I-12inch ngokuPheleleyo ngokuSebenzayo ngokuNgcaciswayo kweSaw yeSixhobo seWafer eZinikezelweyo zokusika iSi/SiC & HBM (Al)

I-12inch ngokuPheleleyo ngokuSebenzayo ngokuQelekileyo kokuDitywa kweSaw yeSixhobo seWafer eZinikezelweyo zokuSika iSi/SiC kunye ne-HBM (Al) Umfanekiso obonakalayo

Inkcazelo emfutshane:

Izixhobo zokudayela ezichanekileyo ngokuzenzekelayo yinkqubo yokusika ephezulu echanekileyo ephuhliswe ngokukodwa kwi-semiconductor kunye ne-electronic components industry. Ibandakanya itekhnoloji yokulawula intshukumo ephezulu kunye nokubekwa okubonakalayo okunengqondo ukufezekisa ukuchaneka kwenqanaba le-micron. Esi sixhobo silungele ukudaywa ngokuchanekileyo kwezixhobo ezahlukeneyo eziqinileyo kunye nezinqabileyo, kubandakanya:
I-1.Izixhobo ze-Semiconductor: I-Silicon (Si), i-silicon carbide (SiC), i-gallium arsenide (i-GaAs), i-lithium tantalate / i-lithium niobate (LT / LN) substrates, njl.
I-2.Izinto zokuPakisha: I-Ceramic substrates, iifreyimu ze-QFN / DFN, i-BGA yokupakisha i-substrates.
I-3.Izixhobo eziSebenzayo: Izihlungi ze-acoustic wave (SAW), iimodyuli zokupholisa i-thermoelectric, ii-wafers ze-WLCSP.

I-XKH ibonelela ngovavanyo lokuhambelana kwezinto kunye neenkonzo zokwenza ngokwezifiso ukuqinisekisa ukuba izixhobo zihambelana ngokugqibeleleyo neemfuno zemveliso yabathengi, ukuhambisa izisombululo ezifanelekileyo kuzo zombini iisampulu ze-R&D kunye nokusetyenzwa kwebhetshi.

Thumela i-imeyile kuthi

Iimbonakalo

Imilinganiselo yobugcisa

Ipharamitha	Inkcazo
Ubungakanani bokusebenza	Φ8", Φ12"
I-spindle	I-Dual-axis 1.2/1.8/2.4/3.0, Max 60000 rpm
Ubungakanani beBlade	2" ~ 3"
Umgca we-Y1 / Y2	Inyathelo elinye lokunyuka: 0.0001 mm
	Ukumisa ukuchaneka: <0.002 mm
	Uluhlu lokusika: 310 mm
X Axis	Uluhlu lwesantya sokutya: 0.1–600 mm/s
Umgca we-Z1 / Z2	Inyathelo elinye lokunyuka: 0.0001 mm
Umgca we-Z1 / Z2	Ukumisa ukuchaneka: ≤ 0.001 mm
θ I-axis	Ukuma kokuchaneka: ±15"
Isitishi sokucoca	Isantya sokujikeleza: 100-3000 rpm
Isitishi sokucoca	Indlela yokucoca: Sula ngokuzenzekela kwaye usomise
I-Voltage yokusebenza	I-3-isigaba 380V 50Hz
Imilinganiselo (W×D×H)	1550×1255×1880 mm
Ubunzima	2100 kg

Umgaqo wokuSebenza

Isixhobo sifezekisa ukusika okuphezulu ngokuchaneka kobu buchwepheshe bulandelayo:
I-1.I-High-Rigidity Spindle System: Isantya sokujikeleza ukuya kwi-60,000 RPM, exhotywe ngamacangci edayimane okanye iintloko zokusika i-laser ukulungelelanisa kwiipropati zezinto ezahlukeneyo.

I-2.Ulawulo lwe-Multi-Axis Motion Control: I-X / Y / Z-i-axis yokuchaneka kokuchaneka kwe-± 1μm, idibaniswe nezikali ezichanekileyo zokugaya ukuqinisekisa ukuphambuka kweendlela zokusika.

3. Ulungelelwaniso olubonakalayo oluBukrelekrele: I-CCD enokulungiswa okuphezulu (iimegapikseli ezi-5) ibona ngokuzenzekelayo izitrato ezisikiweyo kwaye ihlawule ukujija okanye ukungahambi kakuhle.

I-4.Ukupholisa kunye nokususwa kothuli: Inkqubo edibeneyo yokupholisa amanzi acocekileyo kunye nokususwa kwe-vacuum suction uthuli ukunciphisa impembelelo ye-thermal kunye nokungcoliswa kwamasuntswana.

Iindlela zokusika

I-1.Blade Dicing: Ifanelekile kwizinto zemveli ze-semiconductor ezifana ne-Si kunye ne-GaAs, kunye nobubanzi be-kerf ye-50-100μm.

2.I-Stealth Laser Dicing: Isetyenziselwa ii-wafers ezi-ultra-thin (<100μm) okanye izinto ezibuthathaka (umzekelo, i-LT / LN), eyenza ukuhlukana ngaphandle koxinzelelo.

Usetyenziso oluqhelekileyo

Izinto Ezihambelanayo	Indawo yosetyenziso	IiMfuno zokuSebenza
Isilicon (Si)	Ii-ICs, ii-MEMS sensors	Ukusika okuphezulu, ukusika <10μm
I-Silicon Carbide (SiC)	Izixhobo zamandla (MOSFET/diodes)	Ukusika umonakalo ophantsi, ukulungiswa kokulawulwa kwe-thermal
I-Gallium Arsenide (GaAs)	Izixhobo zeRF, iitshiphusi ze-optoelectronic	Uthintelo lwe-Micro-crack, ulawulo lokucoceka
LT/LN Substrates	Izihluzi ze-SAW, iimodyuli zamehlo	Ukusika okungenaxinzelelo, ukugcina iimpawu ze-piezoelectric
IiSubstrates zeCeramic	Iimodyuli zamandla, ukupakishwa kwe-LED	Ukulungiswa kwezinto ezinobunzima obuphezulu, ukunyanzeliswa komphetho
Izakhelo ze-QFN/DFN	Ukupakishwa okuphezulu	Ukusikwa kwe-Multi-chip ngaxeshanye, ukwenziwa kakuhle
WLCSP Wafers	Ukupakishwa kwenqanaba le-wafer	Ukudaywa okungenakonakala kweewafers ezibhityileyo kakhulu (50μm)

Iingenelo

1. Isantya esiphezulu sokuskena isakhelo sekhasethi enee-alam zokuthintela ukungqubana, ukumiswa kokudluliselwa ngokukhawuleza, kunye nokukwazi ukulungisa iimpazamo.

2. Imowudi yokusika ephuculwe kabini, iphucula ukusebenza kakuhle malunga ne-80% xa kuthelekiswa neenkqubo zokusonta enye.

3. Izikrufu zebhola ezifakwe ngokuchanekileyo, izikhokelo zomgca, kunye ne-Y-axis grating scale control-loop control-loop control, ukuqinisekisa ukuzinza kwexesha elide lokuchaneka okuphezulu.

4. Ukulayishwa / ukukhulula ngokuzenzekelayo, ukubeka indawo yokudlulisa, ukusika ukulungelelanisa, kunye nokuhlolwa kwe-kerf, ukunciphisa kakhulu umthwalo womsebenzi (OP) womsebenzi.

I-5.I-Gantry-style yokuxhoma i-spindle, kunye ne-spacing encinci ye-dual-blade ye-24mm, eyenza ukulungelelaniswa okubanzi kwiinkqubo zokusika ezimbini.

Iimbonakalo

1.Umlinganiselo wobude obuchanekileyo obuchanekileyo.

2.I-Multi-wafer-dual-blade ukusika kwitreyi enye.

I-3.Ukulinganisa okuzenzekelayo, ukuhlolwa kwe-kerf, kunye neenkqubo zokubona ukuphulwa kwe-blade.

I-4.Ixhasa iinkqubo ezahlukeneyo kunye ne-algorithms yokulungelelanisa okuzenzekelayo.

I-5.I-Fault self-correction functionality kunye nexesha langempela lokubeka iliso kwiindawo ezininzi.

6.Ikhono lokuqala lokuhlola i-post-initial dicing.

I-7.Iimodyuli ezizenzekelayo zefektri ezizenzekelayo kunye neminye imisebenzi ekhethiweyo.

Izinto ezihambelanayo

Iinkonzo zeZixhobo

Sinikezela ngenkxaso ebanzi ukusuka ekukhethweni kwezixhobo ukuya kulondolozo lwexesha elide:

(1) Uphuhliso olulungiselelweyo
· Cebisa izisombululo zokusika iiblade/laser ezisekelwe kwiimpawu zemathiriyeli (umzekelo, ubulukhuni beSiC, i-GaAs brittleness).

· Nikeza ngovavanyo lwesampulu yasimahla ukuqinisekisa umgangatho wokusika (kubandakanya ukutshiphuza, ububanzi bekefu, uburhabaxa bomphezulu, njl. njl.).

(2) Uqeqesho lobuGcisa
· UQeqesho oluSisiseko: Ukusebenza kwezixhobo, ukulungiswa kweparameter, ukugcinwa kwesiqhelo.
· Izifundo ezikwinqanaba eliphezulu: Ukulungiswa kwenkqubo yezinto ezintsonkothileyo (umzekelo, ukusika okungenaxinzelelo lwe-LT substrates).

(3) Emva koThengiso lweNkxaso
· 24/7 Impendulo: Uxilongo olukude okanye uncedo kwisiza.
· Ubonelelo lwaMalungu aSpare: ama-spindles agcweleyo, iibhleyidi, kunye namalungu okukhanya ukuze atshintshwe ngokukhawuleza.
· ULondolozo loThintelo: Ulungelelwaniso lwarhoqo ukugcina ukuchaneka nokwandisa ubomi benkonzo.

Izinto Eziluncedo Zethu

✔ Amava eShishini: Ukukhonza i-300+ ye-semiconductor yehlabathi jikelele kunye nabavelisi bezinto zombane.
✔ Itekhnoloji ye-Cutting-Edge: Izikhokelo ezichanekileyo ezichanekileyo kunye neenkqubo ze-servo ziqinisekisa uzinzo oluhamba phambili kwishishini.
✔ Uthungelwano lweNkonzo yeHlabathi: Ukugubungela e-Asia, eYurophu, naseMntla Melika ngenkxaso yendawo.
Ukuvavanya okanye imibuzo, qhagamshelana nathi!