I-substrate ye-P-type SiC wafer ye-SiC imveliso entsha ye-Dia2inch
Ii-substrates ze-silicon carbide zohlobo lwe-P zisetyenziswa kakhulu ekwenzeni izixhobo zamandla, ezifana nee-Insulate-Gate Bipolar transistors (IGBTs).
IGBT= MOSFET+BJT, esisitshixo esivulayo. MOSFET=IGFET(ityhubhu yesiphumo sentsimi yesinyithi se-semiconductor, okanye i-transistor yesiphumo sentsimi yesango egqunyiweyo). I-BJT(i-Bipolar Junction Transistor, eyaziwa ngokuba yi-transistor), i-bipolar ithetha ukuba kukho iintlobo ezimbini zee-electron kunye nee-hole carriers ezibandakanyekayo kwinkqubo yokuqhuba umsebenzi, ngokubanzi kukho i-PN junction ebandakanyekayo ekuqhubeni.
I-wafer ye-silicon carbide (SiC) ye-2-intshi ikwi-polytype ye-4H okanye ye-6H. Ineempawu ezifanayo nee-wafer ze-silicon carbide (SiC) ye-n-type, ezifana nokumelana nobushushu obuphezulu, ukuqhuba okuphezulu kobushushu, kunye nokuqhuba okuphezulu kombane. Ii-substrates ze-p-type SiC zihlala zisetyenziswa ekwenzeni izixhobo zamandla, ngakumbi ekwenzeni ii-transistors ze-bipolar ezifakwe i-insulated-gate (IGBTs). Uyilo lwee-IGBT ludla ngokubandakanya ii-PN junctions, apho i-p-type SiC iluncedo ekulawuleni indlela esebenza ngayo isixhobo.
Umzobo oneenkcukacha


