Iwafer eqatywe iAu, isafire, isilicon, iSiC, 2inch 4inch 6inch, ukutyeba kwegolide 10nm 50nm 100nm

Iwafer eqatywe iAu, isafire, isilicon, iSiC, 2inch 4inch 6inch, Ubutyebe obuqatywe ngegolide 10nm 50nm 100nm Umfanekiso okhoyo

Inkcazelo emfutshane:

I-Gold Coated Wafers zethu zifumaneka kuluhlu olubanzi lwee-substrates, ezibandakanya i-Silicon (Si), iSapphire (Al₂O₃), kunye ne-Silicon Carbide (SiC) yafers. Ezi ziqwenga zifika kwi-intshi ezi-2, i-intshi ezi-4, kunye nobukhulu obuyi-intshi ezi-6 kwaye ziqatywe ngoqweqwe olucekethekileyo oluphezulu lwegolide (Au). Ingubo yegolide ifumaneka kubunzima obususela kwi-10nm ukuya kwi-500nm, kunye nobukhulu besiko obulungiselelwe ukuhlangabezana neemfuno ezithile zabathengi. Uluhlu lwegolide luncediswa yifilimu yokubambelela eyenziwe ngeChromium (Cr), iqinisekisa ukudibanisa okuqinileyo phakathi kwe-substrate kunye nomgangatho wegolide.
Ezi ziqwenga zigqunywe ngegolide zifanelekile kwii-semiconductor ezahlukeneyo kunye nezicelo ze-optoelectronics, zibonelela ngokusebenza kombane okuphezulu, ukuchithwa kwe-thermal, ukuxhathisa ukubola, kunye nokuqina koomatshini. Zisetyenziswa kakhulu kwizixhobo zokusebenza eziphezulu apho ukuzinza, ukuthembeka, kunye nokusebenza kwexesha elide kubaluleke kakhulu.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Ezona mpawu

Uphawu	Inkcazo
Izinto zeSubstrate	I-Silicon (Si), iSapphire (Al₂O₃), iSilicon Carbide (SiC)
Gold Coating Ukutyeba	10nm, 50nm, 100nm, 500nm
Ubunyulu begolide	99.999%ubunyulu bokusebenza kakuhle
Ifilimu yokuncamathela	I-Chromium (Cr), 99.98% ubunyulu, ukuqinisekisa ukunamathela olomeleleyo
Uburhabaxa boMphezulu	Ii-nm ezininzi (umgangatho womphezulu ogudileyo wosetyenziso oluchanekileyo)
Ukumelana (Si Wafer)	1-30 Ohm / cm(kuxhomekeke kuhlobo)
Ubungakanani beWafer	2-intshi, 4-intshi, 6-intshi, kunye nobukhulu besiqhelo
Ukutyeba (Si Wafer)	275µm, 381µm, 525µm
I-TTV (Ukwahluka koButyebe bubonke)	≤20µm
IFlethi ePhambili (Si Wafer)	15.9 ± 1.65mmukuya32.5 ± 2.5mm

Kutheni i-Gold Coating ibalulekile kwi-Semiconductor Industry

Ukuqhuba koMbane
Igolide yenye yezona zinto zilungileyoukuhanjiswa kombane. Iziqwenga ezifakwe ngegolide zibonelela ngeendlela eziphantsi, eziyimfuneko kwizixhobo ze-semiconductor ezifuna uqhagamshelo lombane olukhawulezayo noluzinzileyo. Iubunyulu obuphezuluyegolide iqinisekisa ukuqhuba kakuhle, ukunciphisa ukulahleka komqondiso.

Ukunyangwa kokuMhlwa
Igolide yiyoengadlekikwaye imelana kakhulu ne-oxidation. Oku kuyenza ilungele usetyenziso lwe-semiconductor olusebenza kwindawo ezirhabaxa okanye eziphantsi kwamaqondo obushushu aphezulu, ukufuma, okanye ezinye iimeko eziyingozi. I-wafer efakwe ngegolide iya kugcina iimpawu zayo zombane kunye nokuthembeka ekuhambeni kwexesha, ukubonelela aubomi benkonzo endekwizixhobo esetyenziswa kuzo.

Ulawulo lweThermal
Yegolideogqwesileyo thermal conductivityiqinisekisa ukuba ukushisa okwenziwa ngexesha lokusebenza kwezixhobo ze-semiconductor kuchithwa ngokufanelekileyo. Oku kubaluleke kakhulu kwizicelo eziphezulu zamandla afanaii-LEDs, amandla e-elektroniki, kwayeizixhobo ze-optoelectronic, apho ubushushu obugqithisileyo bunokukhokelela ekungasebenzini kwesixhobo ukuba asilawulwa kakuhle.

Ukuqina koomatshini
Iingubo zegolide zibonelelaukukhuselwa koomatshinikwi-wafer, ukuthintela umonakalo ongaphezulu ngexesha lokuphatha kunye nokucubungula. Lo maleko wongeziweyo wokhuseleko uqinisekisa ukuba ii-wafers zigcina ingqibelelo yazo yesakhiwo kunye nokuthembeka, naphantsi kweemeko ezinzima.

Iimpawu zePost-Coating

Umgangatho woMphezulu owongeziweyo
Ingubo yegolide iphucula iumphezulu ogudileyoye-wafer, eyona nto ibalulekileyo kuyoukuchaneka okuphezuluizicelo. Iuburhabaxa bomphezulukuncitshiswe ukuya kwi-nanometers ezininzi, ukuqinisekisa umgangatho ongenasiphako ulungele iinkqubo ezifanaukudibanisa ucingo, i-soldering, kwayeifotolithography.

IiPropati eziPhuculweyo zokuDibanisa kunye nokuThengisa
Umaleko wegolide wongeza iiimpawu zokudibanisaye-wafer, iyenza ilungeleukudibanisa ucingokwayeukudityaniswa kwe-flip-chip. Oku kubangela uqhagamshelo lombane olukhuselekileyo noluhlala ixesha elideUkupakishwa kwe-ICkwayeiindibano zesemiconductor.

I-Corrosion-Free kwaye ihlala ixesha elide
I-coat yegolide iqinisekisa ukuba i-wafer iya kuhlala ikhululekile kwi-oxidation kunye nokuthotywa, nasemva kokuvezwa ixesha elide kwiimeko ezinzima zokusingqongileyo. Oku kunegalelo kwiukuzinza kwexesha elideyesixhobo sokugqibela sesemiconductor.

Ukuzinza kweThermal kunye noMbane
Iifafa ezicatyiswe ngegolide zibonelela ngokuhambelanaukuchithwa kwe-thermalkwayeconductivity yombane, ekhokelela ekusebenzeni ngcono kunyeukuthembekakwezixhobo ekuhambeni kwexesha, nakubushushu obugqithisileyo.

Iiparamitha

Ipropati	Ixabiso
Izinto zeSubstrate	I-Silicon (Si), iSapphire (Al₂O₃), iSilicon Carbide (SiC)
Gold Umaleko Ukutyeba	10nm, 50nm, 100nm, 500nm
Ubunyulu begolide	99.999%(ubunyulu obuphezulu bokusebenza kakuhle)
Ifilimu yokuncamathela	I-Chromium (Cr),99.98%ubunyulu
Uburhabaxa boMphezulu	Iinanometers ezininzi
Ukumelana (Si Wafer)	1-30 Ohm / cm
Ubungakanani beWafer	2-intshi, 4-intshi, 6-intshi, ubungakanani besiko
Si Wafer Ukutyeba	275µm, 381µm, 525µm
TTV	≤20µm
IFlethi ePhambili (Si Wafer)	15.9 ± 1.65mmukuya32.5 ± 2.5mm

Ukusetyenziswa kweeWafers ezineGold-Coated

Ukupakishwa kweSemiconductor
Ii-wafers eziqatywe ngegolide zisetyenziswa kakhuluUkupakishwa kwe-IC, apho yaboconductivity yombane, ukuqina koomatshini, kwayeukuchithwa kwe-thermaliipropati ziqinisekisa ukuthembekauqhagamshelwanokwayeukudibanisakwizixhobo ze-semiconductor.

Ukwenziwa kwe-LED
Amaqebengwana aqatywe ngegolide adlala indima ebalulekileyoUkuveliswa kwe-LED, apho baphucula khonaulawulo lobushushukwayeukusebenza kombane. Umaleko wegolide uqinisekisa ukuba ubushushu obuveliswa ngamandla aphezulu e-LED buchithwa ngokufanelekileyo, bunegalelo kubomi obude kunye nokusebenza kakuhle.

Izixhobo ze-Optoelectronic
In optoelectronics, amaqebengwana aqatywe ngegolide asetyenziswa kwizixhobo ezifanaii-photodetectors, laser diodes, kwayeizinzwa zokukhanya. Ukwaleka kwegolide kubonelela ngokugqwesileyoconductivity thermalkwayeukuzinza kombane, ukuqinisekisa ukusebenza okuhambelanayo kwizixhobo ezifuna ulawulo oluchanekileyo lokukhanya kunye neempawu zombane.

I-Electronics yamandla
Ii-wafers eziqatywe ngegolide ziyimfunekoizixhobo zombane zombane, apho ukusebenza okuphezulu kunye nokuthembeka kubalulekile. Ezi ziqwenga ziqinisekisa ukuba zizinzileukuguqulwa kwamandlakwayeukutshatyalaliswa kobushushukwizixhobo ezifanatransistors amandlakwayeizilawuli zombane.

IMicroelectronics kunye neMEMS
In microelectronicskwayeI-MEMS (IiNkqubo zoMbane oNcinci), amaqebengwana agqitywe ngegolide asetyenziselwa ukwenzaamacandelo microelectromechanicalezifuna ukuchaneka okuphezulu kunye nokuqina. Uluhlu lwegolide lunikeza ukusebenza kombane okuzinzileyo kunyeukukhuselwa koomatshinikwizixhobo ezibuthathaka ze-microelectronic.

Imibuzo Ebuzwa Rhoqo (Q&A)

I-Q1: Kutheni usebenzisa igolide ukugquma ii-wafers?

A1:Igolide isetyenziselwa yonaconductivity yombane ephezulu, ukumelana nomhlwa, kwayeulawulo lobushushuiipropati. Iyaqinisekisauqhagamshelwano oluthembekileyo, ixesha elide lesixhobo, kwayeukusebenza okuhambelanayokwizicelo zesemiconductor.

I-Q2: Ziziphi iingenelo zokusebenzisa ii-wafers eziqatywe ngegolide kwizicelo ze-semiconductor?

A2:Iifafa ezicatyiswe ngegolide zibonelelaukuthembeka okuphezulu, ukuzinza kwexesha elide, kwayeukusebenza ngcono kombane kunye thermal. Zikwaphuculaiimpawu zokudibanisakwaye ukhusele ngokuchaseneyoi-oxidationkwayeumhlwa.

I-Q3: Bubuphi ubungqingqwa begolide endiyikhethileyo kwisicelo sam?

A3:Ubukhulu obufanelekileyo buxhomekeke kwisicelo sakho esithile.10nmilungele usetyenziso oluchanekileyo, olubuthathaka, ngelixa50nmukuya100nmiingubo zisetyenziselwa izixhobo eziphezulu zamandla.500nmingasetyenziselwa usetyenziso olunzima olufuna iileya ezishinyeneyoukuqinakwayeukutshatyalaliswa kobushushu.

I-Q4: Ngaba unokwenza ngokwezifiso iisayizi ze-wafer?

A4:Ewe, iiwafers ziyafumaneka2-intshi, 4-intshi, kwaye6-intshiubungakanani obuqhelekileyo, kwaye sinokubonelela ngeesayizi zesiko ukuhlangabezana neemfuno zakho ezithile.

I-Q5: Ukwaleka kwegolide kuphucula njani ukusebenza kwesixhobo?

A5:Igolide iyaphucukaukuchithwa kwe-thermal, conductivity yombane, kwayeukumelana nomhlwa, zonke ezinegalelo ekusebenzeni kakuhle kwayeizixhobo ezithembekileyo ze-semiconductorubomi obude bokusebenza.

I-Q6: Ifilimu yokubambelela iphucula njani i-coating yegolide?

A6:Iichromium (Cr)ifilimu adhesion iqinisekisa bond olomeleleyo phakathiumaleko wegolidekwaye iisubstrate, ukuthintela i-delamination kunye nokuqinisekisa ukuthembeka kwe-wafer ngexesha lokucubungula kunye nokusetyenziswa.

Ukuqukumbela

I-Silicon yethu yeGold Coated, iSapphire, kunye ne-SiC Wafers zibonelela ngezisombululo eziphambili zezicelo ze-semiconductor, zibonelela ngokwenziwa kombane okuphezulu, ukuchithwa kwe-thermal, kunye nokuxhathisa ukubola. Ezi ziqwenga zilungele ukupakishwa kwe-semiconductor, ukwenziwa kwe-LED, i-optoelectronics, kunye nokunye. Ngegolide esulungekileyo, ubukhulu obulungele ukwenziwa, kunye nokuqina okugqwesileyo koomatshini, baqinisekisa ukuthembeka kwexesha elide kunye nokusebenza okungaguqukiyo kwiindawo ezibango.