ipleyiti yegolide yesilicone wafer (Si Wafer) 10nm 50nm 100nm 500nm Au Ukuqhuba okugqwesileyo kwe-LED

ipleyiti yegolide yesilicone yafer (Si Wafer) 10nm 50nm 100nm 500nm Au Ukuqhuba okugqwesileyo kuMfanekiso oFakelweyo we-LED

Inkcazelo emfutshane:

IiWafers zethu zeSilicon zeGolide zenzelwe i-semiconductor ephezulu kunye nezicelo ze-optoelectronics. Ezi wafers, zifumaneka kwi-intshi ezi-2, i-intshi ezi-4, kunye ne-6-intshi yedayamitha, ziqatywe ngomaleko obhityileyo wegolide esulungekileyo ephezulu (Au). Umaleko wegolide uchanekile-ugqunywe ngobunzima obuyi-50nm (± 5nm), nangona ubukhulu besiko bufumaneka ngokusekwe kwiimfuno ezithile zabathengi. Ngegolide esulungekileyo eyi-99.999%, ezi ziqwenga zibonelela ngokusebenza okugqwesileyo ekuqhubeni kombane, ukuchithwa kwe-thermal, kunye nokuqina koomatshini.

Idizayinelwe uluhlu olubanzi lwezixhobo zombane, ezi ziqwenga ezityatyekwe ngegolide zinceda ukuqinisekisa ukusebenza okuzinzile kwiindawo ezifunayo, zizenza zilungele ukupakishwa kwe-semiconductor, ukwenziwa kwe-LED, kunye ne-optoelectronics. Umgangatho wabo womphezulu, ukuhanjiswa kwe-thermal, kunye nokumelana nokubola kuqinisekisa ukuthembeka okuphuculweyo kunye nobomi obude besixhobo.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Ezona mpawu

Uphawu	Inkcazo
I-Wafer Diameter	Ifumaneka kwi2-intshi, 4-intshi, 6-intshi
Gold Umaleko Ukutyeba	50nm (±5nm)okanye ilungiselelwe iimfuno ezithile
Ubunyulu begolide	99.999% Au(ubunyulu obuphezulu bokusebenza kakuhle)
Indlela yokwaleka	Electroplatingokanyeukufakwa kwevacuumyokwaleka iyunifomu
Umphezulu Gqiba	Umphezulu ogudileyo, ongenasiphako, oyimfuneko kusetyenziso oluchanekileyo
I-Thermal Conductivity	I-conductivity ephezulu ye-thermal yokutshatyalaliswa kobushushu obusebenzayo
Ukuqhuba koMbane	I-conductivity ephezulu yombane, ilungele ukusetyenziswa kwe-semiconductor
Ukunyangwa kokuMhlwa	Ukuchasana okugqwesileyo kwi-oxidation, ilungele indawo ezingqongileyo

Kutheni i-Gold Coating ibalulekile kwi-Semiconductor Industry

Ukuqhuba koMbane
Igolide iyaziwa ngokuba yi-conductivity ephezulu yombane, eyenza ibe yinto efanelekileyo kwizicelo apho kufuneka uqhagamshelo lombane olusebenzayo noluzinzileyo. Kwimveliso ye-semiconductor, iiwafa ezigqunywe ngegolide zibonelela ngoqhagamshelo oluthembeke kakhulu kunye nokunciphisa ukuthotywa komqondiso.

Ukunyangwa kokuMhlwa
Ngokungafaniyo nezinye iintsimbi, igolide ayidibanisi okanye igxumeke ngokuhamba kwexesha, iyenza ibe lolona khetho lubalaseleyo lokukhusela abafowunelwa bombane ababuthathaka. Kwipakethe ye-semiconductor kunye nezixhobo ezivezwe kwiimeko ezinzima zokusingqongileyo, ukuxhathisa kwe-corrosion yegolide kuqinisekisa ukuba uxhulumaniso luhlala lusebenza kwaye lusebenza ixesha elide.

Ulawulo lweThermal
I-thermal conductivity yegolide iphezulu kakhulu, iqinisekisa ukuba i-silicon wafer egqunywe ngegolide inokuphelisa ngokufanelekileyo ubushushu obuveliswe sisixhobo se-semiconductor. Oku kubalulekile ekuthinteleni ukushisa okugqithisileyo kwesixhobo kunye nokugcina ukusebenza kakuhle.

Amandla oomatshini kunye noKuhlala ixesha elide
Iingubo zegolide zongeza amandla omatshini kwii-silicone wafers, ukuthintela umonakalo ongaphezulu kunye nokuphucula ukuqina kwe-wafer ngexesha lokucubungula, ukuthutha kunye nokuphatha.

Iimpawu zePost-Coating

Umgangatho woMphezulu owongeziweyo
I-wafer eqatywe ngegolide inika umphezulu ogudileyo, ofanayo obaluleke kakhuluizicelo ezichanekileyonjengokwenziwa kwe-semiconductor, apho iziphene kumphezulu zinokuchaphazela ukusebenza kwemveliso yokugqibela.

IiPropati eziPhezulu zoBonding kunye neSoldering
Iigolide yokwalekayenza iwafer yesilicon ilungeleukudibanisa ucingo, ukudityaniswa kwe-flip-chip, kwayei-solderingkwizixhobo ze-semiconductor, ukuqinisekisa uqhagamshelwano olukhuselekileyo noluzinzileyo lombane.

Uzinzo Lwexesha elide
Iiwafer ezicatyiswe ngegolide zibonelela ngokuphuculweyoukuzinza kwexesha elidekwizicelo zesemiconductor. Umaleko wegolide ukhusela i-wafer kwi-oxidation kunye nomonakalo, iqinisekisa ukuba i-wafer isebenza ngokuthembekileyo ngokuhamba kwexesha, nakwiimeko ezingqongileyo ezigqithisileyo.

Ukuphucula ukuthembeka kwesixhobo
Ngokunciphisa umngcipheko wokungaphumeleli kwi-corrosion okanye ubushushu, ii-silicone ezityatyekwe ngegolide zinegalelo elikhuluukuthembekakwayeubomi obudeyezixhobo zesemiconductor kunye neenkqubo.

Iiparamitha

Ipropati	Ixabiso
I-Wafer Diameter	2-intshi, 4-intshi, 6-intshi
Gold Umaleko Ukutyeba	I-50nm (± 5nm) okanye inokwenzeka
Ubunyulu begolide	99.999% Au
Indlela yokwaleka	Electroplating okanye vacuum deposition
Umphezulu Gqiba	Igudileyo, ayinasiphako
I-Thermal Conductivity	315 W/m·K
Ukuqhuba koMbane	45.5 x 10⁶ S/m
Ukuxinana kweGolide	19.32 g/cm³
Indawo yokunyibilika kweGolide	1064°C

Ukusetyenziswa kweGold-Coated Silicon Wafers

Ukupakishwa kweSemiconductor
Iziqendu ezityatyekwe ngegolide zibalulekileUkupakishwa kwe-ICkwizixhobo eziphambili ze-semiconductor, ezibonelela ngoqhagamshelo oluphezulu lombane kunye nokusebenza okuphuculweyo kwe-thermal.

Ukwenziwa kwe-LED
In Ukuveliswa kwe-LED, umaleko wegolide ubonelelaukutshatyalaliswa kobushushu obusebenzayokwayeconductivity yombane, ukuqinisekisa ukusebenza okungcono kunye nokuphila ixesha elide kwii-LED ezinamandla amakhulu.

Optoelectronics
Amaqebengwana aqatywe ngegolide asetyenziswa ekwenzeniizixhobo ze-optoelectronic, njengeii-photodetectors, iilaser, kwayeizinzwa zokukhanya, apho ulawulo oluzinzileyo lombane kunye ne-thermal lubalulekile.

Izicelo zePhotovoltaic
Iiwafer eziqatywe ngegolide nazo ziyasetyenziswaiiseli zelanga, apho yaboukumelana nomhlwakwayeconductivity ephezuluukuphucula ukusebenza kakuhle kwesixhobo kunye nokusebenza.

IMicroelectronics kunye neMEMS
In I-MEMS (IiNkqubo zoMbane oNcinci)kunye nezinyemicroelectronics, iziqwenga ezigqunywe ngegolide ziqinisekisa ukudityaniswa kombane okuchanekileyo kwaye zinegalelo kuzinzo lwexesha elide nokuthembeka kwezixhobo.

Imibuzo Ebuzwa Rhoqo (Q&A)

Q1: Kutheni usebenzisa igolide ukugquma ii-silicone wafers?

A1:Igolide inyulwe ngenxa yayoukuhanjiswa kombane okugqwesileyo, ukumelana nomhlwa, kwayeiimpawu ezishushu, ezibaluleke kakhulu kwizicelo ze-semiconductor ezifuna ukuqhagamshelwa kombane okuthembekileyo, ukutshatyalaliswa kokushisa okusebenzayo, kunye nokuqina kwexesha elide.

Q2: Yintoni umgangatho womgangatho wegolide?

A2:Ubungqingqwa bomgangatho wegolide bu50nm (±5nm), kodwa ubukhulu besiko bunokulungiswa ukuhlangabezana neemfuno ezithile ngokuxhomekeke kwisicelo.

I-Q3: Igolide iphucula njani ukusebenza kwe-wafer?

A3:Umaleko wegolide wongezaconductivity yombane, ukuchithwa kwe-thermal, kwayeukumelana nomhlwa, zonke eziyimfuneko ekuphuculeni ukuthembeka kunye nokusebenza kwezixhobo ze-semiconductor.

I-Q4: Ngaba ubungakanani be-wafer bungenziwa ngokwezifiso?

A4:Ewe, sinikezela2-intshi, 4-intshi, kwaye6-intshiIdayamitha njengesiqhelo, kodwa sikwabonelela ngeesayizi ezisicaba ezilungiselelweyo xa siceliwe.

I-Q5: Zeziphi izicelo ezixhamla kwii-wafers eziqatywe ngegolide?

A5:Ii-wafers eziqatywe ngegolide zifanelekileukupakishwa kwesemiconductor, Ukuveliswa kwe-LED, optoelectronics, MEMS, kwayeiiseli zelanga, phakathi kwezinye izicelo ezichanekileyo ezifuna ukusebenza okuphezulu.

I-Q6: Iyintoni inzuzo ephambili yokusebenzisa igolide yokudibanisa kwimveliso ye-semiconductor?

A6:Igolide igqwesilesolderabilitykwayeiimpawu zokudibanisayenze igqibelele ekudaleni uqhagamshelo oluthembekileyo kwizixhobo ze-semiconductor, ukuqinisekisa ukuqhagamshelwa kombane okuhlala ixesha elide kunye nokuchasana okuncinci.

Ukuqukumbela

I-Gold Coated Silicon Wafers yethu ibonelela ngesisombululo sokusebenza okuphezulu kwi-semiconductor, i-optoelectronics, kunye ne-microelectronics industry. Nge-99.999% yokugquma kwegolide ecocekileyo, ezi ziqwenga zinika umbane obalaseleyo, ukuchithwa kwe-thermal, kunye nokumelana nokubola, ukuqinisekisa ukuthembeka okuphuculweyo kunye nokusebenza kuluhlu olubanzi lwezicelo, ukusuka kwii-LED kunye nee-ICs ukuya kwizixhobo ze-photovoltaic. Nokuba yeyokuthengisa, ibonding, okanye ukupakishwa, ezi wafers lolona khetho lufanelekileyo kwiimfuno zakho ezichanekileyo.