I-6 Intshi / 8 Intshi yePOD / FOSB Ibhokisi yeFayibha ye-Splice yeBhokisi yokuZisa Ibhokisi yokuGcina Ibhokisi ye-RSP yeSibonelelo seSidemo seNkonzo FOUP Ngaphambili Ukuvula iPod eManyeneyo
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Isishwankathelo seFOSB
II-FOSB (Ibhokisi yokuThumela eNgaphambi kokuvula)sisikhongozeli esakhiwe ngobunjineli obuchanekileyo, esivuleke ngaphambili esilungiselelwe ngokukodwa uthutho olukhuselekileyo kunye nokugcinwa kweewafers zesemiconductor ezingama-300mm. Idlala indima ebalulekileyo ekukhuseleni ii-wafers ngexesha lokudluliselwa kwe-inter-fab kunye nokuthunyelwa komgama omde ngelixa iqinisekisa ukuba awona manqanaba aphezulu okucoceka kunye nemfezeko yomatshini iyagcinwa.
Yenziwe ngezinto ezicoceke kakhulu, ezingaguqukiyo kwaye zenziwe ngokwemigangatho ye-SEMI, i-FOSB ibonelela ngokhuseleko olukhethekileyo ngokuchasene nokungcoliseka kwamasuntswana, ukukhutshwa okumileyo, kunye nokothuka komzimba. Isetyenziswa ngokubanzi kulo lonke ukuveliswa kwe-semiconductor yehlabathi, ulungiselelo, kunye ne-OEM/OSAT ubambiswano, ngakumbi kwimigca yemveliso ezenzekelayo ye-300mm wafer fabs.
Ubume kunye nezixhobo zeFOSB
Ibhokisi yeFOSB eqhelekileyo yenziwe ngamacandelo achanekileyo, zonke ziyilelwe ukusebenza ngaphandle komthungo kunye ne-automation yefektri kunye nokuqinisekisa ukhuseleko lwe-wafer:
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UMzimba oPhambili: Ibunjwe ukusuka kwiiplastiki zobunjineli ezicocekileyo ezifana ne-PC (i-polycarbonate) okanye i-PEEK, inika amandla omatshini aphezulu, isizukulwana esincinci, kunye nokuchasana kweekhemikhali.
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Umnyango Wokuvula Ngaphambili: Yenzelwe ukuhambelana ngokupheleleyo kwe-automation; Ifaka iigaskets zokutywina eziqinileyo eziqinisekisa ukutshintshiselana komoya kancinci ngexesha lothutho.
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I-Reticle yangaphakathi / I-wafer Tray: Ibamba ukuya kuthi ga kwi-25 wafers ngokukhuselekileyo. Itreyi i-anti-static kwaye icushined ukunqanda ukutshintshwa kwe-wafer, ukuqhekeka komphetho, okanye ukukrwela.
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Latch Mechanism: Inkqubo yokutshixa ukhuseleko iqinisekisa ukuba ucango luhlala luvaliwe ngexesha lokuhamba nokuphatha.
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Iimpawu zokulandelelwa: Iimodeli ezininzi zibandakanya iithegi ze-RFID ezizinzisiweyo, iikhowudi zebhakhowudi, okanye iikhowudi zeQR zokudityaniswa okupheleleyo kwe-MES kunye nokulandelela kulo lonke ikhonkco lolungiselelo.
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Ulawulo lwe-ESD: Iimathiriyeli zi-static-dissipative, ngokuqhelekileyo zinokumelana komphezulu phakathi kwe-10⁶ kunye ne-10⁹ ohms, inceda ukukhusela iiwafers ekukhutshweni kwe-electrostatic.
La macandelo enziwe kwiindawo ezicocekileyo zegumbi kwaye adibana okanye adlule imigangatho ye-SEMI yamazwe ngamazwe efana ne-E10, E47, E62, kunye ne-E83.
Izinto Eziluncedo Ezingundoqo
● Ukhuseleko lweWafer olukwiNqanaba eliphezulu
Ii-FOSB zakhelwe ukukhusela ii-wafers kumonakalo womzimba kunye nongcoliseko lokusingqongileyo:
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Isistim evalwe ngokupheleleyo, evalwe nge-hermetically ivala ukufuma, umsi wekhemikhali, kunye namasuntswana omoya.
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I-Anti-vibration yangaphakathi inciphisa umngcipheko wokutshatyalaliswa koomatshini okanye i-microcracks.
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Iqokobhe langaphandle eliqinileyo liyamelana neempembelelo zokuwa kunye noxinzelelo lokupakisha ngexesha lolungiselelo.
● Ukuhambelana okupheleleyo okuzenzekelayo
IiFOSB zenzelwe ukusetyenziswa kwi-AMHS (iiNkqubo zokuHamba izinto ezizenzekelayo):
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Iyahambelana neengalo zerobhothi ezithobela i-SEMI, amazibuko omthwalo, izitokhwe, kunye nezivula.
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Umatshini wokuvula ngaphambili ulungelelaniswa neFOUP esemgangathweni kunye neenkqubo zezibuko zokulayisha ukwenzela umatshini wokwenza umthungo ongenamthungo.
● Uyilo oluLungele iGumbi lokucoca
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Yenziwe ngezinto ezicoceke kakhulu, ezikhupha umoya ophantsi.
Kulula ukuyicoca kwaye iphinde isetyenziswe; ilungele iKlasi loku-1 okanye iindawo ezicocekileyo zegumbi.
Isimahla kwiiyoni zentsimbi enzima, iqinisekisa ukuba akukho ngcoliseko ngexesha lokudluliselwa kwe-wafer.
● Ukulandelela okuhlakaniphileyo kunye nokudibanisa kwe-MES
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Ukhetho lwe-RFID/NFC/iinkqubo zebhakhowudi zivumela ukulandeleka okupheleleyo ukusuka kwifab ukuya kwifab.
I-FOSB nganye inokuchongwa ngokukodwa kwaye ilandelelwe ngaphakathi kwe-MES okanye inkqubo ye-WMS.
Ixhasa ukusebenza elubala, ukuchongwa kwebhetshi, kunye nolawulo lwempahla.
Ibhokisi yeFOSB-Itheyibhile yeeNkcazo eziDityanisiweyo
| Udidi | Into | Ixabiso |
|---|---|---|
| Izinto eziphathekayo | Uqhagamshelwano lweWafer | Polycarbonate |
| Izinto eziphathekayo | Iqokobhe, ucango, ikhushini yomnyango | Polycarbonate |
| Izinto eziphathekayo | Umgcini wangasemva | Polybutylene Terephthalate |
| Izinto eziphathekayo | Izibambo, i-Auto Flange, iiPads zoLwazi | Polycarbonate |
| Izinto eziphathekayo | Gasket | I-Thermoplastic Elastomer |
| Izinto eziphathekayo | Icwecwe le-KC | Polycarbonate |
| Iinkcukacha | Umthamo | 25 amaqebengwana |
| Iinkcukacha | Ubunzulu | 332.77 mm ±0.1 mm (13.10" ±0.005") |
| Iinkcukacha | Ububanzi | 389.52 mm ±0.1 mm (15.33" ±0.005") |
| Iinkcukacha | Ubude | 336.93 mm ±0.1 mm (13.26" ±0.005") |
| Iinkcukacha | 2-Pack Ubude | 680 mm (26.77") |
| Iinkcukacha | 2-Pack Ububanzi | 415 mm (16.34") |
| Iinkcukacha | 2-Pack Height | 365 mm (14.37") |
| Iinkcukacha | Ubunzima (Abunanto) | 4.6 kg (10.1 lb) |
| Iinkcukacha | Ubunzima (Bugcwele) | 7.8kg (17.2 lb) |
| Ukuhambelana kweWafer | Ubungakanani beWafer | 300 mm |
| Ukuhambelana kweWafer | I-pitch | 10.0 mm (0.39") |
| Ukuhambelana kweWafer | Iinqwelomoya | ±0.5 mm (0.02") ukusuka kwigama |
Iimeko zeSicelo
IiFOSB zizixhobo ezibalulekileyo kwi-300mm wafer logistics kunye nokugcinwa. Zamkelwa ngokubanzi kwezi meko zilandelayo:
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Udluliselo lweFab-to-Fab: Ukuhambisa ii-wafers phakathi kweendawo ezahlukeneyo zokwenziwa kwe-semiconductor.
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Ukuhanjiswa kwe-Foundry: Ukuthutha ii-wafers ezigqityiweyo ukusuka kwi-fab ukuya kumthengi okanye kwindawo yokupakisha.
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OEM / OSAT Logistics: Kwiinkqubo zokupakishwa kunye novavanyo lwangaphandle.
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Iqela lesithathu loGcino & neWarehousing: Khusela ukugcinwa kwexesha elide okanye okwexeshana kwee-wafers ezixabisekileyo.
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Udluliselo lweWafer lwangaphakathi: Kwiikhampasi ezinkulu zefab apho iimodyuli zokuvelisa ezikude ziqhagamshelwe nge-AMHS okanye ukuthutha ngesandla.
Kumsebenzi wekhonkco lokubonelela ngehlabathi, ii-FOSB ziye zaba ngumgangatho wexabiso eliphezulu lothutho lwe-wafer, eqinisekisa ukuhanjiswa simahla kumazwekazi onke.
FOSB vs. FOUP – Yintoni uMahluko?
| Uphawu | I-FOSB (Ibhokisi yokuThumela eNgaphambi kokuvula) | IFOUP (Ngaphambi kokuvula iPod eManyeneyo) |
|---|---|---|
| Ukusetyenziswa okuPhambili | I-Inter-fab wafer ngenqanawa kunye nolungiselelo | Ukuhanjiswa kwe-wafer kwi-fab kunye nokusetyenzwa okuzenzekelayo |
| Ulwakhiwo | Isikhongozeli esiqinileyo, esitywiniweyo esinokhuseleko olongezelelweyo | I-pod enokusetyenziswa kwakhona elungiselelwe ukuzenzekelayo kwangaphakathi |
| Ukungangeni moya | Ukusebenza kokutywinwa okuphezulu | Yenzelwe ukufikelela lula, umoya omncinci |
| Ukusetyenziswa rhoqo | Phakathi (igxile kuthutho olukhuselekileyo lomgama omde) | I-High-frequency kwimizila yemveliso ezenzekelayo |
| Umthamo weWafer | Ngokuqhelekileyo ii-wafers ezingama-25 kwibhokisi nganye | Ngokuqhelekileyo ii-wafers ezingama-25 kwipod nganye |
| Inkxaso ezenzekelayo | Iyahambelana nezivuli zeFOSB | Idityaniswe namazibuko omthwalo weFOUP |
| Ukuthobela | SEMI E47, E62 | SEMI E47, E62, E84, kunye nokunye |
Ngelixa zombini zisebenza iindima ezibalulekileyo kulungiselelo lwe-wafer, ii-FOSB zakhelwe ngenjongo yokuhambisa ngenqanawe phakathi kweempahla okanye kubathengi bangaphandle, ngelixa ii-FOUPs zijolise ngakumbi ekusebenzeni komgca wemveliso ozenzekelayo.
Imibuzo Ebuzwa Rhoqo (FAQ)
I-Q1: Ngaba ii-FOSB ziphinda zisetyenziswe?
Ewe. IiFOSB ezikumgangatho ophezulu ziyilelwe ukusetyenziswa ngokuphindaphindiweyo kwaye ziyakwazi ukumelana nemijikelo emininzi yokucoca kunye nokuphatha ukuba zigcinwe kakuhle. Ukucoca rhoqo ngezixhobo eziqinisekisiweyo kucetyiswa.
I-Q2: Ngaba ii-FOSB zingenziwa ngokwezifiso zokubeka uphawu okanye ukulandelela?
Ngokuqinisekileyo. IiFOSB zinokulungiswa zibe neelogo zabathengi, iithegi ezithile zeRFID, ukutywinwa okuchasene nokufuma, kunye nekhowudi yombala eyahlukileyo yolawulo lolungiselelo olulula.
I-Q3: Ngaba ii-FOSB zifanelekile kwiindawo ezicocekileyo zegumbi?
Ewe. IiFOSB zenziwa kwiiplastiki zomgangatho ococekileyo kwaye zitywinwe ukuthintela ukuveliswa kwamasuntswana. Zifanelekile kwiKlasi yoku-1 ukuya kwiKlasi ye-1000 yendawo yokucoceka kunye nemimandla ebalulekileyo ye-semiconductor.
I-Q4: IiFOSB zivulwa njani ngexesha lokuzenzekelayo?
Ii-FOSB ziyahambelana nezivuli ezikhethekileyo zeFOSB ezisusa umnyango wangaphambili ngaphandle koqhagamshelwano lwezandla, zigcina ingqibelelo yeemeko zegumbi lokucoca.
Ngathi
I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo yeglasi kunye nezinto ezintsha zekristale. Iimveliso zethu zisebenza ngombane obonakalayo, i-elektroniki yabathengi, kunye nomkhosi. Sinikezela ngezixhobo zeSapphire optical, iilensi zeselfowuni eziphathwayo, iiCeramics, LT, Silicon Carbide SIC, Quartz, kunye nesemiconductor crystal wafers. Ngobuchule bezakhono kunye nezixhobo ezibukhali, sigqwesa ekusetyenzweni kwemveliso engeyiyo eyomgangatho, sijonge ukuba lishishini eliphambili le-optoelectronic tech-tech.
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