Isixhobo sokusika iLaser ye-Infrared Picosecond Dual-Platform yeLaser yeOptical Glass/Quartz/Sapphire Processing

Inkcazelo emfutshane:

IsiShwankathelo soBugcisa:
I-Infrared Picosecond Dual-Station ye-Laser Cutting System sisisombululo sodidi lwemizi-mveliso eyenzelwe ngokukodwa ukuchaneka kwemathiriyeli ebonakala ngathi yibrittle. Ixhotyiswe nge-1064nm infrared picosecond laser source (ububanzi bepulse <15ps) kunye noyilo lweqonga elinezitishi ezimbini, le nkqubo inikezela ngokuphinda-phindwe kabini kokusebenza kakuhle, ivumela ukwenziwa ngokungenasiphako kweeglasi zamehlo (umzekelo, i-BK7, i-silica edibeneyo), iikristale zequartz, kunye nesafire (α-up ukuya kwi-Al₃)
Xa kuthelekiswa neendlela eziqhelekileyo ze-nanosecond lasers okanye iindlela zokusika ngoomatshini, i-Infrared Picosecond Dual-Station Glass Laser Cutting System ifikelela kwi-micron-level kerf widths (uluhlu oluqhelekileyo: 20-50μm) ngokusebenzisa "i-cold ablation", kunye nommandla ochaphazelekayo ukushisa olinganiselwe kwi-<5μm. Imowudi yokusebenza yezikhululo ezimbini ezitshintshanayo yonyusa ukusetyenziswa kwesixhobo nge-70%, ngelixa inkqubo yolungelelwaniso lombono wobunikazi (i-CCD yokuchaneka kokubeka indawo: ± 2μm) iyenza ilungele ukuveliswa kobunzima bezinto zeglasi ezigobileyo ze-3D (umzekelo, iglasi yekhava ye-smartphone, iilensi ze-smartwatch) kushishino lwe-elektroniki yabathengi. Inkqubo ibandakanya iimodyuli zokulayisha / ukukhulula ngokuzenzekelayo, ukuxhasa i-24/7 imveliso eqhubekayo.

Thumela i-imeyile kuthi

Iimbonakalo

Eyona parameter

Uhlobo lweLaser	I-Infrared Picosecond
Ubungakanani beqonga	700×1200 (mm)
	900×1400 (mm)
Ukusika Ukutyeba	0.03-80 (mm)
Ukusika isantya	0-1000 (mm/s)
Ukuqhekeka komphetho	<0.01 (mm)
Qaphela: Ubungakanani beqonga bungenziwa ngokwezifiso.

Ezona mpawu

1.Itekhnoloji yeLaser ekhawulezayo:
· Inqanaba lePicosecond-level pulses short (10⁻¹²s) kudityaniswe ne-MOPA tuning technology ifikelela incopho yoxinaniso lwamandla >10¹² W/cm².
· I-infrared wavelength (1064nm) igqobhoza imathiriyeli ecacileyo ngokufunxwa okungahambelaniyo, ukuthintela ukutsalwa komhlaba.
· Inkqubo ye-optical egxininise kakhulu yobunini ivelisa iindawo ezine ezizimeleyo zokusetyenzwa ngaxeshanye.

2.ISitishi esiNxibelelaniso seNkqubo yokuNxibelelana:
· Isiseko seGranite-isiseko senqanaba leenjini ezimbini ezilandelelanayo (ukuchaneka kokubeka: ±1μm).
· Ixesha lokutshintsha isitishi <0.8s, ivumela imisebenzi ehambelanayo "yokulayisha-ukulayisha / ukukhulula".
· Ulawulo oluzimeleyo lobushushu (23±0.5°C) kwisikhululo ngasinye luqinisekisa uzinzo lwexesha elide lomatshini.

3.Ulawulo Lwenkqubo Ekrelekrele:
· Isiseko sedatha ehlanganisiweyo (200+ iiparamitha zeglasi) zokuthelekisa iparamitha ezenzekelayo.
· Ixesha langempela lokujongwa kweplasma kuguqula amandla e-laser (ukulungiswa kokulungiswa: 0.1mJ).
· Ukukhuselwa komkhusane womoya kunciphisa i-edge micro-cracks (<3μm).
Kwimeko yesicelo esiqhelekileyo esibandakanya i-0.5mm-thick sapphire wafer dicing, inkqubo ifezekisa isantya sokusika i-300mm / s kunye nemilinganiselo ye-chipping <10μm, emele i-5x yokuphucula ukusebenza kakuhle kwiindlela zendabuko.

Ukulungiswa kwezinto eziluncedo

I-1.I-Integrated dual-station yokusika kunye nenkqubo yokwahlula ukuze usebenze ngokuguquguqukayo;
2.Isantya esiphezulu somatshini wejiyometri entsonkothileyo yongeza inkqubo yoguqulo olusebenzayo;
I-3.I-Taper-free cutting edges kunye ne-chipping encinci (<50μm) kunye nokuphathwa okukhuselekileyo komqhubi;
I-4.Utshintsho olungenamthungo phakathi kweenkcazo zemveliso kunye nokusebenza okubonakalayo;
5.Iindleko zokusebenza eziphantsi, izinga eliphezulu lesivuno, inkqubo engasetyenziswayo kunye nengenangcoliseko;
6.Ukungabikho kokuveliswa kwe-slag, ulwelo olulahlwayo okanye amanzi amdaka anemfezeko eqinisekisiweyo yomphezulu;

Umboniso wesampuli

Isixhobo sokusika i-infrared picosecond ezimbini-platform yeglasi ye-laser 5

Usetyenziso oluqhelekileyo

1.Ukwenziwa koMthengi we-Electronics:
· Ukusikwa kwecontour echanekileyo ye-smartphone ye-3D yeglasi yesigqubuthelo (ukuchaneka kwe-R-engile: ± 0.01mm).
· Ukugrumba umngxuma omncinci kwiilensi zesafire (ubuncinci bokungena: Ø0.3mm).
· Ukugqitywa kweezowuni zegilasi yamehlo kwiikhamera ezibonisa ngaphantsi.

2.IMveliso yecandelo leOptical:
· I-Microstructure machining ye-AR/VR lens arrays (ubukhulu besici ≥20μm).
· I-angled cut of quartz prisms ye-laser collimators (ukunyamezela i-angular: ± 15").
· Ukubunjwa kweprofayili yezihluzi ze-infrared (i-taper yokusika <0.5 °).

3.Ukupakishwa kweSemiconductor:
· Ukusetyenzwa kweglasi nge-(TGV) kwinqanaba le-wafer (i-aspect ratio 1:10).
· I-Microchannel etching kwi-substrates yeglasi ye-microfluidic chips (Ra <0.1μm).
· Ukucutshungulwa rhoqo kwe-MEMS quartz resonators.

Ukwenziwa kwefestile ye-LiDAR yemoto ye-Optical window, inkqubo yenza ukuba i-contour isikwe kwiglasi ye-quartz engqindilili ye-2mm ene-perpendicularity ye-89.5 ± 0.3 °, ihlangabezana neemfuno zovavanyo lwe-auto-grade vibration.

Inkqubo yezicelo

Yenzelwe ngokukodwa ukusika izinto ezinqabileyo / ezinzima ezibandakanya:
I-1.Iglasi eqhelekileyo kunye neeglasi ze-optical (BK7, i-silica edibeneyo);
2. Iikristale zequartz & nesafire substrates;
3. Iglasi epholileyo kunye nezihluzo zamehlo
4. I-Mirror substrates
Iyakwazi ukusika i-contour kunye nokuchaneka komngxuma wangaphakathi wokomba (ubuncinci Ø0.3mm)

Laser Cutting Principle

I-laser ivelisa i-ultrashort pulses enamandla aphezulu kakhulu asebenzisana ne-workpiece ngaphakathi kwe-femtosecond-to-picosecond timescales. Ngexesha lokusasaza ngezinto eziphathekayo, umqadi uphazamisa isakhiwo sayo soxinzelelo ukwenza imingxuma ye-filamentation micron-scale. Isithuba semingxuma esilungiselelweyo sivelisa iintanda ezincinci ezilawulwayo, ezidibanisa netekhnoloji yokucanda ukufezekisa ukwahlula okuchanekileyo.

Laser Cutting Izinto eziluncedo

I-1.Ukuhlanganiswa okuphezulu okuzenzekelayo (okudibeneyo ukusika / ukucanda ukusebenza) kunye nokusetyenziswa kwamandla aphantsi kunye nokusebenza lula;
I-2.Ukucubungula okungekho qhagamshelwano kwenza ukuba amandla awodwa angafumaneki ngeendlela eziqhelekileyo;
I-3.I-Consumable-free operation inciphisa iindleko zokuqhuba kwaye iphakamisa ukugcinwa kokusingqongileyo;
4.Ukuchaneka okuphezulu kunye ne-zero taper angle kunye nokupheliswa komonakalo we-workpiece yesibini;
I-XKH ibonelela ngeenkonzo ezibanzi zokwenziwa ngokwezifiso kwiinkqubo zethu zokusika i-laser, kubandakanywa ulungelelwaniso lweqonga olulungiselelweyo, uphuhliso lwenkqubo ekhethekileyo yeparamitha, kunye nezisombululo ezithe ngqo kwisicelo ukuhlangabezana neemfuno ezizodwa zemveliso kumashishini ahlukeneyo.