I-Bionic non-slip pad wafer ephethe i-vacuum sucker i-friction pad sucker

Inkcazo emfutshane:

I-Bionic anti-slip mat yimveliso ephucukileyo yokulwa nokutyibilika eyenziwe ngokusekelwe kumgaqo we-bionics. Ilungiswa ngokusebenzisa iteknoloji yokuvelisa i-micro kunye ne-nano ephucukileyo ngokulinganisa iimpawu ezincinci zezakhiwo zebhayoloji ezifana neenyawo ze-gecko kunye nee-octopus suckers. Le mveliso idlula kwimida yobuchwephesha yezinto zemveli ezingatyibilikiyo, kwaye ifezekisa imisebenzi ephambili efana nokunamathela okungenaglu, ukusetyenziswa kwakhona, kunye nokuzivumelanisa nokusingqongileyo. Njengesizukulwana esitsha sezisombululo ezikrelekrele zokulwa nokutyibilika, idibanisa ngokugqibeleleyo iziphumo zobuchule besayensi yezinto, ubunjineli bomphezulu kunye noyilo loomatshini, kwaye ibonisa ixabiso elihle kakhulu lokusetyenziswa kwimveliso yemizi-mveliso, izixhobo zonyango, izixhobo ze-elektroniki zabathengi kunye nezinye iinkalo.

Thumela i-imeyile kuthi

Iimbonakalo

Iimpawu zephedi ye-Bionic anti-slip:

• Ukusetyenziswa kwezinto ezikhethekileyo zobunjineli ze-elastomer ezidityanisiweyo, ukuze kungabikho ntsalela, isiphumo esicocekileyo sokulwa nokutyibilika ngaphandle kongcoliseko, esifanelekileyo kwiimfuno zokusingqongileyo kokwenziwa kwe-semiconductor.

• Ngokusebenzisa uyilo oluchanekileyo lwe-micro-nano structure array, ulawulo olukrelekrele lweempawu zokungqubana komphezulu, ngelixa kugcinwa i-coefficient ephezulu yokungqubana ngelixa kufikelela ekunamatheleni okuphantsi kakhulu.

• Uyilo olulodwa lwe-interface mechanics lwenza kube lula ukusebenza kakuhle kokungqubana okuphezulu kwe-tangential (μ>2.5) kunye nokunamathela okuphantsi okuqhelekileyo (<0.1N/cm²).

• Izixhobo zePolymer ezenzelwe ngokukodwa ishishini le-semiconductor, ezifikelela ekusebenzeni okuzinzileyo ngaphandle kokunciphisa ukusetyenziswa kwakhona kwe-100,000 ngokusebenzisa itekhnoloji yokuvelisa i-micro kunye ne-nano.

Ukusetyenziswa kwephedi yokuthintela ukutyibilika yeBionic:

(1) Ishishini le-semiconductor
1. Ukwenziwa kweWafer:
· Ukungatyibiliki xa kudluliswa ii-wafers ezincinci kakhulu ukuya kuthi ga kwi-12 intshi (50-300μm)
· Ukulungiswa ngokuchanekileyo kwesixhobo sokuthwala i-wafer somatshini we-lithography
· I-wafer engatyibilikiyo yezixhobo zokuvavanya

2. Uvavanyo lwephakheji:
· Ukulungiswa okungatshabalalisiyo kwezixhobo zamandla ze-silicon carbide/gallium nitride
· I-anti-slip buffer ngexesha lokufakelwa kwe-chip
· Vavanya ukuxhathisa komothuko nokutyibilika kwetafile yeprobe

(2) Ishishini le-Photovoltaic
1. Ukulungiswa kwe-silicon wafer:
· Ukungatyibiliki ngexesha lokusika intonga ye-silicon e-monocrystalline
· I-wafer ye-silicon encinci kakhulu (<150μm) engatyibilikiyo
· Ukubekwa kwe-silicon wafer yomatshini wokuprinta isikrini

2. Indibano yecandelo:
· Iplani yeglasi engatyibilikiyo ene-laminated
· Indawo yokufaka isakhelo
· Ibhokisi yokubopha ilungisiwe

(3) ishishini le-photoelectric
1. Iphaneli yokubonisa:
· Inkqubo ye-substrate yeglasi ye-OLED/LCD engatyibilikiyo
· Indawo echanekileyo yokulingana kwe-polarizer
· Izixhobo zokuvavanya ezithintela ukutshayisa kunye nezithintela ukutyibilika

2. Izixhobo ezibonakalayo:
· Ukuhlanganiswa kwemodyuli yelensi akutyibiliki
· Ukulungiswa kwePrism/isipili
· Inkqubo ye-laser optical engashukumiyo

(4) Izixhobo ezichanekileyo
1. Iqonga elichanekileyo lomatshini we-lithography alityibiliki
2. Itafile yokulinganisa yezixhobo zokuchonga ayithinteli ukungoyiki
3. Izixhobo ezizenzekelayo zingatyibiliki ingalo yoomatshini

Idatha yobugcisa:

Ukwakhiwa kwezinto:	C, O, Si
Ubunzima bonxweme (A):	50~55
I-coefficient yokubuyisela i-elastic:	1.28
Ubushushu bokunyamezelana obuphezulu:	260℃
I-coefficient yokungqubana:	1.8
Ukumelana ne-PLASMA:	Ukunyamezelana

Iinkonzo ze-XKH:

I-XKH ibonelela ngeenkonzo ze-bionic anti-slip mat ezisebenza ngokwenkqubo epheleleyo, kubandakanya uhlalutyo lwemfuno, uyilo lweskimu, ukuqinisekiswa ngokukhawuleza kunye nenkxaso yemveliso enkulu. Ixhomekeke kubuchwepheshe bokuvelisa obuncinci kunye nobombane, i-XKH ibonelela ngezisombululo zobungcali zokulwa-slip kwimizi-mveliso ye-semiconductor, i-photovoltaic kunye ne-photoelectric, kwaye incede abathengi ngempumelelo ukuba bafikelele kwiziphumo ezibalulekileyo ezifana nokunciphisa izinga lenkunkuma ukuya kwi-0.005% kunye nokunyuka kwesivuno nge-15%.