I-LNOI Wafer (i-Lithium Niobate kwi-Insulator) kuNxibelelwano ngoNxibelelwano oluva i-Electro-Optic ephezulu
Idayagram eneenkcukacha


Isishwankathelo
Ngaphakathi kwebhokisi ye-wafer kukho iigrooves ezilinganayo, imilinganiselo yazo ifana ngokungqongqo ukuxhasa amacala amabini e-wafer. Ibhokisi yekristale ngokubanzi yenziwe ngezinto zeplastiki eziguquguqukayo zePP ezikwaziyo ukumelana nobushushu, ukunxiba kunye nombane omileyo. Imibala eyahlukeneyo yezongezo isetyenziselwa ukwahlula amacandelo enkqubo yesinyithi kwimveliso ye-semiconductor. Ngenxa yobungakanani obuncinci beqhosha le-semiconductors, iipateni ezixineneyo, kunye neemfuno ezingqongqo kakhulu zobungakanani bamasuntswana kwimveliso, ibhokisi ye-wafer kufuneka iqinisekiswe indawo ecocekileyo ukuze iqhagamshele kwi-microenvironment box reaction cavity yoomatshini abahlukeneyo bokuvelisa.
Indlela yokwenza
Ukwenziwa kwee-wafers ze-LNOI kunamanyathelo athile achanekileyo:
Inyathelo 1: Ukufakelwa kwe-Helium IonIiyoni zeHelium zingeniswa kwikristale ye-LN eninzi kusetyenziswa i-ion implanter. Ezi ion zihlala kubunzulu obuthile, zenza inqwelomoya ebuthathaka eya kuthi ekugqibeleni iququzelele ukuhlukaniswa kwefilimu.
Inyathelo lesi-2: Ukuqulunqwa kwesiseko seSubstrateI-silicon eyahlukileyo okanye i-wafer ye-LN i-oxidized okanye ifakwe nge-SiO2 isebenzisa i-PECVD okanye i-oxidation ye-thermal. Umphezulu wayo ongaphezulu ucwangciswe ukulungiselela ukudibanisa okufanelekileyo.
Inyathelo lesi-3: Ukudityaniswa kwe-LN kwi-SubstrateIkristale ye-LN emiliselwe nge-ion ijingiwe kwaye incamathele kwisiseko se-wafer usebenzisa i-wafer bonding ngokuthe ngqo. Kwizicwangciso zophando, i-benzocyclobutene (BCB) ingasetyenziselwa njengento yokubambelela ukwenza lula ukudibanisa phantsi kweemeko ezinqabileyo.
Inyathelo lesi-4: Unyango lwe-Thermal kunye nokwahlulwa kweFilimuUkufakwa kwe-Anealing kuvula ukwakheka kweqamza kubunzulu obufakelweyo, okwenza ukwahlulwa kwefilimu ebhityileyo (umaleko ophezulu we-LN) ukusuka kubuninzi. Amandla omatshini asetyenziselwa ukugqiba ukukhutshwa.
Inyathelo lesi-5: Ukumenyezwa komphezuluI-Chemical Mechanical Polishing (CMP) isetyenziselwa ukugudisa umphezulu we-LN, ukuphucula umgangatho we-optical kunye nemveliso yesixhobo.
Iiparamitha zobuGcisa
Izinto eziphathekayo | I-Optical IBanga LiNbO3 wafes (Mhlophe or Mnyama) | |
Curie Temp | 1142±0.7℃ | |
Ukusika Iengile | X/Y/Z njl | |
Ububanzi/ubungakanani | 2”/3”/4” ±0.03mm | |
ITol(±) | <0.20 mm ± 0.005mm | |
Ukutyeba | 0.18 ~ 0.5mm okanye ngaphezulu | |
Amabanga aphantsi Umcaba | 16mm/22mm/32mm | |
TTV | <3μm | |
Ukuqubuda | -30 | |
I-Wap | <40μm | |
Ukuqhelaniswa Umcaba | Zonke ziyafumaneka | |
Umphezulu Uhlobo | Icala elinye likhazimlisiwe(SSP)/Amacala aMabini akhazimlisiwe(DSP) | |
Ilungisiwe icala Ra | <0.5nm | |
S/D | 20/10 | |
Edge Iikhrayitheriya | R=0.2mm C-uhlobo or Inkunzi yenkomo | |
Umgangatho | Mahala of amaqamza (amaqamza kwaye ukuqukwa) | |
I-Optical idliwe | Mg/Fe/Zn/MgO njl ngenxa ukubona ibakala LN amaqebengwana ngokwe uceliwe | |
Wafer Umphezulu Iikhrayitheriya | Isalathiso sokuqhafaza | No=2.2878/Ne=2.2033 @632nm wavelength/prism coupler method. |
Usulelo, | Akukho nanye | |
Amacandelo c>0.3μ m | <=30 | |
Ukukrwela, ukuChipping | Akukho nanye | |
Isiphene | Akukho zintanda, imikrwelo, amanqaku esarha, amabala | |
Ukupakishwa | Ibhokisi le-Qty / Wafer | 25pcs kwibhokisi nganye |
Sebenzisa Amatyala
Ngenxa yokuguquguquka kwayo kunye nokusebenza, i-LNOI isetyenziswa kuwo wonke amashishini amaninzi:
Iifotoni:Iimodyuli ezidibeneyo, ii-multiplexers, kunye neesekethe zefotonic.
RF/Acoustics:Iimodyuli zeAcousto-optic, izihluzi zeRF.
I-Quantum Computing:I-nonlinear frequency mixers kunye ne-photon-pair generators.
Ukhuselo kunye ne-Aerospace:Ilahleko ephantsi ye-optical gyros, izixhobo zokutshintsha rhoqo.
Izixhobo zonyango:I-Optical biosensors kunye ne-high-frequency signal probes.
FAQ
Umbuzo: Kutheni i-LNOI ikhethwa ngaphezu kwe-SOI kwiinkqubo zamehlo?
A:I-LNOI inee-coefficients eziphezulu ze-electro-optic kunye noluhlu olubanzi lwe-transparency, eyenza ukusebenza okuphezulu kwiisekethe ze-photonic.
Umbuzo: Ngaba i-CMP inyanzelekile emva kokwahlula?
A:Ewe. Umphandle we-LN oveziweyo urhabaxa emva kokunqunyulwa kwe-ion kwaye kufuneka upolishwe ukuze uhlangabezane neenkcukacha zomgangatho wokubona.
Umbuzo: Ngowuphi ubungakanani besayizi ye-wafer ephezulu ekhoyo?
A:Ii-wafers zeLNOI zorhwebo ikakhulu zi-3" kunye ne-4", nangona abanye ababoneleli bephuhlisa ii-6" ezahlukeneyo.
Umbuzo: Ngaba i-LN layer ingaphinda isetyenziswe emva kokwahlulahlula?
A:I-crystal yesiseko inokuphinda iphuculwe kwaye isetyenziswe kwakhona ngamaxesha amaninzi, nangona umgangatho unokuhla emva kwemijikelezo emininzi.
Q: Ngaba ii-wafers ze-LNOI ziyahambelana nokusetyenzwa kwe-CMOS?
A:Ewe, ziyilelwe ukuba zihambelane neenkqubo eziqhelekileyo zokwenziwa kwe-semiconductor, ngakumbi xa kusetyenziswa i-silicon substrates.