Idayimani yocingo lweSikhululo esiNye esiNdwe ngocingo oluNye umatshini wokusika weSi Wafer/Optical Glass Material Cutting

Idayimani yocingo lweSikhululo esiNye esiNdwe ngumatshini wokusika weSi Wafer/Optical Glass Material Cutting Featured Image

Inkcazelo emfutshane:

Umatshini wokusika weDayimane weZikhululo eziNtathu zocingo oluNye sisixhobo sokusetyenzwa esichanekileyo esenzelwe isikweri esisebenzayo semathiriyeli enqabileyo efana nesafire, ijeyidi, kunye neeseramikhi. Isebenzisa intambo yentsimbi egqunywe ngedayimane eqhubekayo njengendawo yokusika, eneendawo zokusebenza ezintathu ezahlulahlulwe ngokuzimeleyo ezivumela ukusika okudityanisiweyo, ukutyisa ucingo / ukurhoxa, kunye nolawulo loxinzelelo. Ii-motor ze-Servo ziqhuba i-wire's reciprocating motion, ngelixa inkqubo yempendulo ye-loop evaliweyo iguqulela ngokukhawuleza ukuxhatshazwa (± 0.5N ukuchaneka), ukunciphisa ukusetyenziswa kocingo (<0.1%) kunye nokuqinisekisa ukuzinza kwenkqubo. Indawo yokusika yodwa ngokwasemzimbeni ukusuka kwindawo yokusebenza, ebonisa ujongano oluvulelekileyo lokugcinwa kofikelelo lokutshintshwa kocingo olukhawulezayo (ubude obude ≤150m) kunye nenkonzo yecandelo (umz., amavili esikhokelo, iipuli zoxinzelelo). Iimpawu eziphambili zibandakanya ubungakanani bomsebenzi we-600 × 600mm, isantya sokusika se-400-1200mm / h, umthamo we-0-800mm, kunye namandla apheleleyo ≤23kW, okwenza kube yinto efanelekileyo yokucoca i-semiconductor substrates, iikristale ezibonakalayo, kunye nezinto ezintsha zamandla.

Thumela i-imeyile kuthi

Iimbonakalo

Intshayelelo yeMveliso

I-diamond wire ye-diamond ye-station ye-single-single cutting machine yinto ephezulu yokuchaneka kunye nezixhobo eziphezulu zokusika ezenzelwe izinto ezinzima kunye nezinqabileyo. Isebenzisa ucingo lwedayimani njengendawo yokusika kwaye ifanelekile ukusetyenzwa ngokuchanekileyo kwezixhobo ezinobunzima obuphezulu obunje ngee-silicon wafers, isafire, isilicon carbide (SiC), iiseramikhi, kunye neglasi yokukhanya. Ibandakanya uyilo lwezitishi ezintathu, lo matshini wenza ukusika ngaxeshanye kwezinto ezininzi zokusebenza kwisixhobo esinye, ukuphucula kakhulu ukusebenza kwemveliso kunye nokunciphisa iindleko zokuvelisa.

UmGaqo wokuSebenza

I-Diamond Wire Cutting: Isebenzisa i-electroplated okanye i-resin-bounded diamond wire ukwenza ukusika okusekelwe kwi-grinding ngokusebenzisa i-high-speed reciprocating motion.
Izitishi eziNtathu zokuSika i-Synchronous: Zixhotyiswe ngeendawo zokusebenza ezintathu ezizimeleyo, ezivumela ukusika ngaxeshanye kweziqwenga ezithathu ukunyusa umthamo.
Ulawulo lweTension: Ibandakanya inkqubo yokulawula ukunyanzeliswa kwe-high-chane-chane ukugcina ukuqina kocingo lwedayimani oluzinzile ngexesha lokusika, ukuqinisekisa ukuchaneka.
Ukupholisa kunye neNkqubo yokuthambisa: Iqeshe amanzi adiyiniweyo okanye isisipholisi esikhethekileyo ukunciphisa umonakalo oshushu kunye nokwandisa ubomi bocingo lwedayimani.

Iimpawu zeZixhobo

Ukusika okuchanekileyo okuPhezulu: Ifezekisa ukuchaneka kokusika kwe-± 0.02mm, ilungele ukulungiswa kwe-wafer ye-ultra-thin (umzekelo, ii-photovoltaic silicon wafers, i-semiconductor wafers).
Ukusebenza okuphezulu: Uyilo lwezikhululo ezithathu zonyusa imveliso ngaphezulu kwe-200% xa kuthelekiswa noomatshini besikhululo esinye.
Ilahleko yezinto eziPhantsi: Uyilo lwe-kerf emxinwa (0.1–0.2mm) lunciphisa inkunkuma yezinto.
I-Automation ephezulu: Ifaka ukulayishwa ngokuzenzekelayo, ukulungelelaniswa, ukusika, kunye nokukhulula iinkqubo, ukunciphisa ukungenelela kwesandla.
Ukuguquguquka okuphezulu: Ukukwazi ukusika izinto ezahlukeneyo ezinzima kunye neziqhekezayo, kubandakanya isilicon ye-monocrystalline, isilicon yepolycrystalline, isafire, iSiC, kunye neeseramikhi.

Izinto eziluncedo kwezobuGcisa

Inzuzo

Inkcazo

Multi-Station Synchronous Cutting

Izikhululo ezintathu ezizimeleyo ezilawulwa ngokuzimeleyo zenza ukusika i-workpieces ezinobunzima obahlukeneyo okanye izinto, ukuphucula ukusetyenziswa kwezixhobo.

Intelligent Tension Control

Ukulawulwa kwe-loop evaliweyo kunye ne-servo motors kunye ne-sensors iqinisekisa ukunyanzeliswa kocingo rhoqo, ukuthintela ukuphuka okanye ukusika ukuphambuka.

High-Rigidity Ulwakhiwo

Izikhokelo zomgca ezichanekileyo eziphezulu kunye neenkqubo eziqhutywa yi-servo ziqinisekisa ukusika okuzinzile kunye nokunciphisa iziphumo zokungcangcazela.

UkuSebenza kwamandla kunye noBungane be-Eco

Xa kuthelekiswa nokusikwa kodaka lwendalo, ukusika ucingo lwedayimani akungcoliseki, kwaye into yokupholisa inokuphinda isetyenziswe, kucuthwe iindleko zokucocwa kwenkunkuma.

Ukubeka esweni okukrelekrele

Ixhotyiswe nge-PLC kunye neenkqubo zokulawula isikrini se-touch-screen ukujonga ixesha lokwenyani lokusika isantya, uxinzelelo, ubushushu, kunye nezinye iiparitha, ezixhasa ukulandelwa kwedatha.

Inkcazo yobuGcisa

Umzekelo	Isikhululo sedayimani ezintathu umatshini wokusika umgca omnye
Ubungakanani bobungakanani bomsebenzi omkhulu	600*600mm
Isantya sokubaleka kocingo	1000 (MIX) m/m
Idayimani yocingo lwedayimani	0.25-0.48mm
Umthamo wokugcina umgca wevili lokubonelela	20km
Ukusika uluhlu lokutyeba	0-600mm
Ukusika ukuchaneka	0.01mm
Ukubetha ngokuthe nkqo kwindawo yokusebenzela	800mm
Indlela yokusika	Izinto eziphathekayo zimile, kwaye ucingo lwedayimane luyashukuma kwaye luhla
Ukusika isantya feed	0.01-10mm/min (Ngokwemathiriyeli kunye nobukhulu)
Itanki yamanzi	150L
Ukusika ulwelo	Anti-rust high-efficiency ukusika ulwelo
I-engile yokujingi	±10°
Isantya sojingi	25°/s
Ubuninzi bexinzelelo lokusika	88.0N (Seta ubuncinane iyunithi0.1n)
Ukusika ubunzulu	200 ~ 600mm
Yenza iipleyiti ezihambelanayo ngokuhambelana noluhlu lokusika lomthengi	-
Indawo yokusebenzela	3
Ukunikezwa Amandla	Isigaba sesithathu socingo lwe-AC380V/50Hz
Amandla onke esixhobo somatshini	≤32kw
Injini engundoqo	1*2kw
Injini yocingo	1*2kw
Workbench swing motor	0.4*6kw
Injini yokulawula uxinzelelo	4.4*2kw
Ukukhutshwa kweengcingo kunye nemoto yokuqokelela	5.5*2kw
Imilinganiselo yangaphandle (ngaphandle kwebhokisi yengalo yerocker)	485921902184mm
Imilinganiselo yangaphandle (kuquka ibhokisi yengalo yerocker)	485921902184mm
Ubunzima bomatshini	3600ka

Iinkalo zeSicelo

Ishishini le-Photovoltaic: Ukusika i-monocrystalline kunye ne-polycrystalline ingots ye-silicon ukuphucula isivuno se-wafer.
Ishishini leSemiconductor: Ukusikwa ngokuchanekileyo kwee-SiC kunye nee-wafers ze-GaN.
Ishishini le-LED: Ukusika isafire substrates ukwenzela ukwenziwa kweetshiphu ze-LED.
IiCeramics eziPhezulu: Ukwenza kunye nokusika iiseramikhi eziphezulu zokusebenza njenge-alumina kunye ne-silicon nitride.
Iglasi yeOptical: Ukusetyenzwa ngokuchanekileyo kweglasi ecwecwe kakhulu kwiilensi zekhamera kunye neefestile ze-infrared.