Umatshini Wokugaya Ochanekileyo Omacala Ambini we-SiC Sapphire Si wafer
Umzobo oneenkcukacha
Intshayelelo kwiZixhobo zokuGcina eziNamacala Amabini
Izixhobo zokugaya ezichanekileyo ezimacala mabini sisixhobo somatshini esiphucukileyo esenzelwe ukucubungula zombini iindawo zomsebenzi. Sibonelela ngobuthe tyaba obuphezulu kunye nobuthambileyo bomphezulu ngokugaya ubuso obuphezulu nobusezantsi ngaxeshanye. Le teknoloji ifanelekile kakhulu kwi-spectrum ebanzi yezinto, egubungela iintsimbi (intsimbi engatyiwayo, i-titanium, i-aluminium alloys), ii-non-metals (i-ceramics yobugcisa, iglasi ye-optical), kunye nee-polymers zobunjineli. Ngenxa yesenzo sayo somphezulu ombaxa, le nkqubo ifikelela kwi-parallelism egqwesileyo (≤0.002 mm) kunye ne-ultra-fine surface roughness (Ra ≤0.1 μm), nto leyo eyenza ukuba ibaluleke kakhulu kubunjineli beemoto, ii-microelectronics, ii-precision bearings, i-aerospace, kunye ne-optical manufacturing.
Xa kuthelekiswa nee-grinders ezinecala elinye, le nkqubo inobuso obumbini inika amandla aphezulu okusebenzisa kunye neempazamo zokuseta ezincitshisiweyo, kuba ukuchaneka kokubambelela kuqinisekiswa yinkqubo yokugaya ngaxeshanye. Ngokudibaniswa neemodyuli ezenzekelayo ezifana nokulayisha/ukukhulula i-robotic, ulawulo lwamandla oluvaliweyo, kunye nokuhlolwa kobukhulu be-intanethi, izixhobo zidityaniswa ngaphandle komthungo kwiifektri ezikrelekrele kunye neendawo zemveliso ezinkulu.
Idatha yoBugcisa — Izixhobo zokuGcina eziBalaseleyo
| Into | Inkcazo | Into | Inkcazo |
|---|---|---|---|
| Ubungakanani bepleyiti yokusila | φ700 × 50 mm | Uxinzelelo oluphezulu | 1000 kgf |
| Ubukhulu bomthwali | φ238 mm | Isantya sepleyiti ephezulu | ≤160 ngomzuzu |
| Inombolo yomthwali | 6 | Isantya sepleyiti esisezantsi | ≤160 ngomzuzu |
| Ubukhulu bomsebenzi | ≤75 mm | Ukujikeleza kwevili lelanga | ≤85 ngomzuzu |
| Ububanzi bomsebenzi | ≤φ180 mm | I-engile yengalo yokujika | 55° |
| Ukubetha kwesilinda | 150 mm | Uvavanyo lwamandla | 18.75 kW |
| Imveliso (φ50 mm) | 42 ii-pcs | Intambo yamandla | 3×16+2×10 mm² |
| Imveliso (φ100 mm) | 12 ii-pcs | Imfuneko yomoya | ≥0.4 MPa |
| Unyawo lomatshini | 2200×2160×2600 mm | Ukusinda okushiyekile | 6000 kg |
Indlela Osebenza Ngayo Umatshini
1. Ukucubungula ngamavili amabini
Amavili amabini achaseneyo okusila (idayimani okanye i-CBN) ajikeleza kwicala elahlukileyo, esebenzisa uxinzelelo olufanayo kwindawo yokusebenza ebanjwe kwiinqwelomoya. Isenzo esiphindwe kabini sivumela ukususwa ngokukhawuleza kunye nokuhambelana okubalaseleyo.
2. Ukubeka kunye noLawulo
Izikrufu zebhola ezichanekileyo, iimoto ze-servo, kunye nezikhokelo ezithe ngqo ziqinisekisa ukuchaneka kokubekwa kwe-±0.001 mm. Iigeyiji zelaser ezidityanisiweyo okanye ze-optical zilandelela ubukhulu ngexesha langempela, zivumela ukubuyiselwa ngokuzenzekelayo.
3. Ukupholisa kunye nokuhluza
Inkqubo yolwelo olunoxinzelelo oluphezulu inciphisa ukugqwetheka kobushushu kwaye isusa ubumdaka ngokufanelekileyo. I-coolant ijikeleziswa kwakhona ngokusebenzisa i-multi-stage magnetic kunye ne-centrifugal filtration, yandisa ubomi bevili kunye nomgangatho wenkqubo yokuzinzisa.
4. Iqonga loLawulo oluHlakaniphileyo
Ixhotyiswe nge-Siemens/Mitsubishi PLCs kunye ne-HMI yesikrini sokuchukumisa, inkqubo yolawulo ivumela ukugcinwa kweresiphi, ukujonga inkqubo ngexesha langempela, kunye nokuxilongwa kweempazamo. Ii-algorithms eziguquguqukayo zilawula ngobuchule uxinzelelo, isantya sokujikeleza, kunye namazinga okutya ngokusekelwe kubunzima bezinto.

Ukusetyenziswa koMatshini wokuGrida oNgcono oMacala-mabini
Ukuveliswa kweeMoto
Iziphelo ze-crankshaft zoomatshini, iiringi zepiston, iigiya zokudlulisela, ukufikelela kwi-≤0.005 mm parallelism kunye noburhabaxa bomphezulu we-Ra ≤0.2 μm.
I-Semiconductor kunye nee-Elektroniki
Ukucuthwa kwee-wafer ze-silicon ukuze kupakishwe i-3D IC ephucukileyo; ii-substrates ze-ceramic ziyagaywa ngokunyamezela ubukhulu be-±0.001 mm.
Ubunjineli Bokuchaneka
Ukucutshungulwa kwee-hydraulic components, bearing elements, kunye ne-shims apho kufuneka khona ukunyamezelana okungu-≤0.002 mm.
Izixhobo zokukhanya
Ukugqitywa kweglasi yesiciko sefowuni (Ra ≤0.05 μm), iiblanks zelensi yesafire, kunye nee-substrates ze-optical ezingenaxinzelelo lwangaphakathi oluncinci.
Izicelo zeenqwelo-moya
Ukwenziwa komatshini wee-tenons ze-turbine ze-superalloy, izinto zokufakelwa kwe-ceramic, kunye neendawo zesakhiwo ezikhaphukhaphu ezisetyenziswa kwi-satellites.

Iingenelo eziphambili zomatshini wokusila onamacaleni amabini
-
Ulwakhiwo Oluqinileyo
-
Isakhelo sesinyithi esinzima esinonyango lokunciphisa uxinzelelo sinikezela ngokungcangcazela okuphantsi kunye nokuzinza kwexesha elide.
-
Iibheringi ezisemgangathweni ophezulu kunye nezikrufu zebhola eziqinileyo ziphumelela ekuphindaphindeni ngaphakathi0.003 mm.
-
-
Isinxibelelanisi Somsebenzisi Esikrelekrele
-
Impendulo ekhawulezayo ye-PLC (<1 ms).
-
I-HMI yeelwimi ezininzi ixhasa ulawulo lweresiphi kunye nokuboniswa kwenkqubo yedijithali.
-
-
Iguquguqukayo kwaye Iyandiswa
-
Ukuhambelana kwemodyuli kunye neengalo zerobhothi kunye neenkqubo zokuhambisa kwenza ukuba kusebenze ngaphandle komntu.
-
Yamkela iibhondi zamavili ezahlukeneyo (i-resin, idayimani, i-CBN) zokucubungula iintsimbi, iiseramikhi, okanye iindawo ezidityanisiweyo.
-
-
Ubuchule obuphezulu bokuchaneka
-
Ulawulo loxinzelelo oluvaliweyo luqinisekisaUkuchaneka kwe-±1%.
-
Izixhobo ezinikezelweyo zivumela ukucutshungulwa kwezinto ezingezizo ezisemgangathweni, ezifana neengcambu zeturbine kunye neendawo zokutywina ngokuchanekileyo.
-

Imibuzo Ebuzwa Rhoqo - Umatshini Wokuchwetheza Ochanekileyo Omacala Amabini
Q1: Zeziphi izinto ezinokwenziwa ngumatshini wokuGrinda oNgcono oluMacala Ambini?
A1: Umatshini Wokugrumba Ongamacala Ambini uyakwazi ukuphatha uluhlu olubanzi lwezixhobo, kuquka iintsimbi (intsimbi engagqwaliyo, i-titanium, ii-aluminium alloys), iiseramikhi, iiplastiki zobunjineli, kunye neglasi ebonakalayo. Amavili okugaya akhethekileyo (idayimani, i-CBN, okanye i-resin bond) anokukhethwa ngokusekelwe kwizinto zokusebenza.
Q2: Ingakanani inqanaba lokuchaneka koMatshini wokuGrida oNamacala Amabini?
A2: Umatshini ufikelela kwi-parallelism ye-≤0.002 mm kunye noburhabaxa bomphezulu be-Ra ≤0.1 μm. Ukuchaneka kokubekwa kugcinwa ngaphakathi kwe-±0.001 mm ngenxa yezikrufu zebhola eziqhutywa yi-servo kunye neenkqubo zokulinganisa ezikwi-line.
UMBUZO 3: Umatshini Wokugrinda Osebenza Ngamacala Amabili Uwuphucula njani imveliso xa uthelekiswa neegrinder ezinecala elinye?
A3: Ngokungafaniyo noomatshini abamacala omabini, uMatshini wokuGrindisha oNgqongqo oMacala omabini ugoba ubuso bomsebenzi ngaxeshanye. Oku kunciphisa ixesha lokujikeleza, kunciphisa iimpazamo zokubambelela, kwaye kuphucula kakhulu ukusebenza—ilungele imigca yemveliso yobuninzi.
Q4: Ngaba umatshini wokuGrinda oNgqingqiwe kabini ungadityaniswa kwiinkqubo zemveliso ezenzekelayo?
A4: Ewe. Lo matshini wenzelwe iindlela zokwenza izinto ngokuzenzekelayo eziziimodyuli, ezifana nokulayisha/ukukhulula imithwalo kwiirobhothi, ulawulo loxinzelelo oluvaliweyo, kunye nokuhlolwa kobukhulu obungaphakathi kwimigca, okwenza ukuba uhambelane ngokupheleleyo neendawo ezikrelekrele zefektri.
Ngathi
I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo ye-optical kunye nezixhobo ezintsha zekristale. Iimveliso zethu zibonelela nge-optical electronics, i-consumer electronics, kunye ne-military. Sinikezela nge-Sapphire optical components, ii-mobile phone lens covers, i-Ceramics, i-LT, i-Silicon Carbide SIC, i-Quartz, kunye ne-semiconductor crystal wafers. Ngobuchule obunobuchule kunye nezixhobo eziphambili, sigqwesile ekucutshungulweni kwemveliso okungaqhelekanga, sijolise ekubeni yishishini eliphambili le-optoelectronic materials high-tech.









