Umatshini wesikwere wesitishi esiphindwe kabini ukucubungula intonga ye-silicon e-monocrystalline 6/8/12 intshi umphezulu othe tyaba Ra≤0.5μm

Inkcazo emfutshane:

Umatshini wesikwere se-silicon esiphindwe kabini se-monocrystalline sisixhobo esisebenzayo sokucubungula ii-silicon rods ze-monocrystalline (i-Ingot). Wamkela uyilo lokusebenza oluhambelanayo lwe-double station kwaye unokusika ii-silicon rods ezimbini ngaxeshanye, nto leyo ephucula kakhulu ukusebenza kakuhle kwemveliso. Esi sixhobo sicubungula ii-silicon rods zesilinda zibe ziibhloko ze-silicon zesikwere/ezi-quasi-square (i-Grit) ngokusebenzisa ubuchwepheshe bokusika ucingo lwedayimani okanye ii-blades zesarha zangaphakathi ezijikelezayo, silungiselela ukunqunyulwa okulandelayo (njengokwenza ii-silicon wafers), kwaye sisetyenziswa kakhulu kwiikhonkco zokucubungula izinto ze-silicon kumashishini e-photovoltaic kunye ne-semiconductor.

Thumela i-imeyile kuthi

Iimbonakalo

Iimpawu zezixhobo:

(1) Ukucubungula ngaxeshanye kwesitishi esiphindwe kabini
· Ukusebenza kabini: Ukucubungula ngaxeshanye iintonga ezimbini ze-silicon (Ø6"-12") kwandisa imveliso nge-40%-60% xa kuthelekiswa nezixhobo ze-Simplex.

· Ulawulo oluzimeleyo: Isitishi ngasinye sinokuzilungisa ngokwaso iiparameter zokusika (uxinzelelo, isantya sokutya) ukuze zilungelelanise neenkcukacha ezahlukeneyo zentonga yesilicon.

(2) Ukusika ngokuchanekileyo
· Ukuchaneka kobukhulu: ukunyamezelana komgama osecaleni webha yesikwere ± 0.15mm, uluhlu ≤0.20mm.

· Umgangatho womphezulu: ukuqhekeka komphetho osikiweyo <0.5mm, kunciphisa ubungakanani bokugaywa okulandelayo.

(3) Ulawulo olukrelekrele
· Ukusika okuhlengahlengiswayo: ukujonga ngexesha langempela imo yentonga yesilicon, uhlengahlengiso oluguquguqukayo lwendlela yokusika (njengokucubungula intonga yesilicon egobileyo).

· Ukulandeleka kwedatha: bhala phantsi iiparameter zokucubungula zentonga nganye yesilicon ukuxhasa ukufakwa kwenkqubo ye-MES.

(4) Ixabiso eliphantsi lokusetyenziswa
· Ukusetyenziswa kwentambo yedayimani: ≤0.06m/mm (ubude bentonga yesilicon), ububanzi bentambo ≤0.30mm.

· Ukujikeleza kwe-coolant: Inkqubo yokucoca yandisa ubomi benkonzo kwaye inciphisa ukulahlwa kolwelo olungcolileyo.

Iingenelo zobuchwepheshe kunye nophuhliso:

(1) Ukusika ukwenziwa ngcono kwetekhnoloji
- Ukusika ngemigca emininzi: Imigca yedayimani eli-100-200 isetyenziswa ngaxeshanye, kwaye isantya sokusika si-≥40mm/min.

- Ulawulo loxinzelelo: Inkqubo yokulungisa iluphu evaliweyo (±1N) ukunciphisa umngcipheko wokuqhekeka kwentambo.

(2) Ulwandiso lokuhambelana
- Ukulungelelaniswa kwezinto: Ixhasa i-silicon ye-monocrystalline yohlobo lwe-P/N, ehambelana ne-TOPCon, i-HJT kunye nezinye iintambo ze-silicon zebhetri ezisebenzayo kakhulu.

- Ubungakanani obuguquguqukayo: ubude bentonga yesilicon yi-100-950mm, umgama wentonga yesikwere ecaleni yi-166-233mm enokulungiseka.

(3) Uphuculo lwe-automation
- Ukulayisha nokukhulula iirobhothi: ukulayisha/ukukhulula iintonga zesilicon ngokuzenzekelayo, ukubetha imizuzu eyi-≤3.

- Ukuxilongwa okukrelekrele: Ukulungiswa kwangaphambili ukuze kuncitshiswe ixesha lokungasebenzi elingacwangciswanga.

(4) Ubunkokeli kushishino
- Inkxaso yeWafer: ingacubungulwa i-silicon eyi-≥100μm ebhityileyo kakhulu ngeentonga zesikwere, izinga lokuqhekeka <0.5%.

- Ukuphuculwa kokusetyenziswa kwamandla: Ukusetyenziswa kwamandla ngeyunithi nganye yentonga yesilicon kuncitshiswa ngama-30% (xa kuthelekiswa nezixhobo zemveli).

Iiparameter zobugcisa:

Igama lepharamitha	Ixabiso lesalathiso
Inani leebha ezicutshungulweyo	Iziqwenga ezi-2/iseti
Uluhlu lobude bebha yokucubungula	100~950mm
Uluhlu lomda womatshini	166 ~ 233mm
Isantya sokusika	≥40mm/ngomzuzu
Isantya sentambo yedayimani	0~35m/s
Ububanzi bedayimani	0.30 mm okanye ngaphantsi
Ukusetyenziswa komgca	0.06 m/mm okanye ngaphantsi
Ububanzi bentonga ejikelezayo ehambelanayo	Ububanzi bentonga yesikwere egqityiweyo +2mm, Qinisekisa izinga lokupasa lokupholisha
Ulawulo lokwaphuka oluphambili	Umphetho oluhlaza ≤0.5mm, Akukho zitshiphu, umgangatho ophezulu womphezulu
Ubude be-arc bufana	Uluhlu lweprojektha <1.5mm, Ngaphandle kokuphazamiseka kwentonga yesilicon
Ubukhulu bomatshini (umatshini omnye)	4800×3020×3660mm
Amandla apheleleyo alinganisiweyo	56kW
Ubunzima obungapheliyo bezixhobo	12t

Itheyibhile yesalathisi sokuchaneka kweMishini:

Into echanekileyo	Uluhlu lokunyamezelana
Ukunyamezela umda webha yesikwere	± 0.15mm
Uluhlu lomphetho webha yesikwere	≤0.20mm
I-engile kumacala onke entonga yesikwere	90°±0.05°
Ubungangamsha bentonga yesikwere	≤0.15mm
Ukuchaneka kokubeka okuphindaphindiweyo kwerobhothi	± 0.05mm

Iinkonzo ze-XKH:

I-XKH ibonelela ngeenkonzo zomjikelo opheleleyo kwiimashini ze-silicon ezimbini ze-mono-crystalline, kubandakanya ukwenziwa ngokwezifiso kwezixhobo (ezihambelana neentonga ezinkulu ze-silicon), ukugunyaziswa kwenkqubo (ukwenziwa ngcono kweeparameter zokusika), uqeqesho lokusebenza kunye nenkxaso emva kokuthengisa (ubonelelo lwezixhobo eziphambili, ukuxilongwa okukude), ukuqinisekisa ukuba abathengi bafumana isivuno esiphezulu (>99%) kunye nemveliso yeendleko eziphantsi zokusetyenziswa, kunye nokubonelela ngohlaziyo lobuchwephesha (njengokwenziwa ngcono kokusika i-AI). Ixesha lokuhambisa liziinyanga ezi-2-4.