I-8 intshi 200mm yeSapphire Wafer Carrier Subsrate SSP DSP Ukutyeba 0.5mm 0.75mm

8 intshi 200mm Sapphire Wafer Carrier Subsrate SSP DSP Ukutyeba 0.5mm 0.75mm Umfanekiso obonakalayo

Inkcazelo emfutshane:

I-8-intshi ye-sapphire substrate wafer yimathiriyeli yekristale ekumgangatho ophezulu, ehlala ixesha elide esetyenziswa kwizicelo ezahlukeneyo. Iyaziwa ngokugqwesa kwe-thermal kunye nokuzinza kweekhemikhali, kunye nokubonakala kwayo okuphezulu.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Ulwazi oluneenkcukacha

Indlela yokuvelisa: Inkqubo yokwenziwa kwe-8-intshi yesafire substrate ibandakanya amanyathelo amaninzi. Okokuqala, umgubo we-alumina ococekileyo unyibilika kwiqondo lobushushu eliphezulu ukwenza imo etyhidiweyo. Emva koko, ikristale yembewu intywiliselwa ekunyibilikeni, ivumela isafire ukuba ikhule njengoko imbewu irhoxa kancinci. Emva kokukhula ngokwaneleyo, ikristale yesafire isikwa ngononophelo ibe ngamaqhekeza amancinci, athi ke akhazimliswe ukuze afikelele indawo egudileyo kwaye engenasiphako.

Ukusetyenziswa kwe-8-intshi ye-sapphire substrate: I-8-intshi ye-sapphire substrate isetyenziswa ngokubanzi kwishishini le-semiconductor, ngokukodwa kwimveliso yezixhobo zombane kunye ne-optoelectronic components. Isebenza njengesiseko esibalulekileyo sokukhula kwe-epitaxial yee-semiconductors, eyenza ukusekwa kweesekethe ezidityanisiweyo eziphezulu, ii-diode ezikhupha ukukhanya (ii-LED), kunye ne-laser diode. ISapphire substrate iphinda ifumane izicelo ekwenziweni kweefestile zamehlo, ubuso bewotshi, kunye nezikhuselo ezikhuselayo zee-smartphones kunye neetafile.

Iimpawu zemveliso ye-8-intshi yesafire substrate:

- Ubungakanani: I-8-intshi ye-sapphire substrate inobubanzi be-200mm, inika indawo enkulu yendawo yokubeka i-epitaxiallayers.

- Umgangatho woMgangatho: Umphezulu we-substrate ucocwe ngononophelo ukuze ufezekise umgangatho ophezulu we-optical, kunye nobunzima bomhlaba obungaphantsi kwe-0.5 nm RMS.

- Ukutyeba: Ubukhulu obuqhelekileyo be-substrate yi-0.5 mm. Nangona kunjalo, ukhetho lobungakanani obulungiselelweyo buyafumaneka xa uceliwe.

- Ukupakishwa: I-substrates yesafire ipakishwe ngabanye ukuqinisekisa ukukhuselwa ngexesha lokuthutha kunye nokugcinwa. Ngokuqhelekileyo zibekwe kwiitreyi ezikhethekileyo okanye iibhokisi, kunye nezixhobo ezifanelekileyo zokukhusela ukuthintela nawuphi na umonakalo.

- I-Edge Orientation: I-substrate iza kunye ne-edge orientation echaziweyo, eyona nto ibalulekileyo ukulungelelaniswa okuchanekileyo ngexesha leenkqubo zokuvelisa i-semiconductor.

Ukuqukumbela, i-8-intshi ye-sapphire substrate yinto eguquguqukayo kwaye inokwethenjelwa, isetyenziswa ngokubanzi kwishishini le-semiconductor ngenxa yeempawu zayo ezikhethekileyo ze-thermal, iikhemikhali kunye ne-optical. Ngomgangatho wayo obalaseleyo womphezulu kunye neenkcukacha ezichanekileyo, isebenza njengenxalenye ebalulekileyo ekuvelisweni kwezixhobo eziphezulu ze-elektroniki kunye ne-optoelectronic.