Isiseko sobhedu esinye sekristale Cu wafer 5x5x0.5/1mm 10x10x0.5/1mm 20x20x0.5/1mm

Isiseko sobhedu esinye ikristale Cu wafer 5x5x0.5/1mm 10x10x0.5/1mm 20x20x0.5/1mm Umfanekiso ofakiweyo

Inkcazelo emfutshane:

I-substrates yethu yobhedu kunye neewafers zenziwe kwi-high-purity copper (99.99%) kunye nesakhiwo esisodwa se-crystal, esinikezela ngokugqwesileyo kombane kunye ne-thermal conductivity. Ezi ziqwenga zifumaneka kwi-cubic orientation ye- <100>, <110>, kunye ne-<111>, izenza zibe zilungele izicelo kwi-high-performance electronics kunye ne-semiconductor production. Ngemilinganiselo ye-5 × 5 × 0.5 mm, 10 × 10 × 1 mm, kunye ne-20 × 20 × 1 mm, ii-substrates zethu zobhedu ziyakwazi ukulungelelanisa ukuhlangabezana neemfuno ezahlukeneyo zobugcisa. Iparamitha yelathisi yezi ziphako zekristale enye yi-3.607 Å, iqinisekisa ingqibelelo echanekileyo yolwakhiwo lwesixhobo esiphucukileyo. Izinketho zomphezulu ziquka i-single-side polished (SSP) kunye ne-double-side polished (DSP) ezigqityiweyo, ukubonelela ukuguquguquka kweenkqubo ezahlukeneyo zokuvelisa.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Inkcazo

Ngenxa yokumelana nokushisa okuphezulu kunye nokuqina komatshini, i-substrates zethusi zisetyenziswa ngokubanzi kwi-microelectronics, iinkqubo zokutshatyalaliswa kobushushu kunye nobuchwepheshe bokugcina amandla, apho ulawulo olufanelekileyo lwe-thermal kunye nokuthembeka kubaluleke kakhulu. Ezi zakhiwo zenza i-copper substrates ibe yinto ephambili kwizicelo ezininzi zeteknoloji ephezulu.
Ezi zezinye zeempawu zekristale enye yobhedu:I-conductivity yombane egqwesileyo, i-conductivity yesibini emva kwesilivere. I-thermal conductivity ilungile kakhulu, kwaye i-thermal conductivity iyona nto ingcono phakathi kweentsimbi eziqhelekileyo. Ukusebenza kakuhle kokusebenza, kunokuqhuba iintlobo ezahlukeneyo ze-metallurgical processing technology.Ukumelana nokubola kuhle, kodwa ezinye iindlela zokukhusela zisafuneka.Ixabiso elihambelanayo liphantsi, kwaye ixabiso linoqoqosho ngakumbi kwizinto ze-metal substrate.
I-substrate ye-Copper isetyenziswa ngokubanzi kumashishini ahlukeneyo ngenxa ye-conductivity yayo egqwesileyo yombane, i-thermal conductivity kunye namandla omatshini. Ezi zilandelayo zicelo eziphambili ze-copper substrate:
1. Ibhodi yesekethe ye-elektroniki: i-copper foil substrate material njengebhodi yesekethe eprintiweyo (PCB). Isetyenziselwa ibhodi yesekethe ye-high density interconnect, ibhodi yesekethe eguquguqukayo, njl.njl Ine-conductivity efanelekileyo kunye neempawu zokutshatyalaliswa kobushushu kwaye ifanelekile kwizixhobo zombane zamandla aphezulu.

2. Izicelo zolawulo lwe-Thermal: isetyenziswe njenge-substrate yokupholisa izibane ze-LED, i-electronics yamandla, njl. Ukuvelisa ukutshintshwa kobushushu obuhlukeneyo, ii-radiator kunye nezinye izinto zokulawula ukushisa. I-conductivity egqwesileyo ye-thermal yobhedu isetyenziselwa ukuqhuba kunye nokuchitha ukushisa ngokufanelekileyo.

3. Ukusetyenziswa kwe-electromagnetic shielding: njengeqokobhe lesixhobo sombane kunye nomaleko okhuselayo, ukunika isikhuselo esisebenzayo sombane. Isetyenziselwa iifowuni eziphathwayo, iikhompyuter kunye nezinye iimveliso ze-elektroniki zeqokobhe letsimbi kunye nomaleko okhuselayo wangaphakathi. Ngokusebenza kakuhle kwe-electromagnetic shielding, kunokuthintela ukuphazamiseka kwe-electromagnetic.

4.Ezinye izicelo: njengesixhobo sesekethe esiqhutywayo sokwakha iinkqubo zombane. Isetyenziswa ekwenziweni kwezixhobo zombane ezahlukeneyo, iimotor, iziguquli kunye nezinye izinto zombane. Njengezinto zokuhombisa, sebenzisa iimpawu zayo ezilungileyo zokulungisa.

Sinokwenza ngokwezifiso iinkcukacha ezahlukeneyo, ubukhulu kunye neemilo zeCopper Single crystal substrate ngokweemfuno ezithile zabathengi.

Idayagram eneenkcukacha