Ibhokisi ye-FOSB yesithwali se-wafer 25slots ye-12inch wafer Ukuchaneka kwesithuba semisebenzi ezenzekelayo imathiriyeli ecocekileyo

Ibhokisi ye-FOSB yesiphathi sebhokisi ene-25slots ye-12inch wafer Ukuchaneka kwesithuba semisebenzi ezenzekelayo imathiriyeli ecocekileyo eFakelweyo

Inkcazelo emfutshane:

I-12-intshi (300mm) Ibhokisi yokuThumela ePhambili yokuVula (i-FOSB) i-wafer carrier sisisombululo esithuthukisiweyo soshishino lwe-semiconductor, eyenzelwe ukubonelela ngokuphathwa okukhuselekileyo, ukuthutha kunye nokugcinwa kwee-wafers ze-intshi ezili-12. Ngomthamo wee-slots ezingama-25, i-slot nganye yenziwe ngobunono kunye nesithuba esichanekileyo ukunciphisa umngcipheko woqhagamshelwano lwe-wafer, ukuqinisekisa ukuba i-wafer nganye ihlala ikhuselekile kuyo yonke inkqubo yokuthutha.

Yakhiwe ngezinto ezicoceke kakhulu, ezikhupha amanzi aphantsi, le bhokisi ye-FOSB ihlangabezana nemigangatho ephezulu efunekayo kwimveliso ye-semiconductor yale mihla, apho ucoceko kunye nokuthembeka kwe-wafer kubaluleke kakhulu. Ilungiselelwe imisebenzi ezenzekelayo, umthwali we-FOSB udibanisa ngokungenamthungo kwiinkqubo zokuphatha izinto ezizenzekelayo (AMHS), ezivumela uthutho lwe-wafer olusebenzayo, olungenalo ungcoliseko. Uyilo oluphucukileyo lubonisa iindlela zokugcinwa kwewafer ezomeleleyo zokukhusela iiwafers ngexesha lokuhamba, eqinisekisa ukuba zifika kwindawo eziya kuyo zigqibelele, ngaphandle kokuthotywa okanye iziphene.

Le bhokisi ye-wafer carrier iyingxenye ebalulekileyo yokuphatha ukuphatha i-wafer kwindawo echanekileyo ephezulu, enikezela indibaniselwano yokuhambelana ngokuzenzekelayo, ulawulo longcoliseko, kunye nokwakhiwa okuhlala ixesha elide, okwenza ukuba ilungele imigca yokuvelisa i-semiconductor ephezulu.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Ezona mpawu

Uphawu	Inkcazo
Slot Umthamo	25 iindawo zokubekangenxaIi-intshi ezili-12 zamawafa, ukwandisa indawo yokugcina ngelixa uqinisekisa ukuba ii-wafers zigcinwe ngokukhuselekileyo.
Ukuphathwa okuzenzekelayo	YenzelweUkuphathwa kwe-wafer ezenzekelayo, ukunciphisa impazamo yabantu kunye nokwandisa ukusebenza kakuhle kwiindwangu ze-semiconductor.
Precision Slot Isithuba	Ukuchaneka kobunjineli be-slot okuchanekayo kuthintela ukudibana kwe-wafer, ukunciphisa umngcipheko wongcoliseko kunye nomonakalo womatshini.
IiMathiriyeli ezicocekileyo kakhulu	Yenziwe ukusukai-ultra-clean, i-low-outgassing materialsukugcina imfezeko yeewafers kunye nokunciphisa ungcoliseko.
Inkqubo yokugcinwa kweWafer	Ubandakanya ainkqubo yokugcinwa kwe-wafer ephezulu yokusebenzaukugcina amaqhekezana kwindawo ekhuselekileyo ngexesha lokuthuthwa.
I-SEMI/FIMS & nokuthotyelwa kwe-AMHS	NgokupheleleyoI-SEMI/FIMSkwayeAMHSukuthobela, ukuqinisekisa ukudityaniswa komthungo kwiinkqubo ze-semiconductor ezizenzekelayo.
Ulawulo lwamacandelo	Yenzelwe ukunciphisaukuveliswa kwamasuntswana, ukubonelela ngemeko-bume ecocekileyo yothutho lwe-wafer.
Uyilo oluSetyenziswayo	Customizableukuhlangabezana neemfuno ezithile zemveliso, kuquka uhlengahlengiso kuqwalaselo slot okanye izinto ezikhethiweyo.
Ukuqina okuphezulu	Yakhiwe kwizinto eziphezulu eziphezulu zokumelana nobunzima bezothutho ngaphandle kokunciphisa ukusebenza.

Iimpawu ezineenkcukacha

1.25-Slot Umthamo 12-intshi Wafers
I-FOSB ene-slot ye-25 yenzelwe ukubamba ngokukhuselekileyo ukuya kuthi ga kwi-12-intshi ye-wafers, evumela ukuthutha okukhuselekileyo kunye nokusebenzayo. I-slot nganye yenziwe ngononophelo ukuqinisekisa ukulungelelaniswa kwe-wafer kunye nokuzinza, ukunciphisa umngcipheko wokuqhekeka kwe-wafer okanye ukuguqulwa. Uyilo lukhulisa indawo ngelixa ugcina imigama ekhuselekileyo phakathi kwama-wafers, kubalulekile ukuthintela umonakalo ngexesha lokuthutha okanye ukuphatha.

2.Isithuba esichanekileyo soThintelo lomonakalo
Isithuba esichanekileyo phakathi kweendawo zokubeka sibalwa ngobuchule ukuthintela ukudibana okuthe ngqo phakathi kweewafers. Olu phawu lubalulekile ekuphatheni i-wafer ye-semiconductor, njengoko nomkrwelo omncinci okanye ungcoliseko lunokubangela iziphene ezibalulekileyo. Ngokuqinisekisa indawo eyaneleyo phakathi kwee-wafers, ibhokisi ye-FOSB inciphisa amandla omonakalo womzimba kunye nokungcoliswa ngexesha lokuthutha, ukugcinwa kunye nokuphatha.

3.Yenzelwe ukuSebenza okuSebenzayo
Ibhokisi ye-FOSB ye-wafer carrier ilungiselelwe imisebenzi ezenzekelayo, ukunciphisa imfuno yokungenelela komntu kwinkqubo yokuthutha i-wafer. Ngokudibanisa ngokungenamthungo kunye neenkqubo zokuphatha izinto ezizenzekelayo (AMHS), ibhokisi iphucula ukusebenza kakuhle, inciphisa umngcipheko wokusuleleka kuqhagamshelwano lomntu, kwaye ikhawuleza ukuthuthwa kwe-wafer phakathi kweendawo zokucubungula. Oku kuhambelana kuqinisekisa ukuphatha i-wafer egudileyo kwaye ekhawulezayo kwiindawo zanamhlanje zemveliso ye-semiconductor.

I-4.I-Ultra-Clean, i-Low-Outgassing Materials
Ukuqinisekisa amanqanaba aphezulu okucoceka, ibhokisi ye-FOSB ye-wafer carrier yenziwe kwizinto ezicocekileyo, ezisezantsi. Olu lwakhiwo luthintela ukukhululwa kweekhompawundi eziguquguqukayo ezinokuphazamisa ingqibelelo ye-wafer, ukuqinisekisa ukuba ii-wafers zihlala zingangcoliswa ngexesha lokuthutha kunye nokugcinwa. Olu phawu lubaluleke kakhulu kwiilaphu ze-semiconductor apho amasuntswana amancinci okanye ungcoliseko lwekhemikhali lunokukhokelela kwiziphene ezibiza kakhulu.

5.Robust Wafer Retention System
Inkqubo yokugcinwa kwe-wafer ngaphakathi kwebhokisi ye-FOSB iqinisekisa ukuba ii-wafers zigcinwe ngokukhuselekileyo ngexesha lokuthutha, ukuthintela nayiphi na intshukumo enokuthi iholele kwi-wafer misalignment, imikrwelo, okanye ezinye iindlela zomonakalo. Le nkqubo yenzelwe ukugcina indawo ye-wafer nakwindawo ezinesantya esiphezulu esizisebenzelayo, ibonelela ngokhuseleko oluphezulu lweewafers eziethe-ethe.

6.Ulawulo lweParticle kunye nokuCoceka
Uyilo lwebhokisi ye-FOSB ye-wafer carrier igxile ekunciphiseni ukuveliswa kwamasuntswana, enye yezona zizathu ziphambili zeziphene ze-wafer kwimveliso ye-semiconductor. Ngokusebenzisa izinto ezicocekileyo ezicocekileyo kunye nenkqubo yokugcina eyomeleleyo, ibhokisi ye-FOSB inceda ukugcina amanqanaba okungcoliseka kubuncinci, ukugcina ukucoceka okufunekayo kwimveliso ye-semiconductor.

7.SEMI/FIMS kunye nokuthotyelwa kwe-AMHS
Ibhokisi ye-FOSB ye-wafer carrier idibana ne-SEMI / FIMS kunye nemigangatho ye-AMHS, iqinisekisa ukuba ihambelana ngokupheleleyo ne-industry-standard-standard automated material systems. Oku kuthotyelwa kuqinisekisa ukuba ibhokisi iyahambelana neemfuno ezingqongqo zezixhobo zokuvelisa i-semiconductor, iququzelela ukudityaniswa okugudileyo kwimveliso yemveliso kunye nokunyusa ukusebenza kakuhle.

8.Ukuqina kunye nokuphila ixesha elide
Yenziwe ngezinto ezinokuqina okuphezulu, ibhokisi ye-FOSB ye-wafer carrier yenzelwe ukumelana neemfuno zomzimba zothutho lwe-wafer ngelixa igcina imfezeko yolwakhiwo. Oku kuqina kuqinisekisa ukuba ibhokisi ingasetyenziselwa ngokuphindaphindiweyo kwiindawo eziphakamileyo eziphezulu ngaphandle kwesidingo sokutshintshwa rhoqo, ukunika isisombululo esinendleko kwixesha elide.

9.Customizable kwiiMfuno eziZodwa
Ibhokisi ye-FOSB ye-wafer carrier inika iinketho zokwenza ngokwezifiso ukuhlangabezana neemfuno ezithile zokusebenza. Nokuba kulungelelaniswa inani leendawo zokubeka, ukutshintsha imilinganiselo yebhokisi, okanye ukukhetha izixhobo ezikhethekileyo kwizicelo ezithile, ibhokisi yomphathi inokwenziwa ukuze ihambelane noluhlu olubanzi lweemfuno zemveliso yesemiconductor.

Usetyenziso

I-12-intshi (300mm) ibhokisi ye-FOSB yokuthwala i-wafer ifanelekile kwiintlobo ezahlukeneyo zezicelo ngaphakathi kwemveliso ye-semiconductor kunye nemimandla ehambelana nayo:

UkuPhathwa kweWafer yeSemiconductor
Ibhokisi iqinisekisa ukuphathwa ngokukhuselekileyo kunye nokusebenza ngokufanelekileyo kwee-wafers ze-intshi ezili-12 ngexesha lazo zonke izigaba zokuvelisa, ukusuka kwimveliso yokuqala ukuya kuvavanyo lokugqibela kunye nokupakishwa. Ukuphathwa kwayo okuzenzekelayo kunye nokuchaneka kwesithuba se-slot sikhusela ama-wafers ekungcoleni kunye nomonakalo womatshini, ukuqinisekisa isivuno esiphezulu kwimveliso ye-semiconductor.

Ugcino lweWafer
Kwiimpahla ze-semiconductor, ukugcinwa kwe-wafer kufuneka kuphathwe ngononophelo ukuphepha ukuthotywa okanye ukungcoliswa. Ibhokisi lomphathi we-FOSB libonelela ngokusingqongileyo okuzinzile kunye nokucocekileyo, ukukhusela ama-wafers ngexesha lokugcinwa kunye nokunceda ukugcina ingqibelelo yabo de balungele ukuqhutyelwa phambili.

Ii-wafers zokuthutha phakathi kwezigaba zeMveliso
Ibhokisi ye-FOSB ye-wafer carrier yenzelwe ukuthutha ngokukhuselekileyo ama-wafers phakathi kwezigaba ezahlukeneyo zemveliso, ukunciphisa umngcipheko womonakalo we-wafer ngexesha lokuhamba. Nokuba ii-wafers ezihambayo ngaphakathi kwelaphu enye okanye phakathi kwezibonelelo ezahlukeneyo, ibhokisi ye-carrier iqinisekisa ukuba ii-wafers zithuthwa ngokukhuselekileyo nangokufanelekileyo.

Ukudityaniswa ne-AMHS
Ibhokisi ye-FOSB ye-wafer carrier idibanisa ngokungenamthungo kunye neenkqubo zokuphatha izinto ezizenzekelayo (AMHS), ivumela ukuhamba ngesantya esiphezulu se-wafer ngaphakathi kweendwangu zanamhlanje ze-semiconductor. I-automation ebonelelwe yi-AMHS iphucula ukusebenza kakuhle, inciphisa iimpazamo zomntu, kwaye yandisa i-throughput ngokubanzi kwimigca yokuvelisa i-semiconductor.

Amagama angundoqo e-FOSB Q&A

I-Q1: Zingaphi ii-wafers ezinokubanjwa yibhokisi ye-FOSB?

A1:IIbhokisi ye-FOSB yokuthwala i-waferune25-slot umthamo, eyenzelwe ngokukodwa ukubambaIi-intshi ezili-12 (300mm) iifafasingokukhuselekileyo ngexesha lokuphatha, ukugcinwa, kunye nokuthutha.

I-Q2: Ziziphi iingenelo zokuchaneka kwesithuba kwibhokisi ye-FOSB ye-carrier?

A2: Izithuba ezichanekileyoiqinisekisa ukuba ii-wafers zigcinwa kumgama okhuselekileyo omnye komnye, ukuthintela ukudibana okunokukhokelela kwimikrwelo, iintanda, okanye ukosulela. Olu phawu lubalulekile ekugcineni intembeko yeewafers kulo lonke uthutho kunye nenkqubo yokuphatha.

I-Q3: Ngaba ibhokisi yeFOSB ingasetyenziswa kunye neenkqubo ezizenzekelayo?

A3:Ewe, iIbhokisi ye-FOSB yokuthwala i-waferyenzelweimisebenzi ezenzekelayokwaye iyahambelana ngokupheleleyoAMHS, okwenza kube yinto efanelekileyo kwisantya esiphezulu, imigca yokuvelisa i-semiconductor ezenzekelayo.

I-Q4: Ziziphi izinto ezisetyenziswayo kwibhokisi ye-FOSB yokunqanda ukungcola?

A4:IIbhokisi yomphathi weFOSByenziwe ngei-ultra-clean, i-low-outgassing materials, ezikhethwe ngokucophelela ukukhusela ukungcola kunye nokuqinisekisa ukunyaniseka kwe-wafer ngexesha lokuthutha kunye nokugcinwa.

I-Q5: Isebenza njani inkqubo yokugcinwa kwe-wafer kwibhokisi ye-FOSB?

A5:Iinkqubo yokugcinwa kwewaferikhusela ama-wafers endaweni, ukukhusela nayiphi na intshukumo ngexesha lokuthutha, nakwiinkqubo ezizenzekelayo ezikhawulezayo. Le nkqubo inciphisa umngcipheko wokungahambi kakuhle kwe-wafer okanye umonakalo ngenxa ye-vibrations okanye amandla angaphandle.

I-Q6: Ngaba ibhokisi ye-FOSB ye-wafer carrier ingenziwa ngokwezifiso kwiimfuno ezithile?

A6:Ewe, iIbhokisi ye-FOSB yokuthwala i-waferinikezaiinketho zokwenza ngokwezifiso, ukuvumela uhlengahlengiso kwi-slot configurations, izinto eziphathekayo, kunye nobukhulu ukuhlangabezana neemfuno ezizodwa zeefabs ze-semiconductor.

Ukuqukumbela

I-12-intshi ye-intshi (300mm) ibhokisi ye-FOSB ye-wafer carrier inikezela ngesisombululo esikhuselekileyo nesisebenzayo sothutho lwe-wafer semiconductor kunye nokugcinwa. Ngeendawo zokubeka ezingama-25, izithuba ezichanekileyo, izixhobo ezicocekileyo kakhulu, kunye nokuhambelana nazo