Izixhobo zokusika i-infrared Picosecond Dual-Platform Laser Cutting ze-Optical Glass/Quartz/Sapphire Processing

Inkcazo emfutshane:

Isishwankathelo soBugcisa:
Inkqubo yokusika iLaser yeglasi ye-Infrared Picosecond Dual-Station sisisombululo esisemgangathweni wemizi-mveliso esenzelwe ngokukodwa umatshini wokulungisa ngokuchanekileyo izinto ezibonakala zibuthathaka. Ixhotyiswe ngomthombo welaser ye-picosecond ye-infrared ye-1064nm (ububanzi be-pulse <15ps) kunye noyilo lweqonga le-dual-station, le nkqubo inika ukusebenza kakuhle kokucubungula okuphindwe kabini, ivumela umatshini ongenasiphako weeglasi ezibonakalayo (umz., i-BK7, i-fused silica), iikristale ze-quartz, kunye ne-sapphire (α-Al₂O₃) ezinobunzima obufikelela kwi-Mohs 9.
Xa kuthelekiswa ne-nanosecond lasers zesiqhelo okanye iindlela zokusika ngoomatshini, i-Infrared Picosecond Dual-Station Glass Laser Cutting System ifikelela kububanzi be-micron-level kerf (uluhlu oluqhelekileyo: 20–50μm) ngendlela "yokukhupha okubandayo", kunye nendawo echaphazeleka bubushushu enomda we-<5μm. Imo yokusebenza ye-dual-station etshintshanayo yonyusa ukusetyenziswa kwezixhobo nge-70%, ngelixa inkqubo yokulungelelanisa umbono (ukuchaneka kokubeka i-CCD: ±2μm) iyenza ilungele imveliso enkulu yezixhobo zeglasi ezigobileyo ze-3D (umz., iglasi yesiciko se-smartphone, iilensi ze-smartwatch) kushishino lwe-elektroniki lwabathengi. Le nkqubo ibandakanya iimodyuli zokulayisha/zokukhulula ezizenzekelayo, ezixhasa imveliso eqhubekayo yama-24/7.

Thumela i-imeyile kuthi

Iimbonakalo

Ipharamitha ephambili

Uhlobo lweLaser	I-Infrared Picosecond
Ubungakanani bePlatform	700×1200 (mm)
	900×1400 (mm)
Ukusika Ubukhulu	0.03-80 (mm)
Isantya sokusika	0-1000 (mm/s)
Ukwaphuka Komphetho Okusikayo	<0.01 (mm)
Qaphela: Ubungakanani beplatifomu bungenziwa ngokwezifiso.

Ezona mpawu

1. Itekhnoloji yeLaser yeUltrafast:
· Iipulses ezimfutshane zezinga lePicosecond (10⁻¹²s) ezidityaniswe netekhnoloji yokulungisa iMOPA zifikelela kubuninzi bamandla obuphezulu >10¹² W/cm².
· Ububanzi be-infrared (1064nm) bungena kwizinto ezibonakalayo ngokufunxwa okungeyomgca, nto leyo ethintela ukufudunyezwa komphezulu.
· Inkqubo ye-optical egxile kwizinto ezininzi ivelisa iindawo ezine zokucubungula ezizimeleyo ngaxeshanye.

2. Inkqubo yokuvumelanisa yeZitishi ezibini:
· Izigaba zemoto ezizii-motor ezizii-linear ezimbini ezisekelwe kwi-granite (ukuchaneka kokubeka: ± 1μm).
· Ixesha lokutshintsha isikhululo <0.8s, okuvumela imisebenzi "yokucwangcisa-ukulayisha/ukukhulula" ngaxeshanye.
· Ulawulo lobushushu oluzimeleyo (23±0.5°C) ngesitishi ngasinye luqinisekisa uzinzo lwexesha elide lomatshini.

3. Ulawulo lweNkqubo yoBukrelekrele:
· Isiseko sedatha sezinto ezidityanisiweyo (iiparameter zeglasi ezingaphezu kwama-200) zokudibanisa iiparameter ngokuzenzekelayo.
· Ukubeka iliso kwiplasma ngexesha langempela kulungisa amandla elaser ngokuguquguqukayo (isisombululo sohlengahlengiso: 0.1mJ).
· Ukhuseleko lwekhethini lomoya lunciphisa ukuqhekeka okuncinci komphetho (<3μm).
Kwimeko eqhelekileyo yokufaka i-sapphire wafer dicing enobukhulu obuyi-0.5mm, inkqubo ifikelela kwisantya sokusika se-300mm/s kunye nobukhulu be-chipping <10μm, nto leyo ebonisa ukuphuculwa kokusebenza kakuhle okuphindwe kahlanu kuneendlela zemveli.

Iingenelo zokucubungula

1. Inkqubo yokusika kunye nokwahlulahlula izitishi ezimbini ezidibeneyo ukuze isebenze ngokuguquguqukayo;
2. Ukulungiswa kwejiyometri ezintsonkothileyo ngesantya esiphezulu kuphucula ukusebenza kakuhle kokuguqulwa kwenkqubo;
3. Imiphetho yokusika engenamatheli ene-chipping encinci (<50μm) kunye nokuphathwa okukhuselekileyo komqhubi;
4. Utshintsho olungenamthungo phakathi kweenkcukacha zemveliso kunye nokusebenza okubonakalayo;
5.Iindleko zokusebenza eziphantsi, amazinga aphezulu emveliso, inkqubo engenazo izinto ezisetyenzisiweyo kwaye engenazo ungcoliseko;
6. Akukho kuveliswa kwenkunkuma, ulwelo okanye amanzi amdaka aqinisekisiweyo ngomgangatho ofanelekileyo;

Umboniso wesampulu

Izixhobo zokusika iglasi ye-laser ye-infrared picosecond ezimbini-platform 5

Izicelo eziqhelekileyo

1. Ukuveliswa kwee-elektroniki zabathengi:
· Ukusikwa kweglasi yesiciko se-3D yefowuni ephathwayo ngokuchanekileyo (ukuchaneka kwe-R-angle: ± 0.01mm).
· Ukubhoboza imingxunya emincinci kwiilensi zewotshi yesafire (ubuncinci bomngxuma: Ø0.3mm).
· Ukugqitywa kweendawo zokudlulisa iglasi ye-optical kwiikhamera ezingaphantsi kwesibonisi.

2. Imveliso yeCandelo le-Optical:
· Umatshini wokulungisa izinto ezincinci kwiilensi ze-AR/VR (ubungakanani beempawu ≥20μm).
· Ukusikwa kweeprism ze-quartz ezigobileyo kwii-laser collimators (ukunyamezelana kwe-angular: ±15").
· Ukuyila iprofayili yezihluzi ze-infrared (i-cutting taper <0.5°).

3. Ukupakisha i-semiconductor:
· Ukulungiswa kweglasi ngokusebenzisa (TGV) kwinqanaba le-wafer (umlinganiselo womphezulu yi-1:10).
· Ukukrola imijelo emincinci kwi-substrates zeglasi zeetships ze-microfluidic (Ra <0.1μm).
· Ukunciphisa rhoqo ii-resonators ze-quartz ze-MEMS.

Kwimveliso yeefestile ze-optical ze-LiDAR zeemoto, le nkqubo ivumela ukusika iglasi ye-quartz enobukhulu obuyi-2mm kunye nokuma okuthe nkqo kwe-89.5±0.3°, okwanelisa iimfuno zovavanyo lokungcangcazela lwe-automotive-grade.

Izicelo zeNkqubo

Yenzelwe ngokukodwa ukusika ngokuchanekileyo izinto ezibuthathaka/eziqinileyo kuquka:
1. Iiglasi eziqhelekileyo kunye neeglasi ezibonakalayo (BK7, i-fused silica);
2. Iikristale zeQuartz kunye nesubstrates zesafire;
3. Izihluzi zeglasi ezithambileyo kunye nezibonakalayo
4. Izinto ezisetyenziswa kwisipili
Iyakwazi ukusika i-contour kunye nokubhola imingxunya yangaphakathi ngokuchanekileyo (ubuncinci Ø0.3mm)

Umgaqo wokusika ngeLaser

I-laser ivelisa ii-pulses ezimfutshane kakhulu ezinamandla aphezulu kakhulu asebenzisana nomsebenzi ngaphakathi kwe-femtosecond-to-picosecond timescales. Ngexesha lokusasazeka kwezinto, umqadi uphazamisa isakhiwo sawo soxinzelelo ukuze wenze imingxunya ye-filamentation ye-micron-scale. Ukwahlulwa kwemingxuma okwenziwe ngcono kuvelisa ii-micro-cracks ezilawulwayo, ezidityaniswa netekhnoloji yokuqhekeka ukuze kufezekiswe ukwahlukana ngokuchanekileyo.

Iingenelo zokusika iLaser

1.Ukuhlanganiswa okuphezulu kwe-automation (ukusebenza okudibeneyo kokusika/ukuqhekeza) kunye nokusetyenziswa kwamandla aphantsi kunye nokusebenza okulula;
2. Ukucubungula okungaqhagamshelaniyo kwenza ukuba izakhono ezikhethekileyo zingafumaneki ngeendlela eziqhelekileyo;
3. Ukusebenza ngaphandle kokusetyenziswa kunciphisa iindleko zokusebenza kwaye kuphucula uzinzo lokusingqongileyo;
4. Ukuchaneka okuphezulu kakhulu nge-engile ye-taper ye-zero kunye nokususwa komonakalo we-workpiece yesibini;
I-XKH inikezela ngeenkonzo ezibanzi zokwenza ngokwezifiso iinkqubo zethu zokusika i-laser, kubandakanya uqwalaselo lweqonga elenziwe ngokwezifiso, uphuhliso lweeparameter zenkqubo ezikhethekileyo, kunye nezisombululo ezithile zesicelo ukuhlangabezana neemfuno zemveliso ezizodwa kumashishini ahlukeneyo.