I-Microjet Water-Guided Laser Cutting System kwi-Advanced Materials

Inkcazelo emfutshane:

Isishwankathelo:

Njengoko imizi-mveliso isiya kwii-semiconductors ezihambele phambili ngakumbi kunye nemathiriyeli esebenzayo, izisombululo ezichanekileyo kodwa ezithambileyo zomatshini zibaluleka. Le nkqubo ye-laser ekhokelwa ngamanzi e-microjet yenzelwe ngokukodwa imisebenzi enjalo, idibanisa i-solid-state Nd: YAG iteknoloji ye-laser kunye ne-high-pressure microjet water conduit, ukuhambisa amandla ngokuchaneka okugqithisileyo kunye noxinzelelo oluncinci lwe-thermal.

Ukuxhasa zombini i-532nm kunye ne-1064nm ubude be-wavelengths kunye nohlengahlengiso lwamandla e-50W, i-100W, okanye i-200W, le nkqubo iyisisombululo esiphumeleleyo kubavelisi abasebenza ngezinto ezifana ne-SiC, i-GaN, idayimane, kunye ne-ceramic composites. Ilungele ngokukodwa imisebenzi yokwenziwa kwezinto zombane, i-aerospace, i-optoelectronics, kunye namacandelo anamandla acocekileyo.

Thumela i-imeyile kuthi

Iimbonakalo

Izinto eziluncedo eziphezulu

1. UkuGxininisa kuMandla angenakuthelekiswa nanto ngesiKhokelo saManzi
Ngokusebenzisa ijethi yamanzi egxininiswe kakuhle njenge-laser waveguide, inkqubo iphelisa ukuphazamiseka komoya kwaye iqinisekisa ukugxila kwe-laser epheleleyo. Isiphumo si-ultra-namxinwa ububanzi bokusika-ebuncinci njenge-20μm-kunye neengqungquthela ezibukhali, ezicocekileyo.

2. Ubuncinci boNyawo lweThermal
Inkqubo yolawulo lwexesha lokwenyani lwe-thermal iqinisekisa ukuba indawo echaphazeleke bubushushu ayinakudlula i-5μm, ibalulekile ekugcineni ukusebenza kwezinto kunye nokuphepha i-microcracks.

3. Ukuhambelana kwezinto eziBanzi
Imveliso yobude obuphindwe kabini (532nm/1064nm) ibonelela ngokulungiswa kokufunxa okuphuculweyo, okwenza umatshini ulungelelaniswe neentlobo ezahlukeneyo zamaza, ukusuka kwiikristale ezibonakalayo ukuya kwi-opaque ceramics.

4. Isantya esiphezulu, i-High-Precision-Precision Motion Control
Ngeenketho zeenjini ze-linear kunye ne-direct-drive motors, inkqubo isekela iimfuno eziphezulu ngaphandle kokuphazamisa ukuchaneka. Intshukumo ye-axis emihlanu iqhubela phambili ukwenza ipateni entsonkothileyo kunye nokusikwa kwamacala amaninzi.

5. Uyilo lweModyuli kunye neScalable
Abasebenzisi banokulungelelanisa ulungelelwaniso lwenkqubo olusekwe kwiimfuno zesicelo-ukusuka kwiprototyping esekwe kwilebhu ukuya kwimveliso-eyenziwe ifaneleke kuyo yonke iR&D kunye nemimandla yoshishino.

IiNdawo zokuSebenza

IiSemiconductors zesiZukulwana sesithathu:
Ifanelekile kwi-SiC kunye ne-GaN wafers, inkqubo yenza ukudayiva, ukuthunga, kunye nokusika ngokunyaniseka okukhethekileyo.

Idayimani kunye ne-Oxide Semiconductor Machining:
Isetyenziselwa ukusika kunye nokugrumba izinto ezinobunzima obuphezulu njengedayimani enye yekristale kunye ne-Ga₂O₃, ngaphandle kwe-carbonization okanye i-thermal deformation.

Amacandelo e-Aerospace aPhakamileyo:
Ixhasa ukubunjwa kolwakhiwo lwee-composites ze-ceramic ezinobunzima obuphezulu kunye ne-superalloys ye-jet injini kunye nezixhobo zesathelayithi.

I-Photovoltaic kunye ne-Ceramic Substrates:
Yenza i-burr-free ukusika ii-wafers ezibhityileyo kunye ne-LTCC substrates, kubandakanywa nemingxunya ephumayo kunye ne-slot milling yokudibanisa.

I-scintillators kunye ne-Optical Components:
Igcina ukugudiswa komphezulu kunye nokuhanjiswa kwezinto ezibonakalayo ezibuthathaka njenge-Ce: YAG, LSO, kunye nezinye.

Inkcazo

Uphawu	Inkcazo
Umthombo weLaser	DPSS Nd:YAG
Iinketho zeWavelength	532nm / 1064nm
Amanqanaba ombane	50/100/200 Watts
Ukuchaneka	±5μm
Sika Ububanzi	Umxinwa njenge 20μm
Indawo eChaphazeleke bubushushu	≤5μm
Uhlobo lweSindululo	Linear / Direct Drive
Izixhobo ezixhaswayo	SiC, GaN, Diamond, Ga₂O₃, njl.

Kutheni Ukhetha Le Sistim?

● Ukuphelisa imiba eqhelekileyo yelaser efana nokuqhekeka kwe-thermal kunye nokuqhekeka komphetho
● Ukuphucula isivuno kunye nokuhambelana kwezinto ezixabisa kakhulu
● Ukulungelelaniswa nokusetyenziswa kolingelo nakwimizi-mveliso
● Iqonga lobungqina bexesha elizayo lenzululwazi yemathiriyeli

Q&A

I-Q1: Ziziphi izinto ezinokuthi le nkqubo yenkqubo?
A: Inkqubo yenzelwe ngokukodwa izinto ezinzima kunye ne-brittle eziphezulu zexabiso. Iyakwazi ukucubungula ngokufanelekileyo i-silicon carbide (SiC), i-gallium nitride (i-GaN), idayimane, i-gallium oxide (i-Ga₂O₃), i-LTCC substrates, i-aerospace composite, i-photovoltaic wafers, kunye neekristale ze-scintillator ezifana ne-Ce: YAG okanye i-LSO.

I-Q2: Isebenza njani iteknoloji yelaser ekhokelwa ngamanzi?
A: Isebenzisa i-microjet yoxinzelelo oluphezulu lwamanzi ukukhokela umqadi we-laser ngokubonakaliswa kwangaphakathi okupheleleyo, ukuhambisa ngokufanelekileyo amandla e-laser ngokusasazwa okuncinci. Oku kuqinisekisa ukugxilwa kwe-ultra-fine, umthwalo ophantsi we-thermal, kunye nokunciphisa okuchanekileyo kunye nobubanzi bomgca ukuya kwi-20μm.

I-Q3: Luluphi ulungelelwaniso lwamandla e-laser olukhoyo?
A: Abathengi banokukhetha kwi-50W, i-100W, kunye ne-200W iinketho zamandla e-laser ngokuxhomekeke kwisantya sokusebenza kunye neemfuno zesisombululo. Zonke iinketho zigcina uzinzo oluphezulu lwe-beam kunye nokuphindaphinda.