I-N-Type SiC Composite Substrates Dia6inch Umgangatho ophezulu we-monocrystaline kunye ne-substrate ephantsi yomgangatho

Inkcazelo emfutshane:

I-N-Type SiC Composite Substrates zizinto eziphathekayo ze-semiconductor ezisetyenziselwa ukuveliswa kwezixhobo zombane. Ezi substrates zenziwe nge-silicon carbide (SiC), ikhompawundi eyaziwa ngokuba yi-thermal conductivity egqwesileyo, amandla ombane aphezulu wokuqhekeka, kunye nokuchasana neemeko ezinzima zokusingqongileyo.


Iinkcukacha zeMveliso

Iithegi zeMveliso

I-N-Type ye-SiC Composite Substrates Itheyibhile yepharamitha eqhelekileyo

项目Izinto ILogo Simahla Akukho mlinganiselo Ipapashwe ngu-指标Inkcazo 项目Izinto ILogo Simahla Akukho mlinganiselo Ipapashwe ngu-指标Inkcazo
直径Ububanzi 150±0.2mm ( 硅 面 ) 粗 糙 度
Ngaphambili (Si-face)uburhabaxa
Ra≤0.2nm (5μm*5μm)
晶型Iipolytype 4H I-Edge Chip, i-Scratch, i-Crack (ukuhlolwa okubonakalayo) Akukho nanye
电阻率Ukuxhathisa 0.015-0.025ohm ·cm 总厚度变化TTV ≤3μm
Ukugqithisela umaleko Ukutyeba ≥0.4μm 翘曲度I-Wap ≤35μm
空洞Ilize ≤5ea/wafer (2mm>D>0.5mm) 总厚度Ukutyeba 350±25μm

Igama elithi "N-uhlobo" libhekisela kuhlobo lwe-doping olusetyenziswa kwizinto ze-SiC. Kwi-physics ye-semiconductor, i-doping ibandakanya ukungeniswa ngabom kokungcola kwi-semiconductor ukuguqula iimpawu zayo zombane. I-N-uhlobo lwe-doping yazisa izinto ezibonelela ngokugqithiswa kwee-electron zamahhala, zinika izinto eziphathekayo ugxininiso lwe-carrier carrier.

Uncedo lwe-N-uhlobo lwe-SiC composite substrates ziquka:

1. Ukusebenza kobushushu obuphezulu: I-SiC ine-conductivity ephezulu ye-thermal kwaye inokusebenza kumaqondo okushisa aphezulu, okwenza ukuba ifaneleke kwi-high-power and high-frequency electronic applications.

2. Amandla ombane aphezulu wokuqhekeka: Izixhobo ze-SiC zinevoltheji ephezulu yokuqhawuka, ezenza zikwazi ukumelana namabala ombane aphezulu ngaphandle kokuqhawuka kombane.

3. Ukumelana nemichiza kunye nokusingqongileyo: I-SiC ixhatshazwa yikhemikhali kwaye inokumelana neemeko ezinzima zokusingqongileyo, iyenze ilungele ukusetyenziswa kwizicelo ezinzima.

4. Ukunciphisa ukulahlekelwa kwamandla: Xa kuthelekiswa nezinto eziqhelekileyo ezisekelwe kwi-silicon, i-substrates ye-SiC yenza ukuguqulwa kwamandla okusebenzayo kunye nokunciphisa ukulahlekelwa kwamandla kwizixhobo zombane.

5. I-Bandgap ebanzi: I-SiC ine-bandgap ebanzi, evumela ukuphuhliswa kwezixhobo zombane ezinokuthi zisebenze kumaqondo aphezulu kunye noxinzelelo lwamandla aphezulu.

Ngokubanzi, ii-substrates ezihlanganisiweyo zohlobo lwe-N-SiC zibonelela ngenzuzo ebalulekileyo kuphuhliso lwezixhobo zombane ezisebenza ngokuphezulu, ngakumbi kwizicelo apho ukusebenza kobushushu obuphezulu, ubuninzi bamandla amakhulu, kunye noguqulo lwamandla olusebenzayo lubalulekile.


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