Umatshini wokusika iingcingo ezintathu zeDayimane kwiSitolo esinye seSi Wafer/Optical Glass Material Cutting

Inkcazo emfutshane:

Umatshini wokusika iingcingo ezintathu zeDiamond Wire One-Station sisixhobo sokucubungula ngokuchanekileyo esenzelwe ukuqhekeza ngokufanelekileyo izinto ezibuthathaka ezifana nesafire, ijade, kunye neeseramikhi. Usebenzisa ucingo lwentsimbi oluhlala lugqunywe yidayimani njengesixhobo sokusika, kunye neendawo zokusebenzela ezintathu ezahlulwe ngokwahlukeneyo ezivumela ukusika okuvumelanisiweyo, ukondla/ukuqengqeleka kwentambo, kunye nokulawula uxinzelelo. Iimoto zeServo ziqhuba intshukumo yokubuyisela ucingo, ngelixa inkqubo yempendulo evaliweyo ilungisa uxinzelelo (±0.5N ngokuchanekileyo), inciphisa ukusetyenziswa kwentambo (<0.1%) kwaye iqinisekisa uzinzo lwenkqubo. Indawo yokusika yahlulwe ngokwasemzimbeni kwindawo yokusebenza, ine-interface yolondolozo evulekileyo yokutshintshwa kwentambo ngokukhawuleza (ubude obuphezulu ≤150m) kunye nokulungiswa kwecandelo (umz., amavili esikhokelo, iipulleys zoxinzelelo). Iinkcukacha eziphambili ziquka ubungakanani bomsebenzi obuyi-600×600mm, isantya sokusika esiyi-400-1200mm/h, ubukhulu bomthamo obuyi-0-800mm, kunye namandla apheleleyo ayi-≤23kW, nto leyo eyenza ukuba ilungele ukunqunyulwa ngokuchanekileyo kwe-semiconductor substrates, iikristale ze-optical, kunye nezixhobo ezintsha zamandla.

Thumela i-imeyile kuthi

Iimbonakalo

Intshayelelo yeMveliso

Umatshini wokusika ucingo lwedayimani oneziteshi ezintathu zokusika ucingo olunye sisixhobo sokusika esichanekileyo nesisebenza kakuhle kakhulu esenzelwe izinto eziqinileyo neziqhekekayo. Usebenzisa ucingo lwedayimani njengendlela yokusika kwaye ufanelekile ekucutshungulweni ngokuchanekileyo kwezinto ezinobunzima obuphezulu ezifana nee-silicon wafers, i-sapphire, i-silicon carbide (SiC), iiseramikhi, kunye neglasi ebonakalayo. Lo matshini uneesitishi ezintathu zokusika, kwaye uvumela ukusika ngaxeshanye izinto ezininzi zokusebenza kwisixhobo esinye, nto leyo ephucula kakhulu ukusebenza kakuhle kwemveliso kwaye inciphisa iindleko zokuvelisa.

Umgaqo Wokusebenza

Ukusikwa kwentambo yedayimani: Kusebenzisa ucingo lwedayimani olufakwe ngombane okanye olubotshelelwe nge-resin ukwenza ukusika okusekelwe ekugayweni ngesantya esiphezulu sokujikeleza.
Ukusika okuNxibelelanayo kweZitishi Ezintathu: Kuxhotyiswe ngeendawo zokusebenza ezintathu ezizimeleyo, okuvumela ukusika ngaxeshanye kweziqwenga ezintathu ukuphucula amandla okusebenza.
Ulawulo Loxinzelelo: Luquka inkqubo yolawulo loxinzelelo oluchanekileyo kakhulu ukugcina uxinzelelo oluzinzileyo lwentambo yedayimani ngexesha lokusika, ukuqinisekisa ukuchaneka.
Inkqubo Yokupholisa Nokuthambisa: Isebenzisa amanzi angenawo i-ion okanye i-coolant ekhethekileyo ukunciphisa umonakalo wobushushu kunye nokwandisa ubomi bentambo yedayimani.

Iimpawu zezixhobo

Ukusika Okuchanekileyo: Kufikelela ekuchanekeni kokusika kwe-±0.02mm, kulungele ukucutshungulwa kwe-wafer ebhityileyo kakhulu (umz., ii-wafer ze-silicon ze-photovoltaic, ii-wafer ze-semiconductor).
Ukusebenza Kakhulu: Uyilo lwezitishi ezintathu lunyusa imveliso ngaphezulu kwama-200% xa kuthelekiswa noomatshini besitishi esinye.
Ukulahleka Okuphantsi Kwezinto Ezisetyenziswayo: Uyilo oluncinci lwe-kerf (0.1–0.2mm) lunciphisa inkunkuma yezinto ezisetyenziswayo.
Ukwenziwa kwezinto ngokuzenzekelayo okuphezulu: Kubandakanya iinkqubo zokulayisha, ukulungelelanisa, ukusika, kunye nokukhupha izinto ngokuzenzekelayo, nto leyo enciphisa ukungenelela ngesandla.
Ukuguquguquka Okuphezulu: Iyakwazi ukusika izinto ezahlukeneyo eziqinileyo nezibuthathaka, kuquka i-monocrystalline silicon, i-polycrystalline silicon, i-sapphire, i-SiC, kunye ne-ceramics.

Iingenelo zobugcisa

Inzuzo

Inkcazo

Ukusika okuNxulumeneyo kwiZitishi ezininzi

Izikhululo ezintathu ezilawulwa ngokuzimeleyo zivumela ukusika izinto zokusebenza ezinobukhulu obahlukeneyo okanye izixhobo, nto leyo ephucula ukusetyenziswa kwezixhobo.

Ulawulo lweNgxaki oluBukrelekrele

Ulawulo oluvaliweyo oluneemoto ze-servo kunye neesensa luqinisekisa uxinzelelo lwentambo oluqhubekayo, luthintela ukwaphuka okanye ukuphambuka kokusika.

Ulwakhiwo oluqinileyo

Izikhokelo ezichanekileyo zomgca kunye neenkqubo eziqhutywa yi-servo ziqinisekisa ukusika okuzinzileyo kunye nokunciphisa iziphumo zokungcangcazela.

Ukusebenza kakuhle kwamandla kunye nokusingqongileyo

Xa kuthelekiswa nokusika udaka kwendabuko, ukusika ucingo lwedayimani akunangcoliseko, kwaye isibandisi sinokuphinda sisetyenziswe, nto leyo enciphisa iindleko zonyango lwenkunkuma.

Ukubeka iliso okukrelekrele

Ixhotyiswe nge-PLC kunye neenkqubo zolawulo lwesikrini sokuchukumisa ukuze ijonge isantya sokusika, uxinzelelo, ubushushu, kunye nezinye iiparameter ngexesha langempela, ixhasa ukulandelelwa kwedatha.

Iinkcukacha zoBugcisa

Imodeli	Umatshini wokusika umgca omnye wedayimani yesitishi ezintathu
Ubungakanani obukhulu bomsebenzi	600*600mm
Isantya sokusebenza kwentambo	1000 (XIX) m/min
Ububanzi bentambo yedayimani	0.25-0.48mm
Umthamo wokugcina umgca wevili lokuhambisa	20km
Uluhlu lokusika ubukhulu	0-600mm
Ukuchaneka kokusika	0.01mm
Ukunyuka okuthe nkqo kwendawo yokusebenza	800mm
Indlela yokusika	Izinto azishukumi, kwaye ucingo lwedayimani luyashukuma luze luhle
Isantya sokusika ukutya	0.01-10mm/min (Ngokwezinto eziphathekayo kunye nobukhulu)
Itanki yamanzi	150L
Ulwelo lokusika	Ulwelo lokusika olusebenza kakuhle kakhulu oluchasene nomhlwa
I-engile yokujika	±10°
Isantya sokujika	25°/s
Uxinzelelo olukhulu lokusika	88.0N (Seta ubuncinci iyunithi 0.1n)
Ubunzulu bokusika	200~600mm
Yenza iipleyiti zokudibanisa ezihambelanayo ngokwendlela yokusika yomthengi	-
Indawo yokusebenzela	3
Ukunikezwa Amandla	Intambo yesihlanu yesigaba sesithathu i-AC380V/50Hz
Amandla apheleleyo esixhobo somatshini	≤32kw
Injini ephambili	1*2kw
Injini yocingo	1*2kw
Injini yokujika yebhentshi yokusebenza	0.4*6kw
Injini yokulawula uxinzelelo	4.4 * 2kw
Imoto yokukhupha iingcingo kunye nokuqokelela	5.5*2kw
Ubukhulu bangaphandle (ngaphandle kwebhokisi yengalo yerocker)	485921902184mm
Ubukhulu bangaphandle (kubandakanya ibhokisi yengalo yerocker)	485921902184mm
Ubunzima bomatshini	3600ka

IiNdawo zeSicelo

Ishishini le-Photovoltaic: Ukusikwa kwee-ingots ze-silicon ze-monocrystalline kunye ne-polycrystalline ukuphucula isivuno se-wafer.
Ishishini leSemiconductor: Ukusikwa ngokuchanekileyo kwee-wafer zeSiC kunye neGaN.
Ishishini le-LED: Ukusika ii-substrates zesafire zokwenziwa kweetships ze-LED.
Iiceramics eziPhambili: Ukwenza nokusika iiceramics ezisebenza kakuhle njenge-alumina kunye ne-silicon nitride.
Iglasi Ebonakalayo: Ukulungiswa ngokuchanekileyo kweglasi ebhityileyo kakhulu kwiilensi zekhamera kunye neefestile ze-infrared.