I-Diamond Saw enezintambo ezininzi i-TJ3000 12″ Ijika Elihlayo Eliguqulweyo
Umzobo oneenkcukacha
Indawo yeMveliso kunye nezicelo
I-TJ3000 yisarha yedayimani eneengcingo ezininzi ekhawulezayo nechanekileyo, eyenzelwe ngokukodwaIiwafer ze-semiconductor ze-intshi ezili-12 kunye ne-substrates zesafireIdibanisa ubuchule bokucubungula iikristale ezinkulu kunye nokusebenza okuncinci kakhulu kokusika, okwenza ukuba ifaneleke kwimveliso yobuninzi kunye nemigca ye-R&D ephucukileyo.
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I-silicon carbide (i-SiC)
I-Sapphire
Iiseramikhi eziphucukileyo / zobugcisa
Iintsimbi ezixabisekileyo kunye nee-alloys eziqinileyo (emva kovavanyo lwenkqubo)
I-Quartz kunye neglasi ekhethekileyo
Izixhobo zekristale ze-semiconductor
Iglasi ebonakalayo kunye neglasi elaminethiweyo
Izicelo eziqhelekileyo:
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I-wafer eyi-12" kunye nokusika i-substrate
Ukuveliswa kwezixhobo zamandla
Ukuvulwa kwe-ceramic kunye ne-glass substrate
Ukusikwa ngokuchanekileyo kwezinto eziqinileyo ezixabisekileyo
Amandla okucubungula angundoqo
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Ubungakanani obukhulu bomsebenzi:Ø310 × 500 mm(ixhasa usetyenziso olufikelela kwi-12")
Uluhlu lobubanzi bentambo yedayimani:0.1 – 0.5 mm
Uluhlu lokusika ubukhulu:0.1 – 20 mm
Ukuchaneka kokusika:≈ 0.01 mm(kuxhomekeke kwiimeko zezinto kunye nenkqubo)
Umthamo wokugcina umgca wevili lokuhambisa:20 km(isekelwe kwintambo ye-Ø0.25 mm)
Olu luhlu lwezakhono lugubungela ii-wafers eziqhelekileyo, ii-wafers ezincinci, kunye nee-substrates ezincinci kakhulu, ngelixa zigcina ubukhulu obufanayo kunye nomgangatho womphezulu kwiintlobo ezahlukeneyo zeemveliso.

Indlela Yokusika kunye noLawulo Lokuhamba
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Indlela yokusika:ukusika okujijekileyo okujonge ezantsi
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Isiqwenga somsebenzi siyajika size sondleke ukusuka phezulu ukuya ezantsi
Ucingo lwedayimani luhlala lungashukumi
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Ukuphakamisa ngokuthe nkqo kwetafile yokusebenza:350 mm
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I-engile yokujika:±8°
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Isantya sokujika:≈ 0.83°/s
Ngombono wokusika "i-workpiece swinging, wire stationary", i-TJ3000:
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Yehlisa ukungcangcazela kwentambo kunye namanqaku exesha
Iphucula uburhabaxa bomphezulu osikiweyo kunye nokufana kobukhulu
Iphucula ukuthamba kunye nokuhambelana kwezinto ezinkulu zokusebenza
Zonke ii-axes ziqhutywa zii-servo motors ezinempendulo ephezulu, eziqinisekisa ukuphindaphindeka okuhle kakhulu kokutyiwa, ukujija, kunye neentshukumo zokuphakamisa.
Inkqubo yeWire kunye neMveliso
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Isantya esiphezulu sentambo yedayimani:2500 m/ngomzuzu
Isantya sokusika ukutya:0.01 – 10 mm/ngomzuzu(ihlengahlengiswa rhoqo)
Uxinzelelo olukhulu lokusika:0 – 80 N, kunye0.1 Niyunithi yokuseta encinci
Ukudibanisa isantya esiphezulu sentambo, ukugcinwa kwemigca emide, kunye nolawulo lokuxinana okuncinci kubonelela:
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Ukulungiswa kweparameter eguquguqukayo kwiidayamitha ezahlukeneyo zeentambo kunye nezixhobo
Ukuvelisa okuphezulu ngelixa kugcinwa isivuno esiphezulu kunye nomgangatho womphezulu
Ubuchule bokuvelisa ubuninzi obuqhubekayo iiyure ezingama-24 ngosuku, iintsuku ezisixhenxe ngeveki, ngaphandle kokuphazamiseka okuncinci kokutshintsha iingcingo
Uqwalaselo lweengcingo ezininzi lwenza ukuba kunqunyulwe ngaxeshanye iziqwenga ezininzi, nto leyo enciphisa kakhulu iindleko zokusika iiyunithi.
Indawo yokuphola, yokuhluza kunye nenkqubo
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Umthamo wetanki yamanzi:300 L
Ulwelo lokusika:ulwelo lokusika oluchasene nomhlwa olusebenza kakuhle kakhulu xa lujikeleza ngaphandle
Iingenelo zenkqubo:
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Ukupholisa kunye nokuthambisa okuzinzileyo nokwaneleyo kwindawo yokusika
Ukususwa kweetshiphusi okusebenzayo, ukunciphisa ukuqhekeka komphetho kunye nokuqhekeka okuncinci
Ixesha elide lenkonzo yocingo lwedayimani, iirola ezikhokelayo, kunye neerola ezigqunyiweyo
Indawo yokusika ecocekileyo, iphucula uzinzo lwenkqubo kunye nesivuno
iinkcukacha
| Iinkcukacha zobugcisa | Iinkcukacha |
|---|---|
| Ubungakanani obukhulu boMsebenzi | Ø310×500mm |
| Ububanzi beRoller Coating ePhambili | Ø350×510mm (Iirola ezimbini eziphambili) |
| Isantya sokuSebenza kweNtambo | 2500 (MAX) m/min |
| Ububanzi beDayimani yoCingo | 0.1-0.5mm |
| Umthamo wokugcina umgca wevili lokubonelela | 20km (0.25金刚线) |
| Ukusika Uluhlu Lokutyeba | 0.1-20mm |
| Ukuchaneka kokusika | 0.01mm |
| Ukuphakama okuthe nkqo kweSiteshi sokuSebenza | 350mm |
| Indlela Yokusika | Ukusikwa kwe-swing ezantsi (Izinto ziyashukuma zehle ukusuka phezulu ukuya ezantsi, ngelixa ucingo lwedayimani luhlala lungashukumi) |
| Isantya sokuSika sokuTya | 0.01-10m/ngomzuzu |
| Itanki Yamanzi | 300L |
| Ulwelo lokusika | Ulwelo lokusika olusebenza kakuhle lwe-TJ oluchasene nomhlwa |
| I-Angle ye-Swing | ±8° |
| Isantya sokujika | 0.83°/s |
| Uxinzelelo oluphezulu lokusika | 0-80N (Seta ubuncinane beyunithi 0.1N) |
| Inani leebhentshi zokusebenzela | 1 |
| Ukunikezwa Amandla | I-AC380V/50Hz enamacingo amahlanu enamanqanaba amathathu |
| Amandla apheleleyo eSixhobo soMatshini | ≤113kW |
| Injini Ephambili (Ukupholisa Amanzi) | 32kW×2kw |
| Injini yoNxibelelwano | 1×2kW |
| Injini yeSwing yeSitishi sokuSebenza | 1.5×1kW |
| Injini Enyukayo Neyawayo Kwindawo Yokusebenzela | 0.4×1kW |
| Imoto yoLawulo loxinzelelo (Ukupholisa amanzi) | 5.5×2kW |
| Imoto yoKhupha kunye nokuQokelelwa kweeNtambo | 15×2kW |
| Ubukhulu bangaphandle (Ngaphandle kwebhokisi yengalo yeRocker) | 2700×1650×3050mm |
| Ubukhulu bangaphandle (Kubandakanya iRocker Arm Box) | 2950×1650×3104mm |
| Ubunzima bomatshini | 8200KG |
FAQ
1. Zeziphi izinto ezinokwenziwa ngumatshini wokusika we-TJ3000?
I-TJ3000 yenzelwe ukusika uluhlu olubanzi lwezixhobo, kuquka i-silicon carbide (SiC), ii-sapphire substrates, ii-ceramics, iintsimbi ezixabisekileyo, ilitye le-quartz, izinto ze-semiconductor, iglasi ye-optical, kunye neglasi elaminethiweyo.
2. Ingakanani ubukhulu bokusika be-TJ3000?
Ubungakanani obukhulu bomsebenzi i-TJ3000 enokuyiphatha yi-Ø310×500mm, nto leyo evumela ukuba ikwazi ukucubungula izinto ezinkulu nezincinci kakhulu ngokufanelekileyo.
3. Ubungakanani bokutyeba komatshini?
Uluhlu lobukhulu bokusika luqala kwi-0.1mm ukuya kwi-20mm, nto leyo eyenza umatshini ufanelekele iimfuno ezahlukeneyo zokusika, ukusuka kwizilayi ezibhityileyo kakhulu ukuya kwiindawo ezityebileyo.
4. Ingasebenza ngesantya esingakanani intambo yedayimani kwi-TJ3000?
Ucingo lwedayimani lunokusebenza ngesantya esiphezulu seemitha ezingama-2500 ngomzuzu, nto leyo evumela ukusika kakuhle nokuphucula kakhulu amandla okuvelisa.
Ngathi
I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.









