I-12inch (300mm) Ibhokisi yokuThumela yangaphambili yokuvula Ibhokisi ye-FOSB yebhokisi yebhokisi ye-wafer 25pcs umthamo wokuphatha i-Wafer kunye nokuthumela Imisebenzi ezenzekelayo

I-12inch (300mm) Ibhokisi yokuThumela yangaphambili yokuvula Ibhokisi ye-FOSB yesithwali sebhokisi ye-wafer 25pcs umthamo wokuphatha i-Wafer kunye nokuthumela Imisebenzi ezenzekelayo

Inkcazelo emfutshane:

I-12-intshi (300mm) Ibhokisi yokuThumela ePhambili yokuVula (i-FOSB) sisisombululo esiphezulu se-wafer carrier eyenzelwe ukuhlangabezana nemigangatho ephezulu yoshishino lokuvelisa i-semiconductor. Le FOSB yenzelwe ngokukodwa ukuqinisekisa ukuphathwa ngokukhuselekileyo, ukugcinwa, kunye nokuthuthwa kwee-wafers ezingama-300mm. Isakhiwo esomeleleyo, esidityaniswe ne-ultra-clean, i-low-outgassing material composition, iyanciphisa kakhulu imingcipheko yokungcoliseka ngelixa igcina ingqibelelo ye-wafer ngexesha lamanyathelo okucubungula abalulekileyo.

Iibhokisi ze-FOSB zibalulekile kwiindawo zangoku ze-semiconductor apho ukuphathwa kwe-wafer kufuneka kube ngokuzenzekelayo, ngokuchanekileyo, kwaye kungabikho usulelo. Le bhokisi yokuthwala umthamo we-25-slot inikeza indawo efanelekileyo yokuthutha i-wafer, ukunciphisa uxinzelelo lomatshini kunye nokuqinisekisa indawo echanekileyo ye-wafer. Ngoyilo lwangaphambili lokuvula, lunikeza ukufikelela okulula kuzo zombini iinkqubo ezizenzekelayo kunye nokuphatha ngesandla xa kuyimfuneko. Ibhokisi ye-eFOSB ihambelana ngokupheleleyo nemigangatho yoshishino efana ne-SEMI/FIMS kunye ne-AMHS, eyenza ukuba ilungele ukusetyenziswa kwiinkqubo zokuphatha izinto ezizenzekelayo (AMHS) kwiifabhu ze-semiconductor kunye neendawo ezihambelanayo zokuvelisa.

Thumela i-imeyile kuthi

Iinkcukacha zeMveliso

Iithegi zeMveliso

Ezona mpawu

Uphawu	Inkcazo
Umthamo weWafer	25 iindawo zokubekakwii-wafers ezingama-300mm, ezinikezela ngesisombululo soxinaniso oluphezulu lokuthuthwa kwe-wafer kunye nokugcinwa.
Ukuthobela	NgokupheleleyoI-SEMI/FIMSkwayeAMHSukuthobela, ukuqinisekisa ukuhambelana neenkqubo zokuphatha izinto ezizenzekelayo kwiifabhu ze-semiconductor.
Imisebenzi ezenzekelayo	Yenzelweukuphatha okuzenzekelayo, ukunciphisa ukusebenzisana kwabantu kunye nokunciphisa umngcipheko wokungcola.
Indlela yokuphatha ngesandla	Inikezela ngokuguquguquka kofikelelo lwezandla kwiimeko ezifuna ungenelelo lomntu okanye ngexesha leenkqubo ezingezizo ezizenzekelayo.
Ukuqulunqwa kwezinto	Yenziwe ukusukai-ultra-clean, i-low-outgassing materials, ukunciphisa umngcipheko wokuveliswa kwamasuntswana kunye nokungcoliseka.
Inkqubo yokugcinwa kweWafer	NONEinkqubo yokugcinwa kwewaferkunciphisa umngcipheko wokuhamba nge-wafer ngexesha lothutho, ukuqinisekisa ukuba ii-wafers zihlala zikhuselekile.
Uyilo lococeko	Ngokukodwa ubunjineli bokunciphisa umngcipheko wokuvelisa amasuntswana kunye nokungcoliseka, ukugcina imigangatho ephezulu efunekayo kwimveliso ye-semiconductor.
Ukuqina kunye nokomelela	Ezakhiwe ngezixhobo eziphezulu zokumelana nobunzima bezothutho ngelixa ugcina ingqibelelo yesakhiwo somthwali.
Ukwenza ngokwezifiso	Unikezeloiinketho zokwenza ngokwezifisokwiisayizi ezahlukeneyo zewafer okanye iimfuno zothutho, ezivumela abathengi ukuba balungelelanise ibhokisi ngokwezidingo zabo.

Iimpawu ezineenkcukacha

25-Slot Umthamo 300mm Wafers
Isithwali se-wafer se-eFOSB siyilelwe ukuthwala ukuya kuthi ga kwi-25 300mm iiwafers, indawo nganye yokubeka ibekwe ngokuchanekileyo ukuqinisekisa ukubekwa kwewafer ngokukhuselekileyo. Uyilo luvumela ii-wafers ukuba zibekwe ngokufanelekileyo ngelixa zithintela uqhagamshelwano phakathi kwee-wafers, ngaloo ndlela kuncitshiswa umngcipheko wokukrala, ungcoliseko, okanye umonakalo womatshini.

Ukuphathwa okuzenzekelayo
Ibhokisi ye-eFOSB ilungiselelwe ukusetyenziswa kunye ne-automated material handling systems (AMHS), ezinceda ukulungelelanisa ukunyakaza kwe-wafer kunye nokwandisa umthamo kwimveliso ye-semiconductor. Ngokuzenzekelayo inkqubo, imingcipheko ehambelana nokuphathwa kwabantu, njengokungcoliseka okanye umonakalo, iyancipha kakhulu. Uyilo lwebhokisi ye-eFOSB iqinisekisa ukuba inokuphathwa ngokuzenzekelayo kuzo zombini ezithe tyaba nezithe nkqo, iququzelela inkqubo yothutho egudileyo nethembekileyo.

Indlela yokuphatha ngesandla
Ngelixa i-automation ibekwe phambili, ibhokisi ye-eFOSB ikwahambelana neendlela zokuphatha ngesandla. Oku kusebenza kabini kunenzuzo kwiimeko apho ukungenelela komntu kuyimfuneko, njengaxa uhambisa ama-wafers kwiindawo ezingenazo iinkqubo ezizenzekelayo okanye kwiimeko ezifuna ukuchaneka okungaphezulu okanye ukunakekelwa.

I-Ultra-Coca, i-Low-Outgassing Materials
Izinto ezisetyenziswa kwibhokisi ye-eFOSB zikhethelwe ngokukodwa iipropathi zayo zokukhupha umoya eziphantsi, ezithintela ukukhutshwa kweekhompawundi eziguquguqukayo ezinokuthi zingcolise iiwafers. Ukongezelela, izinto eziphathekayo zixhathisa kakhulu kwiinqununu, eyona nto ibalulekileyo ekuthinteleni ukungcoliseka ngexesha lokuthuthwa kwe-wafer, ngokukodwa kwiindawo apho ukucoceka kubaluleke kakhulu.

UThintelo lweNqanaba yesiZukulwana
Uyilo lwebhokisi lubandakanya iimpawu ezijoliswe ngokukodwa ekuthinteleni ukuveliswa kweengqungquthela ngexesha lokuphatha. Oku kuqinisekisa ukuba ii-wafers zihlala zingenangcoliseko, okubalulekileyo kwimveliso ye-semiconductor apho namasuntswana amancinci anokubangela iziphene ezibalulekileyo.

Ukuqina kunye nokuthembeka
Ibhokisi ye-eFOSB yenziwe ngezinto ezihlala ixesha elide ezinokumelana noxinzelelo lwezothutho, iqinisekisa ukuba ibhokisi igcina imfezeko yolwakhiwo ekuhambeni kwexesha. Oku kuqina kunciphisa imfuno yokutshintshwa rhoqo, okwenza kube isisombululo esineendleko eziphezulu kwixesha elide.

Iinketho zokwenza ngokwezifiso
Ukuqonda ukuba wonke umgca wemveliso we-semiconductor unokuba neemfuno ezizodwa, ibhokisi ye-eFOSB ye-wafer carrier inika iinketho zokwenza ngokwezifiso. Nokuba ilungisa inani leendawo zokubeka, ilungisa ubungakanani bebhokisi, okanye ibandakanya imathiriyeli ekhethekileyo, ibhokisi ye-eFOSB inokulungiswa ukuhlangabezana neemfuno ezithile zomxumi.

Usetyenziso

II-12-intshi (300mm) Ibhokisi yokuThumela ePhambili yokuVula (eFOSB)yenzelwe ukusetyenziswa kwiintlobo ngeentlobo zezicelo kwishishini le-semiconductor, kubandakanya:

UkuPhathwa kweWafer yeSemiconductor
Ibhokisi ye-eFOSB ibonelela ngeendlela ezikhuselekileyo nezisebenzayo zokuphatha ama-wafers angama-300mm ngexesha lawo onke amanqanaba okuvelisa, ukusuka ekuyilweni kokuqala ukuya kuvavanyo kunye nokupakishwa. Inciphisa imingcipheko yongcoliseko kunye nomonakalo, obalulekileyo kwimveliso ye-semiconductor apho ukuchaneka kunye nococeko ngundoqo.

Ugcino lweWafer
Kwiimeko zokuvelisa i-semiconductor, ii-wafers kufuneka zigcinwe phantsi kweemeko ezingqongqo ukugcina ingqibelelo yazo. Umthwali we-eFOSB uqinisekisa ukugcinwa okukhuselekileyo ngokubonelela ngendawo ekhuselekileyo, ecocekileyo, kunye nezinzile, ukunciphisa umngcipheko wokuthotywa kwe-wafer ngexesha lokugcinwa.

Ezothutho
Ukuthutha ii-wafers ze-semiconductor phakathi kwezibonelelo ezahlukeneyo okanye ngaphakathi kweelaphu kufuna ukupakishwa okukhuselekileyo ukukhusela ii-wafers eziethe-ethe. Ibhokisi ye-eFOSB inika ukhuseleko olululo ngexesha lothutho, iqinisekisa ukuba ii-wafers zifika zingonakali, zigcina imveliso ephezulu.

Ukudityaniswa ne-AMHS
Ibhokisi ye-eFOSB ilungele ukusetyenziswa kwiilaphu zala maxesha, ezizihambelayo ze-semiconductor, apho ukuphatha imathiriyeli ngokufanelekileyo kubalulekile. Ukuhambelana kwebhokisi kunye ne-AMHS iququzelela ukuhamba ngokukhawuleza kwee-wafers ngaphakathi kwemigca yokuvelisa, ukunyusa imveliso kunye nokunciphisa iimpazamo zokuphatha.

Amagama angundoqo e-FOSB Q&A

I-Q1: Yintoni eyenza ukuba ibhokisi ye-eFOSB ilungele ukuphathwa kwe-wafer kwimveliso ye-semiconductor?

A1:Ibhokisi ye-eFOSB yenzelwe ngokukodwa ii-wafers ze-semiconductor, ibonelela ngendawo ekhuselekileyo nezinzileyo yokuphatha, ukugcinwa kunye nokuthutha. Ukuthotyelwa kwayo kunye ne-SEMI / FIMS kunye nemigangatho ye-AMHS iqinisekisa ukuba idibanisa ngokufanelekileyo kunye neenkqubo ezizenzekelayo. Iimathiriyeli zebhokisi ezicoceke kakhulu, ezikhupha umoya ophantsi kunye nenkqubo yokugcinwa kwewafer inciphisa imingcipheko yongcoliseko kwaye iqinisekise imfezeko yewafer kuyo yonke le nkqubo.

I-Q2: Ibhokisi ye-eFOSB ikuthintela njani ukungcoliseka ngexesha lokuthuthwa kwe-wafer?

A2:Ibhokisi ye-eFOSB yenziwe ngezinto ezixhathisayo ekukhupheni umoya, ukuthintela ukukhutshwa kweekhompawundi eziguquguqukayo ezinokungcolisa iiwafers. Uyilo lwayo luphinda lunciphise ukuveliswa kweengqungquthela, kunye nenkqubo yokugcinwa kwe-wafer ikhusela ii-wafers endaweni, ukunciphisa umngcipheko wokulimala komatshini kunye nokungcoliswa ngexesha lokuthutha.

I-Q3: Ngaba ibhokisi ye-eFOSB ingasetyenziswa kunye neenkqubo zombini kunye ne-automated systems?

A3:Ewe, ibhokisi ye-eFOSB inomsebenzi omninzi kwaye inokusetyenziswa kuzo zombiniiinkqubo ezizenzekelayokunye neemeko zokuphatha ngesandla. Yenzelwe ukuphatha ngokuzenzekelayo ukunciphisa ungenelelo lomntu, kodwa ikwavumela ukufikelela ngesandla xa kuyimfuneko.

I-Q4: Ngaba ibhokisi ye-eFOSB inokwenziwa ngokweesayizi ezahlukeneyo zewafer?

A4:Ewe, ibhokisi ye-eFOSB inikezelaiinketho zokwenza ngokwezifisoukulungiselela iisayizi ezahlukeneyo zewafer, ulungelelwaniso lweslot, okanye iimfuno ezithile zokuphatha, ukuqinisekisa ukuba iyahlangabezana neemfuno ezizodwa zemigca yemveliso eyahlukeneyo yesemiconductor.

I-Q5: Ibhokisi ye-eFOSB iphucula njani indlela yokuphatha kakuhle iwafer?

A5:Ibhokisi ye-eFOSB yongeza ukusebenza kakuhle ngokuvumelaimisebenzi ezenzekelayo, ukunciphisa imfuno yokungenelela ngesandla kunye nokulungelelanisa ukuthuthwa kwe-wafer ngaphakathi kwe-semiconductor fab. Uyilo lwayo luqinisekisa ukuba ama-wafers ahlala ekhuselekile, ukunciphisa iimpazamo zokuphatha kunye nokuphucula i-throughput.

Ukuqukumbela

I-12-intshi (300mm) Ibhokisi yokuThumela ePhambili yokuVula (i-eFOSB) sisisombululo esithembeke kakhulu nesisebenzayo sokuphatha iwafer, ukugcinwa, kunye nothutho kwimveliso yesemiconductor. Ngeempawu zayo eziphambili, ukuthobela imigangatho yoshishino, kunye nokuguquguquka, ibonelela abavelisi be-semiconductor ngendlela esebenzayo yokukhusela ingqibelelo ye-wafer kunye nokwandisa ukusebenza kakuhle kwemveliso. Nokuba yeyokuphathwa ngokuzenzekela okanye ngesandla, ibhokisi ye-eFOSB ihlangabezana neemfuno ezingqongqo zeshishini le-semiconductor, iqinisekisa ukuthuthwa kwe-wafer engenalo ungcoliseko kunye nomonakalo kwinqanaba ngalinye lenkqubo yokuvelisa.