I-Copper substrate enye yekristale yeCu wafer 5x5x0.5/1mm 10x10x0.5/1mm 20x20x0.5/1mm

Inkcazo emfutshane:

Ii-substrates zethu ze-copper kunye nee-wafers zenziwe nge-copper ecocekileyo kakhulu (99.99%) enesakhiwo sekristale enye, enika ukuhanjiswa kombane kunye nobushushu obuhle kakhulu. Ezi wafers zifumaneka kwiindlela ze-cubic ze-<100>, <110>, kunye ne-<111>, nto leyo eyenza ukuba zilungele ukusetyenziswa kwimveliso ye-elektroniki esebenza kakhulu kunye ne-semiconductor. Ngobukhulu be-5×5×0.5 mm, 10×10×1 mm, kunye ne-20×20×1 mm, ii-substrates zethu ze-copper zinokwenziwa ngokwezifiso ukuhlangabezana neemfuno zobugcisa ezahlukeneyo. Ipharamitha ye-lattice yezi wafers ze-crystal enye yi-3.607 Å, eqinisekisa ukuthembeka kwesakhiwo ngokuchanekileyo sokwenza izixhobo eziphambili. Iinketho zomphezulu ziquka ukugqitywa kwe-single-side polished (SSP) kunye ne-double-side polished (DSP), ebonelela ngokuguquguquka kwiinkqubo ezahlukeneyo zokuvelisa.

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Inkcazo

Ngenxa yokumelana kwayo nobushushu obuphezulu kunye nokuqina koomatshini, ii-substrates zekopolo zisetyenziswa kakhulu kwi-microelectronics, kwiinkqubo zokusasaza ubushushu kunye nobuchwepheshe bokugcina amandla, apho ulawulo olufanelekileyo lobushushu kunye nokuthembeka kubaluleke kakhulu. Ezi mpawu zenza ii-substrates zekopolo zibe yinto ephambili kwizicelo ezininzi zobuchwepheshe obuphambili.
Ezi zezinye zeempawu ze-substrate yekristale enye yobhedu: Ukuqhuba kombane okugqwesileyo, ukuqhuba kombane kukwindawo yesibini emva kwesilivere. Ukuqhuba kobushushu kulungile kakhulu, kwaye ukuqhuba kobushushu yeyona nto ilungileyo phakathi kweentsimbi eziqhelekileyo. Ukusebenza kakuhle kokucubungula, kunokuqhuba iintlobo ngeentlobo zobuchwepheshe bokucubungula isinyithi. Ukumelana nokugqwala kulungile, kodwa kusafuneka amanyathelo okukhusela. Ixabiso liphantsi, kwaye ixabiso liphantsi kakhulu kwizinto zesinyithi.
I-substrate ye-copper isetyenziswa kakhulu kumashishini ahlukeneyo ngenxa yokuqhuba kwayo umbane okugqwesileyo, ukuqhuba kobushushu kunye namandla oomatshini. Nazi iindlela eziphambili zokusebenzisa i-substrate ye-copper:
1. Ibhodi yesekethe ye-elektroniki: izinto zesiseko se-copper foil njengebhodi yesekethe eprintiweyo (PCB). Isetyenziselwa ibhodi yesekethe yokudibanisa enoxinano oluphezulu, ibhodi yesekethe eguquguqukayo, njl. Ineempawu ezilungileyo zokuhambisa ubushushu kunye nokusabalalisa ubushushu kwaye ifanelekile kwizixhobo ze-elektroniki ezinamandla aphezulu.

2. Izicelo zolawulo lobushushu: zisetyenziswa njengesiseko sokupholisa izibane ze-LED, izixhobo zombane, njl.njl. Yenza izixhobo ezahlukeneyo zokutshintsha ubushushu, ii-radiator kunye nezinye izinto zolawulo lobushushu. Ukuhanjiswa kobushushu okugqwesileyo kobhedu kusetyenziselwa ukuqhuba nokukhupha ubushushu ngokufanelekileyo.

3. Ukusetyenziswa kwe-electromagnetic shield: njenge-shell yesixhobo se-elektroniki kunye nomaleko we-shield, ukubonelela nge-electromagnetic shield esebenzayo. Isetyenziselwa iifowuni eziphathwayo, iikhompyutha kunye nezinye iimveliso ze-elektroniki ze-metal shell kunye nomaleko we-shield yangaphakathi. Ngokusebenza kakuhle kwe-electromagnetic shield, inokuthintela ukuphazamiseka kwe-electromagnetic.

4. Ezinye izicelo: njengesixhobo sokuhambisa umbane ekwakheni iinkqubo zombane. Sisetyenziswa ekwenzeni izixhobo zombane ezahlukeneyo, iimoto, iitransformer kunye nezinye izinto ze-electromagnetic. Njengezinto zokuhombisa, sebenzisa iimpawu zayo ezilungileyo zokucubungula.

Singenza ngokwezifiso iinkcukacha ezahlukeneyo, ubukhulu kunye neemilo zeCopper Single crystal substrate ngokweemfuno ezithile zabathengi.

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