IMagnesium enye yekristale Mg wafer DSP SSP Ukuqhelaniswa

Inkcazelo emfutshane:

I-Magnesium (Mg) i-metal substrate density iphantsi, malunga ne-2/3 ye-aluminium, iyona nto ilula kwiintsimbi ezininzi. Amandla alungileyo kunye nokuqina, ukuqina kufutshane ne-aluminium alloy, kunokwenziwa kwiindawo ezilula zesakhiwo. Ukuqhuba kakuhle kwe-thermal, i-coefficient conduction conduction yi-1.1 amaxesha e-aluminium. Ukusebenza okugqwesileyo kokusebenza, kunokusebenzisa iindlela ezahlukeneyo zokubumba isinyithi. Ixabiso liphantsi kakhulu, kwaye yenye yeentsimbi ezikhaphukhaphu ezisetyenziswa kakhulu kubunjineli. I-oxidized ngokulula kwaye ifuna unyango olungaphezulu ukuze kuphuculwe ukuxhathisa ukubola. Ngomsebenzi wayo ogqwesileyo wokukhanya, ukuhanjiswa kakuhle kwe-thermal kunye neendleko zoqoqosho, i-magnesium metal substrate inoluhlu olubanzi lwezicelo kwiimoto, iisekethe ze-elektroniki, izikhongozeli kunye nezinye iindawo ezininzi.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Inkcazo

Ezinye iimpawu ze-magnesium enye yekristale substrate. Uxinzelelo oluphantsi, malunga ne-2/3 ye-aluminiyam, yeyona nto ilula kwiintsimbi ezininzi.
Amandla alungileyo kunye nokuqina, ukuqina kufutshane ne-aluminium alloy, kunokwenziwa kwiindawo ezilula zesakhiwo.
Ukuqhuba kakuhle kwe-thermal, i-coefficient conduction conduction yi-1.1 amaxesha e-aluminium.
Ukusebenza okugqwesileyo kokusebenza, kunokusebenzisa iindlela ezahlukeneyo zokubumba isinyithi.
Ixabiso liphantsi kakhulu, kwaye yenye yeentsimbi ezikhaphukhaphu ezisetyenziswa kakhulu kubunjineli.
I-oxidized ngokulula kwaye ifuna unyango olungaphezulu ukuze kuphuculwe ukuxhathisa ukubola.
Ezinye iindlela zokusetyenziswa kwe-magnesium enye yekristale substrate.
I-1.Izicelo ezilula: Isetyenziswe kwiindawo ezahlukeneyo zesakhiwo kunye neegobolondo kwiimoto, i-aerospace kunye nezinye iindawo. Ukwenziwa kweemeko zombane zabathengi ezifana neeselfowuni kunye neelaptops. Isetyenziselwa ukwenziwa kweemveliso ezikhaphukhaphu ezifana nezixhobo zoomatshini kunye nezixhobo.

I-2.Ibhodi yesekethe ye-elektroniki: I-metal substrate material esetyenziswa njengebhodi yesekethe eprintiweyo (PCB). Ngenxa yokuhanjiswa kwayo kakuhle kwe-thermal, inokusetyenziswa njenge-substrate yokupholisa kwizixhobo zombane zamandla aphezulu. Isetyenziswa kwintsimi yamandla ombane afana neebhetri kunye neeseli zelanga.

I-3.Iiqulathi kunye nezicelo zokugcina kunye nokuthutha: Ukuveliswa kwezixhobo zetsimbi ezikhaphukhaphu, iitanki zokugcina kunye nezinye izixhobo zokugcina kunye nokuthutha. Ifakwe kwiisilinda zegesi ezinoxinzelelo oluphezulu, iitanki zokugcina imichiza kunye neminye imimandla ekhaphukhaphu.

Imveliso ye-4.Craft: Isetyenziselwa ukwenza ubugcisa, imihlobiso kunye nezinye iimveliso zetsimbi ezikhanyayo. Ngokusebenza kwayo kakuhle, inokuvelisa iintlobo ezahlukeneyo zeemilo ezinzima.
Sinokwenza ngokwezifiso iinkcukacha ezahlukeneyo, ubukhulu kunye neemilo zeMagnesium Single crystal substrate ngokweemfuno ezithile zabathengi.