Ukuchaneka okuphezulu umatshini wokomba welaser wesafire ye-ceramic imathiriyeli enqabileyo ethwele umbhobho wokugrumba
Intshayelelo yeMveliso
Izinto ezisebenzayo: Ifanelekile kwintsimbi yendalo, i-polycrystalline steel, i-ruby, isafire, ithusi, i-ceramics, i-rhenium, insimbi engenasici, i-carbon steel, i-alloy steel kunye nezinye izinto ezinzima kakhulu, izinto ezichasene nobushushu obuphezulu kwiimilo ezahlukeneyo, ububanzi, ubunzulu kunye nokugaya i-taper.
Iimeko zokusebenza
1. Ilungele ukusebenza phantsi kobushushu be-ambient ye-18℃-28℃ kunye nokufuma okuhambelana ne-30% -60%.
2. Ifanelekile unikezelo lwamandla amabini /220V/50HZ/10A.
3. Qwalasela iiplagi ezihlangabezana neemfuno zemigangatho efanelekileyo yaseTshayina. Ukuba akukho plagi enjalo, kufuneka kunikwe iadaptha efanelekileyo.
4. Isetyenziswa kakhulu kumzobo wedayimani wocingo lokufa, ukucotha kocingo lokufa, umngxuma we-muffler, umngxuma yenaliti, ukuthwala igugu, umbhobho kunye namanye amashishini okugqobhoza.
Iiparamitha zobugcisa
Igama | Idatha | Umsebenzi |
Ubude bemaza obubonayo | 354.7nm okanye 355nm | Imisela ukuhanjiswa kwamandla kunye nomthamo wokungena we-laser beam, kwaye ichaphazela izinga lokufunxa izinto kunye nesiphumo sokucubungula. |
Amandla emveliso aphakathi | 10.0 / 12.0/15.0 w@40khz | Ukuchaphazela ukusebenza kakuhle kunye nesantya sokubetha, amandla aphezulu, ngokukhawuleza isantya sokucubungula. |
Ububanzi be-Pulse | Ngaphantsi kwe-20ns@40KHz | Ububanzi be-pulse obufutshane bunciphisa indawo echaphazelekayo yobushushu, buphucula ukuchaneka kwe-machining, kunye nokuphepha umonakalo we-thermal wezinto eziphathekayo. |
Isantya sokuphindaphinda i-Pulse | 10-200KHz | Ukumisela ukuhanjiswa kwamaza kunye nokusebenza kakuhle kwe-laser beam, kokukhona i-frequency ephezulu, isantya sokubetha ngokukhawuleza. |
umgangatho we-optical beam | M²<1.2 | Imiqadi ekumgangatho ophezulu iqinisekisa ukuchaneka kokomba kunye nomgangatho womphetho, ukunciphisa ukulahleka kwamandla. |
Idayamitha yendawo | 0.8±0.1mm | Qinisekisa ubuncinci bokuvula kunye nokuchaneka kwe-machining, i-spot encinci, encinci i-aperture, iphakamileyo yokuchaneka. |
umqadi-ukwahlukana engile | Ngaphezulu kwe-90% | Ikhono lokugxila kunye nobunzulu bokubetha kwe-laser beam kuyachaphazeleka. Incinci i-Angle yokuhlukana, inamandla amandla okugxila. |
Ibeam ellipticity | Ngaphantsi kwe-3% ye-RMS | Ubuncinci be-ellipticity, ngokusondeleyo ukumila komngxuma kwisangqa, kuphezulu ukuchaneka komatshini. |
Ukusetyenzwa kwamandla
Oomatshini bokugrumba be-laser abachanekileyo banamandla okusebenza kwaye banokubhoboza imingxuma ukusuka kwi-microns ezimbalwa ukuya kwiimilimitha ezimbalwa ububanzi, kwaye imilo, ubukhulu, indawo kunye ne-Angle yemingxuma inokulawulwa ngokuchanekileyo. Ngelo xesha, izixhobo zixhasa i-360-degree-round-round drilling, enokuthi ihlangabezane neemfuno zokugaya iintlobo ezahlukeneyo zemilo kunye nezakhiwo. Ukongeza, umatshini wokuchaneka we-laser ochaneke kakhulu unomgangatho obalaseleyo wecala kunye nokugqitywa komphezulu, imingxuma esetyenziweyo ayinayo i-burr, akukho mphetho wokunyibilika, kwaye umngxuma womngxuma ugudile kwaye uthe tyaba.
Ukusetyenziswa komatshini wokubetha welaser ochanekileyo:
1. Umzi mveliso wombane:
Ibhodi yesekethe eprintiweyo (PCB) : isetyenziselwa ukusetyenzwa kwe-microhole ukuhlangabezana neemfuno ze-high-density interconnection.
Ukupakishwa kweSemiconductor: Punch imingxuma kwii-wafers kunye nempahla yokupakisha ukuphucula ukuxinana kwephakheji kunye nokusebenza.
2. I-Aerospace:
Imingxuma yokupholisa iblade ye-injini: Imingxunya emincinci yokupholisa yenziwe ngoomatshini kwiincakuba ze-superalloy ukuphucula ukusebenza kwe-injini.
Ukusetyenzwa kwe-Composite: Ukwembiwa okuphezulu kokuchaneka kwee-carbon fiber composites ukuqinisekisa ukomelela kwesakhiwo.
3. Izixhobo zonyango:
Izixhobo zotyando ezincinci: Ukutshiza i-microholes kwizixhobo zotyando ukuphucula ukuchaneka kunye nokhuseleko.
Inkqubo yokuhanjiswa kweziyobisi: Gxobhoza imingxuma kwisixhobo sokuhanjiswa kweziyobisi ukulawula izinga lokukhutshwa kwechiza.
4. Ukwenziwa kweMoto:
Inkqubo yokutofa ngamafutha: Ukwenza imingxunya emincinci kumbhobho wenaliti yamafutha ukuze kuphuculwe isiphumo se-atomization yamafutha.
Ukwenziwa kwenzwa: Ukugrumba imingxuma kwi-sensor element ukuphucula ubuntununtunu kunye nesantya sokuphendula.
5. Izixhobo zamehlo:
I-Optical fiber connector: Ukucoca i-microholes kwi-fiber optical connector ukuqinisekisa umgangatho wokuhanjiswa kwesignali.
Isihluzi se-Optical: Gcoba imingxunya kwisihluzi samehlo ukufezekisa ukhetho oluthile lwamaza obude.
6. Oomatshini abachanekileyo:
Ukubumba okuchanekileyo: Ukucoca i-microholes kwi-mold ukuphucula ukusebenza kunye nobomi benkonzo ye-mold.
Amalungu amancinci: Gcoba imingxuma kwiindawo ezincinci ukuhlangabezana neemfuno zendibano ephezulu echanekileyo.
I-XKH inikezela ngoluhlu olupheleleyo lweenkonzo zoomatshini bokugrumba i-laser ephezulu, kubandakanywa ukuthengiswa kwezixhobo, inkxaso yobugcisa, izisombululo ezilungiselelwe, ukufakwa kunye nokugunyaziswa, uqeqesho lokusebenza kunye nokugcinwa kokuthengiswa emva kokuthengisa, njl., Ukuqinisekisa ukuba abathengi ekusebenziseni inkxaso yobuchwephesha, esebenzayo kunye neyongezelelweyo.
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