2: Kutheni ukugquma ngesandla kudla ngokukhokelela kwiibhamuza/izinto ezingafakwanga?
A: Iindlela ezenziwe ngesandla ziyasokola ukugcina ubukhulu obufanayo, nto leyo eyenza ukucoca amaqhekeza kube nzima kwaye konyusa umngcipheko womoya ovalelekileyo. Zinokukrwela nemiphezulu yegrafiti kwaye kunzima ukuyilinganisa ngokwevolumu.

Umbuzo 3: Kutheni i-spin coating ingazinzi kolu setyenziso?
A: Ubukhulu bunobuthathaka kwindlela ehamba ngayo i-glue, uxinzelelo lomphezulu, kunye namandla e-centrifugal. I-graphite paper/plate coating inokuthintelwa yi-fixturing kunye nomngcipheko wongcoliseko olusecaleni, kwaye i-glue enomxholo oqinileyo inokuba nzima ukuyijika ngokulinganayo.

Ngathi

I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.