I-GaN-on-Diamond Wafers 4inch 6inch Iyonke ubukhulu be-epi (micron) 0.6 ~ 2.5 okanye ilungiselelwe usetyenziso oluPhezulu
Iipropati
Ubungakanani beWafer:
Ifumaneka kwi-4-intshi kunye ne-6-intshi ye-diameters yokuhlanganiswa okuguquguqukayo kwiinkqubo ezahlukeneyo zokuvelisa i-semiconductor.
Iinketho zokwenza ngokwezifiso ezikhoyo kwisayizi ye-wafer, ngokuxhomekeke kwiimfuno zomthengi.
Ukutyeba koMaleko we-Epitaxial:
Uluhlu: 0.6 µm ukuya kwi-2.5 µm, kunye neenketho zobungqingqwa obulungiselelweyo obusekwe kwiimfuno ezithile zosetyenziso.
I-epitaxial layer yenzelwe ukuqinisekisa ukukhula kwekristale ye-GaN ephezulu, kunye nobukhulu obuphuculweyo ukulinganisa amandla, ukuphendula rhoqo, kunye nokulawulwa kwe-thermal.
I-Thermal Conductivity:
Umaleko wedayimani ubonelela ngokugqithiswa kwe-thermal conductivity ephezulu kakhulu malunga ne-2000-2200 W/m·K, iqinisekisa ukutshatyalaliswa kobushushu obusebenzayo kwizixhobo eziphezulu zamandla.
Iinkcazelo ngeempawu ze-GaN:
I-Bandgap ebanzi: I-GaN layer ixhamla kwi-bandgap ebanzi (~ 3.4 eV), evumela ukusebenza kwiindawo ezinzima, i-voltage ephezulu, kunye neemeko eziphezulu zokushisa.
Ukuhamba kwe-Electron: Ukuhamba kwe-electron ephezulu (malunga ne-2000 cm²/V·s), ekhokelela ekutshintsheni okukhawulezileyo kunye nee-frequencies eziphezulu zokusebenza.
I-Voltage High Breakdown Voltage: I-voltage yokutshatyalaliswa kwe-GaN iphezulu kakhulu kunezixhobo eziqhelekileyo ze-semiconductor, iyenza ilungele ukusetyenziswa kwamandla ombane.
Ukusebenza koMbane:
Uxinano lwaMandla aMmandla: I-GaN-on-Diamond wafers yenza amandla ombane aphezulu ngelixa ugcina ifom encinci, ilungele i-amplifiers kunye ne-RF systems.
Ilahleko ephantsi: Indibaniselwano yokusebenza kakuhle kwe-GaN kunye nokutshatyalaliswa kobushushu bedayimani kukhokelela ekulahlekeni okuphantsi kwamandla ngexesha lokusebenza.
Umgangatho womphezulu:
Ukukhula komgangatho ophezulu we-Epitaxial: Umaleko we-GaN ukhuliswe nge-epitaxially kwi-substrate yedayimane, iqinisekisa ukuxinana okuncinci kokuchithwa, umgangatho ophezulu wekristale, kunye nokusebenza kakuhle kwesixhobo.
Ukufana:
Ukutyeba kunye nokuBumba okufanayo: Zombini umaleko we-GaN kunye ne-diamond substrate zigcina ukufana okugqwesileyo, kubalulekile ekusebenzeni okungaguqukiyo kwesixhobo kunye nokuthembeka.
Uzinzo kwiMichiza:
Zombini i-GaN kunye nedayimani zibonelela ngozinzo olukhethekileyo lweekhemikhali, ezivumela ezi ziphaluka ukuba zisebenze ngokuthembekileyo kwiindawo ezirhabaxa zekhemikhali.
Usetyenziso
I-RF Power Amplifiers:
Ii-wafers ze-GaN-on-Diamond zifanelekile kwizikhulisi zamandla e-RF kunxibelelwano lwe-telecommunications, iisistim zeradar, kunye nonxibelelwano lwesathelayithi, zibonelela ngokusebenza okuphezulu kunye nokuthembeka kumaza aphezulu (umzekelo, i-2 GHz ukuya kuma-20 GHz nangaphaya).
Unxibelelwano lweMicrowave:
Ezi wafers zigqwesa kwiinkqubo zonxibelelwano ze-microwave, apho ukukhutshwa kwamandla aphezulu kunye nokuthotywa kwesignali encinci kubalulekile.
Ubuchwephesha beRadar kunye neSensing Technologies:
Ii-wafers ze-GaN-on-Diamond zisetyenziswa ngokubanzi kwiinkqubo ze-radar, zibonelela ngokusebenza okuqinileyo kwi-high-frequency kunye nezicelo zamandla aphezulu, ngokukodwa kumacandelo omkhosi, i-automotive, kunye ne-aerospace.
Iinkqubo zesathelayithi:
Kwiinkqubo zonxibelelwano lwesathelayithi, ezi ziqwenga ziqinisekisa ukuqina kunye nokusebenza okuphezulu kweamplifiers zamandla, ezikwaziyo ukusebenza kwiimeko ezinzima zokusingqongileyo.
I-Electronics enamandla amakhulu:
Izakhono zolawulo lwe-thermal ye-GaN-on-Diamond zibenza bafaneleke kumbane wamandla aphezulu, njengabaguquli bamandla, i-inverters, kunye ne-slid-state relays.
IiNkqubo zoLawulo lweThermal:
Ngenxa ye-thermal conductivity ephezulu yedayimani, ezi ziqwenga zinokusetyenziswa kwizicelo ezifuna ulawulo oluqinileyo lwe-thermal, njenge-LED enamandla amakhulu kunye neenkqubo ze-laser.
I-Q&A ye-GaN-on-Diamond Wafers
I-Q1: Yintoni inzuzo yokusebenzisa i-GaN-on-Diamond wafers kwizicelo eziphezulu ze-frequency?
A1:Ii-wafers ze-GaN-on-Diamond zidibanisa ukuhamba kwe-electron ephezulu kunye ne-bandap ebanzi ye-GaN kunye ne-thermal conductivity ebalaseleyo yedayimani. Oku kwenza ukuba izixhobo eziphezulu ze-frequency zisebenze kumanqanaba aphezulu ombane ngelixa zilawula ngokufanelekileyo ukushisa, ziqinisekisa ukusebenza kakuhle kunye nokuthembeka xa kuthelekiswa nezinto eziqhelekileyo.
I-Q2: Ngaba ii-wafers ze-GaN-on-Diamond zingenziwa ngokwezifiso zamandla athile kunye neemfuno zefrikhwensi?
A2:Ewe, ii-wafers ze-GaN-on-Diamond zibonelela ngeendlela ezinokwenziwa ngokwezifiso, kubandakanywa ubukhulu be-epitaxial layer (0.6 µm ukuya kwi-2.5 µm), ubukhulu be-wafer (4-intshi, i-intshi eyi-6), kunye nezinye iiparamitha ezisekelwe kwiimfuno ezithile zesicelo, ukubonelela ngokuguquguquka kwamandla aphezulu kunye nosetyenziso oluqhelekileyo.
I-Q3: Ziziphi iingenelo eziphambili zedayimani njenge-substrate ye-GaN?
A3:I-Diamond yokugqithiswa kwe-thermal conductivity (ukuya kwi-2200 W / m · K) inceda ngokufanelekileyo ukukhupha ubushushu obuveliswa zizixhobo eziphezulu ze-GaN. Esi sikhundla solawulo lwe-thermal sivumela izixhobo ze-GaN-on-Diamond ukuba zisebenze kumandla aphezulu oxinaniso kunye nee-frequencies, ukuqinisekisa ukusebenza okuphuculweyo kwesixhobo kunye nokuphila ixesha elide.
I-Q4: Ngaba ii-wafers ze-GaN-on-Diamond zifanelekile kwi-space okanye izicelo ze-aerospace?
A4:Ewe, ii-wafers ze-GaN-on-Diamond zifaneleke kakuhle kwi-space kunye nezicelo ze-aerospace ngenxa yokuthembeka kwazo okuphezulu, amandla okulawula i-thermal, kunye nokusebenza kwiimeko ezinzima, ezifana nemitha ephezulu, ukuhluka kweqondo lokushisa, kunye nokusebenza okuphezulu.
I-Q5: Yintoni ubude obulindelekileyo bezixhobo ezenziwe kwi-GaN-on-Diamond wafers?
A5:Indibaniselwano yokuqina kwe-GaN yendalo kunye neempawu zedayimani ezikhethekileyo zokuphelisa ubushushu zikhokelela kubomi obude bezixhobo. Izixhobo ze-GaN-on-Diamond zenzelwe ukusebenza kwiindawo ezinzima kunye neemeko zamandla aphezulu kunye nokuthotywa okuncinci ngexesha.
I-Q6: I-thermal conductivity yedayimane ichaphazela njani ukusebenza ngokubanzi kwee-wafers ze-GaN-on-Diamond?
A6:I-thermal conductivity ephezulu yedayimani idlala indima ebalulekileyo ekwandiseni ukusebenza kwee-wafers ze-GaN-on-Diamond ngokuhambisa ngokufanelekileyo ubushushu obuveliswe kwizicelo zamandla aphezulu. Oku kuqinisekisa ukuba izixhobo ze-GaN zigcina ukusebenza kakuhle, ukunciphisa uxinzelelo lwe-thermal, kwaye zigweme ukufudumala, okuwumngeni oqhelekileyo kwizixhobo eziqhelekileyo ze-semiconductor.
I-Q7: Ziziphi izicelo eziqhelekileyo apho ii-wafers ze-GaN-on-Diamond zidlula ezinye izinto ze-semiconductor?
A7:Ii-wafers ze-GaN-on-Diamond zisebenza ngaphezu kwezinye izinto kwizicelo ezifuna ukuphathwa kwamandla aphezulu, ukusebenza kwe-high-frequency, kunye nolawulo olusebenzayo lwe-thermal. Oku kuquka ii-amplifiers zeRF, iinkqubo zerada, unxibelelwano ngemicrowave, unxibelelwano ngesathelayithi, kunye nezinye izixhobo zombane eziphezulu.
Ukuqukumbela
I-GaN-on-Diamond wafers inikezela ngesisombululo esisodwa kwi-high-frequency kunye nezicelo zamandla aphezulu, ukudibanisa ukusebenza okuphezulu kwe-GaN kunye neempawu ezikhethekileyo ze-thermal zedayimani. Ngeempawu ezinokwenziwa ngokwezifiso, zenzelwe ukuhlangabezana neemfuno zamashishini afuna ukunikezelwa kwamandla ngokufanelekileyo, ulawulo lwe-thermal, kunye nokusebenza okuphezulu-frequency, ukuqinisekisa ukuthembeka kunye nokuphila ixesha elide kwiindawo ezinzima.
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