I-POD ye-6 intshi / 8 intshi ye-POD / FOSB Fiber Optic Splice Box Delivery Box Storage Box RSP Remote Service Platform FOUP Front Opening Unified Pod

I-POD / FOSB Fiber Optic Splice Box Delivery Box Storage Box RSP Remote Service Platform FOUP Front Opening Unified Pod Umfanekiso obonisiweyo

Inkcazo emfutshane:

II-FOSB (Ibhokisi yoThutho eVula ngaphambili)sisikhongozeli esenziwe ngobuchule obuchanekileyo, esivula ngaphambili esenzelwe ngokukodwa ukuthutha ngokukhuselekileyo kunye nokugcina ii-wafers ze-semiconductor ezingama-300mm. Sidlala indima ebalulekileyo ekukhuseleni ii-wafers ngexesha lokudluliselwa phakathi kwempahla kunye nokuthunyelwa komgama omde ngelixa siqinisekisa ukuba amanqanaba aphezulu ococeko kunye nokuqina koomatshini kuyagcinwa.

Thumela i-imeyile kuthi

Iimbonakalo

Umzobo oneenkcukacha

Isishwankathelo se-FOSB

Yenziwe ngezinto ezicocekileyo kakhulu, ezisasaza izinto ezingashukumiyo kwaye yenziwe ngokwemigangatho ye-SEMI, i-FOSB inika ukhuseleko olukhethekileyo ngokuchasene nongcoliseko lwamasuntswana, ukukhutshwa okungashukumiyo, kunye nomothuko womzimba. Isetyenziswa kakhulu kushishino lwe-semiconductor lwehlabathi, uthutho, kunye nobudlelwane be-OEM/OSAT, ngakumbi kwimigca yemveliso ezenzekelayo yee-wafer fabs ezingama-300mm.

Ulwakhiwo kunye nezixhobo ze-FOSB

Ibhokisi yeFOSB eqhelekileyo yenziwe ngamacandelo aliqela achanekileyo, onke ayilelwe ukusebenza ngokungenamthungo kunye nokuzisebenzela kwefektri kunye nokuqinisekisa ukhuseleko lwe-wafer:

Umzimba Oyintloko: Ibunjwe ngeeplastiki zobunjineli ezicocekileyo kakhulu ezifana nePC (polycarbonate) okanye iPEEK, inika amandla aphezulu oomatshini, ukuvelisa amasuntswana aphantsi, kunye nokumelana neekhemikhali.
Ucango oluVulekayo lwangaphambili: Yenzelwe ukuhambelana ngokupheleleyo nokusebenza ngokuzenzekelayo; inee-gaskets eziqinileyo eziqinisekisa utshintshiselwano lomoya oluncinci ngexesha lokuthuthwa.
Itreyi yeReticle/Wafer yangaphakathi: Ibamba ii-wafers ezingama-25 ngokukhuselekileyo. Itreyi ayishukumi kwaye ikhuselwe ukuthintela ukushukuma kwe-wafer, ukuqhekeka komphetho, okanye ukukrwela.
Indlela Yokubopha I-LatchInkqubo yokutshixa ukhuseleko iqinisekisa ukuba ucango luhlala luvaliwe ngexesha lokuhamba nokuphathwa.
Iimpawu zokulandelelwaIimodeli ezininzi ziquka iithegi zeRFID ezifakwe ngaphakathi, iibhakhowudi, okanye iikhowudi zeQR zokudibanisa ngokupheleleyo i-MES kunye nokulandelela kulo lonke uthotho lwezothutho.
Ulawulo lwe-ESD: Ezi zinto azitshintshi ngokuzenzekelayo, zihlala zinokumelana nomphezulu phakathi kwe-10⁶ kunye ne-10⁹ ohms, nto leyo enceda ekukhuseleni ii-wafers ekukhutshweni kwe-electrostatic.

Ezi zinto zenziwe kwiindawo zokucoca kwaye ziyahlangabezana okanye zidlule imigangatho ye-SEMI yamazwe ngamazwe efana ne-E10, E47, E62, kunye ne-E83.

Iingenelo eziphambili

● Ukhuseleko lweWafer oluphezulu

Ii-FOSB zakhiwe ukukhusela ii-wafers ekonakaleni ngokwasemzimbeni nakwizinto ezingcolisayo kokusingqongileyo:

Inkqubo evalekileyo ngokupheleleyo, evalwe kakuhle ivala umswakama, umsi weekhemikhali, kunye namasuntswana ahamba emoyeni.
Ingaphakathi elichasene nokungcangcazela linciphisa umngcipheko wokuqhawuka okanye ukuqhekeka okuncinci.
Iqokobhe langaphandle eliqinileyo liyakwazi ukumelana nokuwa kunye noxinzelelo oludibeneyo ngexesha lothutho.

● Ukuhambelana okugcweleyo kwe-Automation

Ii-FOSB zenzelwe ukusetyenziswa kwi-AMHS (iiNkqubo zoLawulo lwezinto eziZenzekelayo):

Iyahambelana neengalo zerobhothi ezithobela i-SEMI, ii-load ports, ii-stockers, kunye nee-openers.
Indlela yokuvula ngaphambili ihambelana neenkqubo ze-FOUP eziqhelekileyo kunye neenkqubo zezibuko zomthwalo ukuze kwenziwe umatshini ozenzekelayo ongenamthungo.

● Uyilo olulungele igumbi lokucoca

Yenziwe ngezinto ezicocekileyo kakhulu nezingenagesi ingako.
Kulula ukuyicoca nokuyiphinda uyisebenzise; ifanelekile kwiindawo zokucoca zeKlasi yoku-1 okanye ngaphezulu.
Ayinazo ii-ion zesinyithi ezinzima, iqinisekisa ukuba akukho ngcoliseko ngexesha lokudluliselwa kwe-wafer.

● Ukulandelela okukrelekrele kunye nokuhlanganiswa kwe-MES

Iinkqubo ze-RFID/NFC/barcode ezikhethwayo zivumela ukulandeleka ngokupheleleyo ukusuka kwi-fab ukuya kwi-fab.
I-FOSB nganye inokuchongwa kwaye ilandelwe ngokukodwa ngaphakathi kwenkqubo ye-MES okanye ye-WMS.
Ixhasa ukucaca kwenkqubo, ukuchongwa kwebhetshi, kunye nolawulo lwempahla.

Ibhokisi ye-FOSB - Itheyibhile yeeNkcukacha eziDibeneyo

Udidi	Into	Ixabiso
Izixhobo	Uqhagamshelwano lweSitya esisicaba	I-Polycarbonate
Izixhobo	Igobolondo, Ucango, Umqamelo wocango	I-Polycarbonate
Izixhobo	Isigcini sangasemva	I-Polybutylene Terephthalate
Izixhobo	Izibambo, I-Auto Flange, Iiphedi zoLwazi	I-Polycarbonate
Izixhobo	I-Gasket	I-Elastomer ye-Thermoplastic
Izixhobo	Ipleyiti ye-KC	I-Polycarbonate
Iinkcukacha	Umthamo	Iiwafer ezingama-25
Iinkcukacha	Ubunzulu	332.77 mm ±0.1 mm (13.10" ±0.005")
Iinkcukacha	Ububanzi	389.52 mm ±0.1 mm (15.33" ±0.005")
Iinkcukacha	Ubude	336.93 mm ±0.1 mm (13.26" ±0.005")
Iinkcukacha	Ubude beepakethi ezi-2	680 mm (26.77")
Iinkcukacha	Ububanzi beepakethi ezi-2	415 mm (16.34")
Iinkcukacha	Ukuphakama kweepakethi ezi-2	365 mm (14.37")
Iinkcukacha	Ubunzima (Ayinanto)	4.6 kg (10.1 lb)
Iinkcukacha	Ubunzima (Bupheleleyo)	7.8 kg (17.2 lb)
Ukuhambelana kweWafer	Ubungakanani beWafer	300 mm
Ukuhambelana kweWafer	Iphimbo	10.0 mm (0.39")
Ukuhambelana kweWafer	Iinqwelomoya	±0.5 mm (0.02") ukusuka kwi-nominal

Imizekelo yesicelo

Ii-FOSB zizixhobo ezibalulekileyo kwi-logistics and storage ye-300mm wafer. Zisetyenziswa kakhulu kwezi meko zilandelayo:

Utshintsho lweFab-to-Fab: Ukuhambisa ii-wafers phakathi kwezixhobo ezahlukeneyo zokwenza ii-semiconductor.
Ukuhanjiswa kweeFoundry: Ukuthutha ii-wafers ezigqityiweyo ukusuka kwimpahla yobugcisa ukuya kumthengi okanye kwindawo yokupakisha.
Uthungelwano lwe-OEM/OSAT: Kwiinkqubo zokupakisha nokuvavanya ezinikezelwa ngaphandle.
Indawo yokugcina kunye nokugcina impahla yomntu wesithathu: Gcina ii-wafers ezixabisekileyo ixesha elide okanye okwethutyana.
Ukudluliselwa kweWafer yangaphakathi: Kwiikhampasi ezinkulu ezisemgangathweni apho iimodyuli zokuvelisa ezikude ziqhagamshelwe nge-AMHS okanye ngothutho oluqhutywa ngesandla.

Kwimisebenzi yothutho lwehlabathi, ii-FOSB ziye zaba ngumgangatho wothutho lwe-wafer olunexabiso eliphezulu, ziqinisekisa ukuhanjiswa ngaphandle kongcoliseko kumazwekazi.

I-FOSB vs. I-FOUP – Yintoni umahluko?

Uphawu	I-FOSB (Ibhokisi yoThutho eVula ngaphambili)	I-FOUP (I-Unified Pod evulekileyo ngaphambili)
Ukusetyenziswa Okuphambili	Ukuthunyelwa kwe-wafer kunye ne-logistics phakathi kwe-fab	Ukudluliselwa kwe-wafer ekwi-fab kunye nokucubungula ngokuzenzekelayo
Ulwakhiwo	Isikhongozeli esiqinileyo nesivaliweyo esinokhuseleko olongezelelweyo	I-pod ephinda isetyenziswe yenzelwe ukuzenzekela ngaphakathi
Umoya oqinileyo	Ukusebenza okuphezulu kokutywina	Yenzelwe ukufikelela lula, ayinamoya ungangeni kakhulu
Ubuninzi bokusetyenziswa	Phakathi (kugxilwe ekuthuthweni okukhuselekileyo komgama omde)	I-frequency ephezulu kwimigca yemveliso ezenzekelayo
Umthamo weWafer	Ngokwesiqhelo iiwafer ezingama-25 kwibhokisi nganye	Ngokwesiqhelo iiwafer ezingama-25 kwipod nganye
Inkxaso yokuZenzekelayo	Iyahambelana nezivuli ze-FOSB	Idityaniswe neeports zomthwalo zeFOUP
Ukuthobela imithetho	I-SEMI E47, E62	I-SEMI E47, E62, E84, kunye nokunye

Nangona zombini zisebenza indima ebalulekileyo kwi-wafer logistics, ii-FOSB zenzelwe ukuthunyelwa okuqinileyo phakathi kwee-fabs okanye kubathengi bangaphandle, ngelixa ii-FOUP zigxile kakhulu ekusebenzeni kakuhle kwemigca yemveliso ezenzekelayo.

Imibuzo Ebuzwa Rhoqo (Imibuzo Ebuzwa Rhoqo)

Umbuzo 1: Ngaba ii-FOSB zingasetyenziswa kwakhona?
Ewe. IiFOSB ezisemgangathweni ophezulu zenzelwe ukusetyenziswa ngokuphindaphindiweyo kwaye zinokumelana neziganeko ezininzi zokucoca nokuphatha ukuba zigcinwa kakuhle. Ukucoca rhoqo ngezixhobo eziqinisekisiweyo kuyacetyiswa.

Umbuzo 2: Ngaba ii-FOSB zingenziwa ngokwezifiso ukuze ziphawulwe okanye zilandelwe?
Ngokuqinisekileyo. IiFOSB zinokwenziwa ngokwezifiso ngeelogo zabathengi, iithegi zeRFID ezithile, ukutywinwa kokungafumi, kunye nemibala eyahlukeneyo ukuze kube lula ukulawula izinto ezifunekayo.

Umbuzo 3: Ngaba ii-FOSB zifanelekile kwiindawo zokucoca?
Ewe. IiFOSB zenziwe ngeeplastiki ezicocekileyo kwaye zitywinwe ukuthintela ukuveliswa kweesuntswana. Zifanelekile kwiindawo zokucoca zeClass 1 ukuya kwiClass 1000 kunye neendawo ezibalulekileyo ze-semiconductor.

Umbuzo 4: Zivulwa njani ii-FOSB ngexesha lokuzenzekela?
Ii-FOSB ziyahambelana nezivuli ze-FOSB ezikhethekileyo ezisusa ucango lwangaphambili ngaphandle kokuthintana ngesandla, zigcina imeko yegumbi elicocekileyo icocekile.

Ngathi

I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.