Inkqubo yokusika i-laser ekhokelwa ngamanzi yeMicrojet yezixhobo eziphambili

Inkqubo yokusika i-laser ekhokelwa ngamanzi yeMicrojet yezixhobo eziphucukileyo Umfanekiso obonisiweyo

Inkcazo emfutshane:

Isishwankathelo:

Njengoko amashishini esiya kwi-semiconductors eziphucukileyo kunye nezixhobo ezininzi ezisebenzayo, izisombululo zoomatshini ezichanekileyo kodwa ezithambileyo ziba zibaluleke kakhulu. Le nkqubo yokucubungula i-laser ekhokelwa ngamanzi ye-microjet yenzelwe ngokukodwa imisebenzi enjalo, idibanisa itekhnoloji ye-laser ye-Nd:YAG eqinileyo kunye nomjelo wamanzi we-microjet oxinezelekileyo, inika amandla ngokuchanekileyo okukhulu kunye noxinzelelo oluncinci lobushushu.

Ixhasa zombini ubude be-532nm kunye ne-1064nm kunye noqwalaselo lwamandla lwe-50W, 100W, okanye i-200W, le nkqubo sisisombululo esiphambili kubavelisi abasebenza ngezinto ezifana ne-SiC, i-GaN, idayimani, kunye nee-ceramic composites. Ilungele ngokukodwa imisebenzi yokuvelisa kwi-elektroniki, kwi-aerospace, kwi-optoelectronics, nakwicandelo lamandla acocekileyo.

Thumela i-imeyile kuthi

Iimbonakalo

Iingenelo eziphezulu

1. Ukugxila kwamandla okungenakuthelekiswa nanto ngokusebenzisa isikhokelo samanzi
Ngokusebenzisa ijethi yamanzi ecinezelwe kakuhle njengesikhokelo samaza elaser, inkqubo isusa ukuphazamiseka komoya kwaye iqinisekisa ukugxila ngokupheleleyo kwelaser. Isiphumo kukuba ububanzi obuncinci kakhulu—obuncinci njenge-20μm—bunemiphetho ebukhali necocekileyo.

2. Unyawo oluphantsi lobushushu
Ulawulo lobushushu lwenkqubo ngexesha langempela luqinisekisa ukuba indawo echaphazelekileyo bubushushu ayidluli kwi-5μm, nto leyo ebalulekileyo ekugcineni ukusebenza kwezinto kunye nokuphepha ukuqhekeka okuncinci.

3. Ukuhambelana kwezinto ezibanzi
Ukuphuma kwamaza amabini (532nm/1064nm) kubonelela ngokulungiswa okuphuculweyo kokufunxa, okwenza umatshini ukwazi ukuziqhelanisa neentlobo ngeentlobo zezixhobo, ukusuka kwiikristale ezikhanyayo ukuya kwiiceramics ezingabonakaliyo.

4. Ulawulo lweNtshukumo oluPhezulu, olunesantya esiphezulu
Ngeendlela ezahlukeneyo zeemoto ezisebenzisa ulayini kunye nezisebenzisa umbane ngqo, inkqubo ixhasa iimfuno zokusebenzisa umbane ophezulu ngaphandle kokuphazamisa ukuchaneka. Ukunyakaza okune-axis ezintlanu kuvumela ukuveliswa kweepateni ezintsonkothileyo kunye nokusikwa okuhamba ngeendlela ezininzi.

5. Uyilo oluyiModular nolunokulinganiswa
Abasebenzisi banokwenza ulungelelwaniso lwenkqubo ngokusekelwe kwiimfuno zesicelo—ukusuka kwi-prototyping esekelwe kwilebhu ukuya kwi-deployments-scale deployments—okwenza ukuba ifaneleke kuzo zonke iindawo zophando nophuhliso kunye nezoshishino.

Iindawo zoSetyenziso

IiSemiconductors zeSizukulwana Sesithathu:
Ilungele ii-wafers zeSiC kunye neGaN, le nkqubo yenza ukunqumla, ukunqumla, kunye nokusika ngokuthembeka okugqwesileyo.

Umatshini weDiamond kunye neOxide Semiconductor:
Isetyenziselwa ukusika nokugrumba izixhobo ezinobunzima obuphezulu ezifana nedayimani yekristale enye kunye neGa₂O₃, ngaphandle kwekhabhoni okanye ukuguqulwa kobushushu.

Izinto eziPhambili zeAerospace:
Ixhasa ukwakheka kwesakhiwo sezinto ezidityanisiweyo zeseramikhi ezixineneyo kunye nee-superalloys zeenjini zejethi kunye nezixhobo zesathelayithi.

Ii-Photovoltaic kunye nee-Ceramic Substrates:
Ivumela ukusika ii-wafers ezibhityileyo kunye ne-LTCC substrates ngaphandle kwe-burr, kubandakanya i-through-holes kunye ne-slot milling ukuze kudityaniswe.

Izinto ezibonisa ukukhanya kunye nezinto ezibonakalayo:
Igcina umphezulu uthambile kwaye udluliswa kwizinto ezibonakalayo ezibuthathaka ezifana neCe:YAG, LSO, nezinye.

Inkcazo

Uphawu	Inkcazo
Umthombo weLaser	I-DPSS Nd:YAG
Iinketho zobude beWave	532nm / 1064nm
Amanqanaba Amandla	Iiwatts ezingama-50/100/200
Uchaneko	±5μm
Ububanzi bokusika	Incinci njenge-20μm
Indawo echaphazelekileyo bubushushu	≤5μm
Uhlobo lweNtshukumo	I-Linear / i-Direct Drive
Izixhobo ezixhaswayo	I-SiC, iGaN, iDayimane, iGa₂O₃, njl.

Kutheni Ukhetha Le Nqubo?

● Iphelisa iingxaki eziqhelekileyo zoomatshini be-laser ezifana nokuqhekeka kobushushu kunye nokuqhekeka komphetho
● Iphucula isivuno kunye nokuhambelana kwezinto ezibiza kakhulu
● Ilungele ukusetyenziswa kwinqanaba lovavanyo kunye nelemizi-mveliso
● Iqonga eliqinisekisa ikamva lesayensi yezinto eziphuhlisayo

Imibuzo neempendulo

Q1: Zeziphi izinto ezinokwenziwa yile nkqubo?
A: Le nkqubo yenzelwe ngokukodwa izinto eziqinileyo nezibuthathaka nezinexabiso eliphezulu. Ingasebenza ngempumelelo kwi-silicon carbide (SiC), i-gallium nitride (GaN), idayimani, i-gallium oxide (Ga₂O₃), ii-LTCC substrates, ii-aerospace composites, ii-photovoltaic wafers, kunye neekristale ze-scintillator ezifana ne-Ce:YAG okanye i-LSO.

Umbuzo 2: Isebenza njani iteknoloji yelaser ekhokelwa ngamanzi?
A: Isebenzisa i-microjet yamanzi enoxinzelelo oluphezulu ukukhokela umqadi we-laser ngokubonakalisa ngaphakathi ngokupheleleyo, ihambisa amandla e-laser ngempumelelo ngokusasazwa okuncinci. Oku kuqinisekisa ukugxila okuncinci kakhulu, umthwalo ophantsi wobushushu, kunye nokunqunyulwa ngokuchanekileyo ngobubanzi bemigca ukuya kwi-20μm.

Q3: Zeziphi iindlela ezikhoyo zokumisela amandla e-laser?
A: Abathengi banokukhetha kwiindlela zamandla e-laser ezingama-50W, 100W, kunye ne-200W ngokuxhomekeke kwisantya sabo sokucubungula kunye neemfuno zesisombululo. Zonke iindlela zigcina uzinzo oluphezulu kunye nokuphindaphinda.