Iimveliso
-
I-Silicon Carbide (SiC) I-Surstrate yeCristal enye – 10×10mm I-Wafer
-
Umatshini wokusika iingcingo ezintathu zeDayimane kwiSitolo esinye seSi Wafer/Optical Glass Material Cutting
-
Ilebhu yeSapphire etyheli eyenzelwe ukuvelisa ubucwebe
-
I-Alumina Ceramic End Effector / Fork Arm yokuphatha iWafer kunye neSubstrate
-
Inkqubo yoQondiso lweWafer yokulinganisa uQondiso lweCrystal
-
I-SiC Ceramic Tray ye-Wafer Carrier enokumelana nobushushu obuphezulu
-
Ingalo yeSiC Ceramic Fork / Isiphumo sokugqibela - Ukuphathwa okuNgcono okuPhambili koMveliso weSemiconductor
-
Itreyi yeCeramic yeSilicon Carbide – Iitreyi ezihlala ixesha elide nezisebenza kakuhle kwizicelo zobushushu nezekhemikhali
-
I-Alumina Ceramic End Effector eSebenza ngokuPhezulu (iFork Arm) yeSemiconductor kunye neCleanroom Automation
-
Iityhubhu zeQuartz eziFused ezinobungakanani obunokulungiselelwa ukusetyenziswa kwimizi-mveliso nakwilebhu
-
I-SiO₂ Quartz Wafer Ii-Quartz Wafers I-SiO₂ MEMS Ubushushu 2″ 3″ 4″ 6″ 8″ 12″
-
Ibhokisi yokuthwala enye yeWafer 1″2″3″4″6″