Ibhokisi yesikwere yokuthutha ibhokisi yesikwere yokuthutha isiqwenga sefestile yesikwere

Iingenelo zee-wafers zokuthumela kwiibhokisi zokuthumela ezisikwere ziquka:

1--Ukusetyenziswa kwendawo ephezulu: Iibhokisi zokuthumela ezisikwere zihlala ziyilelwe ukuba zibe ncinci kakhulu, zivumela ukusetyenziswa kakuhle kwendawo yokuthumela kunye nendawo yokugcina izinto kunye nokunciphisa inkunkuma.

2--Uzinzo: Iibhokisi zokuthumela ezisikwere zihlala zenzelwe ukubonelela ngesakhiwo esizinzileyo senkxaso esinceda ukukhusela ii-wafers ekungcangcazeleni nasekuthukeni.

3--Ukubeka izinto ngokulula: Ngenxa yesimo seebhokisi zokuthumela ezisikwere, zihlala zinokubekwa ndawonye ngokulula ukuze kongiwe indawo yokugcina izinto kunye nendawo yokuthutha.

4--Ukulula kokuphatha ngokuzenzekelayo: Ukuma kunye noyilo lweebhokisi zokuhambisa ezisikwere kwenza kube lula ukuziqhelanisa neenkqubo zokuphatha ngokuzenzekelayo, nto leyo eyonyusa imveliso.

Lilonke, iibhokisi zokuthumela ezisikwere zibonelela ngokusebenza kakuhle, uzinzo kunye nokusetyenziswa kwendawo xa kuthuthwa ii-wafers, nto leyo ezenza zibe sisitya esiqhelekileyo sokuthumela ii-wafers.

Zenziwe ngezinto ze-ABS ezihlala ixesha elide kwaye zineendawo ezingama-25, ezi bhokisi zokugcina zibonelela ngendawo eyaneleyo yokucwangcisa nokukhusela ii-wafers ngexesha lokuphathwa nokuthuthwa. Ngokwakhiwa kwazo okuqinileyo kunye noyilo oluchanekileyo, iibhokisi zethu zokuthumela ii-wafers ziqinisekisa ukuba ii-wafers zithuthwa ngokukhuselekileyo ukuya kwindawo eziya kuyo, zigcina ukuthembeka kwazo kunye nomgangatho wazo kulo lonke uhambo lwazo. Zilungele izakhiwo zokwenza ii-semiconductor kunye neelabhoratri zophando, ezi bhokisi zokugcina zibonelela ngesisombululo esithembekileyo sokugcina nokuthutha ii-wafers ngokulula nangokulula.