Iphedi ye-bionic engatyibilikiyo ethwele iphedi yokufunxa efunxayo

Iphedi ye-Bionic engatyibiliki wafer ethwele ivacuum sucker pad sucker Umfanekiso obonakalayo

Inkcazelo emfutshane:

I-Bionic anti-slip mat yimveliso ephezulu yokusebenza echasene ne-slip eyenziwe ngokusekelwe kumgaqo we-bionics. Ilungiswa ngokusebenzisa ubuchwephesha obuphambili be-micro kunye ne-nano ngokulinganisa iimpawu ze-microscopic yezakhiwo zebhayoloji ezifana neenyawo ze-gecko kunye ne-octopus suckers. Le mveliso iphula imida yobugcisa bezinto zemveli ezingatyibilikiyo, kwaye iqonda imisebenzi ephambili efana nokuncamathela okungenanto yeglu, ukusebenziseka kwakhona, kunye nokuguquguquka kokusingqongileyo. Njengesizukulwana esitsha sezisombululo ezikrelekrele ezichasene ne-slip, idibanisa ngokugqibeleleyo iziphumo ezintsha zesayensi yezinto, ubunjineli bomhlaba kunye noyilo lomatshini, kwaye ibonisa ixabiso eligqwesileyo lesicelo kwimveliso yemveliso, izixhobo zonyango, i-elektroniki yabathengi kunye nezinye iinkalo.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeBionic anti-slip pad:

• Ukusetyenziswa kobunjineli obukhethekileyo be-elastomer imathiriyeli ehlanganisiweyo, ukuzuza kungabikho ntsalela, isiphumo esingenalungcoliso sicocekileyo sokuthintela ukutyibilika, sigqibelele iimfuno zokusingqongileyo zokwenziwa kwe-semiconductor.

• Ngokuchaneka kwe-micro-nano structure array design, ulawulo olukrelekrele lweempawu zokukhuhlana komphezulu, ngelixa ugcina i-coefficient ephezulu ye-friction ngelixa ufezekisa ukunamathela kwe-ultra-low.

• Uyilo olulodwa lobuxhakaxhaka lobuxhakaxhaka luvumela ukusebenza okugqwesileyo kokubini ukukhuhlana okuphezulu kwetangential (μ>2.5) kunye nokuncamathela okusezantsi okuqhelekileyo (<0.1N/cm²).

• Iimathiriyeli zePolymer eziphuhliswe ngokukodwa kwishishini le-semiconductor, elifumana ukusebenza okuzinzileyo ngaphandle kokuthomalalisa ukusetyenziswa kwakhona kwe-100,000 ngokusebenzisa iteknoloji yokuvelisa i-micro kunye ne-nano.

Ukusetyenziswa kwephedi ye-Bionic anti-slip:

(1) Ishishini le-semiconductor
1. Ukwenziwa kwewafer:
· Ukubekwa kwindawo engatyibilikiyo ngexesha lokuhanjiswa kweewafers ezibhityileyo ukuya kuthi ga kwi-intshi ezili-12 (50-300μm)
· Ukulungiswa ngokuchanekileyo komthuthi we-wafer kumatshini we-lithography
· I-wafer non-slip liner yezixhobo zokuvavanya

2. Uvavanyo lwepakethi:
· Ukulungiswa okungonakalisi kwe-silicon carbide/gallium nitride izixhobo zamandla
· Isithinteli sokutyibilika ngexesha lokunyuswa kwetshiphu
· Vavanya ukothuka kunye nokutyibilika kwetafile yeprobe

(2) Imboni ye-Photovoltaic
1. Ukusetyenzwa kwewafer yesilicon:
· Ukulungiswa kokungatyibiliki ngexesha lokusika intonga ye-silicon ye-monocrystalline
· Ultra-obhityileyo isilicon wafer (<150μm) transmission non-slip
· Ukubekwa kweSilicon wafer kumatshini wokushicilela wesikrini

2. Indibano yecandelo:
· Inqwelomoya yeglasi elayitiweyo engatyibilikiyo
· Ukubekwa kwesakhelo sofakelo
· Ibhokisi yokubophelela ilungisiwe

(3) imboni yombane
1. Iphaneli yokubonisa:
· Inkqubo engatyibilikiyo yeOLED/LCD yeglasi engaphantsi
· Ukubekwa kwindawo echanekileyo yepolarizer fit
· Izixhobo zokuvavanya ukothuka kunye nezixhobo zokuvavanya ukutyibilika

2. Amalungu okukhanya:
· Ukudityaniswa kwemodyuli yelensi kungatyibiliki
· Ukulungiswa kweprism/isipili
· Inkqubo yokubona ukothuka kwelaser

(4) Izixhobo ezichanekileyo
1. Iqonga elichanekileyo lomatshini we-lithography li-anti-slip
2. Itheyibhile yokumejarisha yesixhobo sokubhaqa ingqina ukothuka
3. Isixhobo esizenzekelayo ingalo yomatshini engatyibiliki

Idatha yobugcisa:

Ukwakhiwa kwezinto:	C, O, Si
Ukuqina konxweme (A) :	50~55
I-Elastic recovery coefficient:	1.28
Ubushushu bokunyamezela okuphezulu:	260℃
I-friction coefficient:	1.8
Ukumelana ne-PLASMA:	Ukunyamezelana

Iinkonzo ze-XKH:

I-XKH ibonelela ngeenkonzo ze-bionic anti-slip mat epheleleyo yenkqubo yokwenza ngokwezifiso, kubandakanywa uhlalutyo lwemfuno, uyilo lwesikimu, ubungqina obukhawulezayo kunye nenkxaso yemveliso yobuninzi. Ukuxhomekeka kwi-teknoloji yokuvelisa i-micro kunye ne-nano, i-XKH inikezela ngezisombululo ezichasene ne-slip ze-semiconductor, i-photovoltaic kunye ne-photoelectric industries, kwaye uye wanceda ngempumelelo abathengi ukuba bafezekise iziphumo ezibalulekileyo ezifana nokunciphisa izinga le-debris ukuya kwi-0.005% kunye nokunyuka kwesivuno nge-15%.