Umatshini wokuSila onamacala amabini oChanekileyo weSiC Sapphire Si wafer

Umatshini wokuSila onaMacala aMbini ochanekileyo weSiC Sapphire Si wafer Featured Image

Inkcazelo emfutshane:

I-Double-Sided Precision Grinding Machine sisisombululo sesizukulwana esilandelayo esenzelwe ukuchaneka okuphezulu kwemigangatho yomibini yendawo yokusebenza ngexesha elinye. Ngokusila ubuso obuphezulu kunye nezantsi ngaxeshanye, umatshini uqinisekisa ukuhambelana okukhethekileyo (≤0.002 mm) kunye ne-ultra-smooth surface finish (Ra ≤0.1 μm). Obu buchule benza ukuba uMshini wokuSila oMacala aMacala-mbini ube sisixhobo esiphambili kuwo wonke amashishini afana neemoto, ukupakishwa kwe-semiconductor, umatshini ochanekileyo, i-optics, kunye ne-aerospace.

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Intshayelelo yeSixhobo sokuSila esinaMacala amabini

Isixhobo sokusila esinamacala amabini sisixhobo somatshini esiphucukileyo esenzelwe ukusetyenzwa kwe-synchronous kuyo yomibini imiphezulu yendawo yokusebenza. Inika ukuthambeka okuphezulu kunye nokuguda komphezulu ngokusila ubuso obuphezulu nangaphantsi ngaxeshanye. Le teknoloji ifanelekile ngokubanzi kwi-spectrum yezinto ezibanzi, isinyithi esigqumayo (insimbi engenasici, i-titanium, i-alloys ye-aluminium), i-non-metals (i-ceramics zobuchwepheshe, i-glass optical), kunye neepolima zobunjineli. Ngombulelo kwisenzo sayo sobuso obubini, inkqubo ifezekisa ukuhambelana okugqwesileyo (≤0.002 mm) kunye ne-ultra-fine surface roughness (Ra ≤0.1 μm), iyenza ibe yinto eyimfuneko kubunjineli beemoto, i-microelectronics, iibheringi ezichanekileyo, i-aerospace, kunye nokuveliswa kwe-optical.

Xa kuthelekiswa negrinder ezicalanye, le nkqubo yobuso obubini ibonelela ngokudlula okuphezulu kunye neempazamo zokuseta ezincitshisiweyo, kuba ukuchaneka kwe-clamping kuqinisekiswa yinkqubo yomatshini ngaxeshanye. Ngokudibanisa neemodyuli ezizenzekelayo ezifana nokulayisha / ukukhulula i-robotic, ulawulo lwamandla avaliweyo, kunye nokuhlolwa komgangatho we-intanethi, izixhobo zidibanisa ngokungenamthungo kwiifektri ezihlakaniphile kunye neendawo zokuvelisa ezinkulu.

double_side_precision_grinding_machine_for_metals_non_metals_ceramics_plastics 1_副本

Umatshini wokuSila oMacala-mbini ochanekileyo_副本

Idatha yezobuGcisa - Isixhobo sokuSila esichanekileyo esinamacala amabini

Into	Inkcazo	Into	Inkcazo
Ubungakanani bepleyiti yokugaya	φ700 × 50 mm	Uxinzelelo oluphezulu	1000 kgf
Ubungakanani bomthwali	φ238 mm	Isantya sepleyiti ephezulu	≤160 rpm
Inombolo yomphathi	6	Isantya sepleyiti esisezantsi	≤160 rpm
Ukutyeba kweworkpiece	≤75 mm	Ukujikeleza kwevili lelanga	≤85 rpm
Idayamitha yomsebenzi	≤φ180 mm	Swing ingalo angle	55 °
I-cylinder stroke	150 mm	Ukukala kwamandla	18.75 kW
Imveliso (φ50 mm)	42 iipcs	Intambo yamandla	3×16+2×10 mm²
Imveliso (φ100 mm)	12 iipcs	Imfuneko yomoya	≥0.4 MPa
Inyathelo lomatshini	2200×2160×2600 mm	Ukusinda okushiyekile	6000 kg

Usebenza njani umatshini

1. Ukwenziwa kwamavili amabini

Amavili amabini okusila achaseneyo (i-diamond okanye i-CBN) ajikeleza kumacala ahlukeneyo, ebeka uxinzelelo olufanayo kwisixhobo sokusebenza esibanjwe kwizithwala iiplanethi. Isenzo esiphindwe kabini sivumela ukususwa ngokukhawuleza kunye ne-parallelism ebalaseleyo.

2. Ukuma kunye noLawulo

Izikrufu zebhola ezichanekileyo, iimotor ze-servo, kunye nezikhokelo zomgca ziqinisekisa ukuchaneka kokubeka ± 0.001 mm. I-laser edityanisiweyo okanye igeyiji yokulinganisa umkhondo ngexesha lokwenyani, ivumela imbuyekezo ezenzekelayo.

3. Ukupholisa kunye nokuHlunga

Inkqubo ye-high-pressure fluid inciphisa ukuphazamiseka kwe-thermal kwaye isuse i-debris ngokufanelekileyo. Isisipholisi sijikeleziswa ngokutsha ngokuhluzwa kwamanqanaba ngaMazibuthe kunye ne-centrifugal, ukwandisa ubomi bevili kunye nokuzinzisa umgangatho wenkqubo.

4. I-Smart Control Platform

Ukuxhotyiswa nge-Siemens / Mitsubishi PLCs kunye ne-HMI yesikrini esichukumisayo, inkqubo yokulawula ivumela ukugcinwa kweresiphi, ukujonga inkqubo yexesha langempela, kunye ne-fault diagnostics. I-adaptive algorithms ilawula ngobuchule uxinzelelo, isantya sokujikeleza, kunye namazinga okutya asekwe kubulukhuni bezinto.

Umatshini wokuSila onaMacala aMbini oNgxamisekileyo Iintsimbi zeCeramics zePlastiki yeglasi 1

Ukusetyenziswa komatshini wokuSila oNcase ngamacala amabini

UkuVeliswa kweeMoto
I-Machining crankshaft iphela, i-piston rings, i-gear transmission, ukuphumeza i-≤0.005 mm parallelism kunye nobunzima bomhlaba u-Ra ≤0.2 μm.

ISemiconductor & Electronics
Ukucuthwa kwee-wafers ze-silicon zokupakishwa kwe-3D IC ephezulu; iisubstrates zeceramic eziphantsi ngonyamezelo lwedimensional ±0.001 mm.

Ubunjineli obuchanekileyo
Ukucutshungulwa kwamacandelo e-hydraulic, i-bearing elements, kunye ne-shims apho ukunyamezela ≤0.002 mm kuyadingeka.

Amacandelo e-Optical
Ukugqitywa kweglasi yesigqubuthelo se-smartphone (Ra ≤0.05 μm), izikhewu zelensi yesafire, kunye ne-optical substrates ezinoxinzelelo oluncinci lwangaphakathi.

Usetyenziso lwe-Aerospace
Ukucutshungulwa kweetenons ze-injini ye-superalloy, i-ceramic insulation components, kunye ne-lightweight ye-structural parts ezisetyenziswa kwiisathelayithi.

Umatshini wokuSila onaMacala aMbini oNgxamisekileyo Iintsimbi zeCeramics zePlastiki yeglasi 3

Izinto eziluncedo eziPhambili zoMtshini wokuSila oChanekileyo waMacala amabini

Ulwakhiwo oluqinileyo
- Isakhelo sesinyithi esinzima esinomsebenzi onzima kunye nonyango lokunciphisa uxinzelelo lunikezela ukungcangcazela okuphantsi kunye nokuzinza kwexesha elide.
- Iibheringi zodidi oluchanekileyo kunye nezikrufu eziqinileyo zebhola zifezekisa ukuphindaphinda ngaphakathi0.003 mm.
Ujongano lomsebenzisi okrelekrele
- Ukuphendula ngokukhawuleza kwe-PLC (<1 ms).
- I-HMI yeelwimi ezininzi ixhasa ulawulo lweresiphi kunye nokubonwa kwenkqubo yedijithali.
Iyabhetyebhetye kwaye iyandiswa
- Ukuhambelana kwemodyuli kunye neengalo zerobhothi kunye neenkqubo zokuhambisa zenza umsebenzi ongekho mntu.
- Yamkela iibhondi zamavili ezahlukeneyo (intlaka, idayimani, i-CBN) yokusetyenzwa kwesinyithi, iiseramikhi, okanye iinxalenye ezihlanganisiweyo.
Ukuchaneka okuphezulu
- Ulawulo loxinzelelo oluvaliweyo luqinisekisa±1% ukuchaneka.
- Isixhobo esinikezelweyo sivumela ukwenziwa kwezixhobo ezingekho mgangathweni, njengeengcambu ze-iturbine kunye neendawo zokutywina ezichanekileyo.

Umatshini wokuSila onaMacala aBini oNgxamisekileyo Iintsimbi zeCeramics zePlastiki yeglasi 2

I-FAQ – Umatshini wokuSila oChanekileyo oMacala amabini

I-Q1: Ziziphi izinto ezinokuthi inkqubo ye-Double-Sided Precision Grinding Machine?
I-A1: I-Double-Sided Precision Grinding Machine iyakwazi ukuphatha uluhlu olubanzi lwezinto eziphathekayo, ezibandakanya isinyithi (insimbi engenasici, i-titanium, i-aluminium alloys), i-ceramics, iiplastiki zobunjineli kunye neglasi ye-optical. Amavili okusila akhethekileyo (i-diamond, i-CBN, okanye i-resin bond) inokukhethwa ngokusekelwe kwizinto zokusebenza.

I-Q2: Ithini inqanaba lokuchaneka koMshini wokuSila oMacala amabini?
A2: Umatshini ufezekisa ukuhambelana kwe-≤0.002 mm kunye nobunzima bomhlaba weRa ≤0.1 μm. Ukuchaneka kwendawo kugcinwa ngaphakathi kwe-± 0.001 mm ngenxa yezikrufu zebhola eziqhutywa yi-servo kunye neenkqubo zokulinganisa e-line.

I-Q3: Ngaba umatshini wokuSila oQhaqwe ngaMacala aMbini uphucula njani imveliso xa kuthelekiswa negrinder ezicalanye?
I-A3: Ngokungafaniyo noomatshini abakwicala elinye, uMshini wokuSila oQhelekileyo oMacaleni oMbini ugaya ubuso bobabini bomsebenzi ngaxeshanye. Oku kunciphisa ixesha lomjikelo, kunciphisa iimpazamo zokubethelela, kwaye kuphucula kakhulu i-throughput-efanelekileyo kwimigca yokuvelisa ubuninzi.

I-Q4: Ngaba i-Double-Sided Precision Grinding Machine ingadibaniswa kwiinkqubo zokuvelisa ezizenzekelayo?
A4: Ewe. Umatshini wenzelwe iimodyuli ezizenzekelayo ezikhethiweyo, ezifana nokulayisha / ukukhulula i-robotic, ukulawulwa koxinzelelo lwe-loop evaliweyo, kunye nokuhlolwa kwe-in-line ubukhulu, okwenza ukuba ihambelane ngokupheleleyo neendawo ezihlakaniphile zefektri.

Ngathi

I-XKH igxile kuphuhliso lobuchwepheshe obuphezulu, imveliso, kunye nokuthengiswa kweglasi ekhethekileyo yeglasi kunye nezinto ezintsha zekristale. Iimveliso zethu zisebenza ngombane obonakalayo, i-elektroniki yabathengi, kunye nomkhosi. Sinikezela ngezixhobo zeSapphire optical, iilensi zeselfowuni eziphathwayo, iiCeramics, LT, Silicon Carbide SIC, Quartz, kunye nesemiconductor crystal wafers. Ngobuchule bezakhono kunye nezixhobo ezibukhali, sigqwesa ekusetyenzweni kwemveliso engeyiyo eyomgangatho, sijonge ukuba lishishini eliphambili le-optoelectronic tech-tech.