Umatshini wokubhoboza i-laser yetafile encinci 1000W-6000W ubuncinci bokuvula obuyi-0.1MM ungasetyenziselwa izinto zeglasi zesinyithi
Izinto ezisebenzayo
1. Izinto zesinyithi: ezifana ne-aluminium, ubhedu, i-titanium alloy, intsimbi engatyiwayo, njl.
2. Izinto ezingezizo ezesinyithi: ezifana neplastiki (kubandakanya i-polyethylene PE, i-polypropylene PP, i-polyester PET kunye nezinye iifilimu zeplastiki), iglasi (kubandakanya iglasi eqhelekileyo, iglasi ekhethekileyo efana neglasi emhlophe kakhulu, iglasi ye-K9, iglasi ye-borosilicate ephezulu, iglasi ye-quartz, njl.njl., kodwa iglasi eqinisiweyo ngenxa yeempawu zayo ezikhethekileyo zomzimba ayisafanelekanga ukugrumba), iiseramikhi, iphepha, isikhumba njalo njalo.
3. Izinto ezidityanisiweyo: zenziwe ngezinto ezimbini nangaphezulu ezineempawu ezahlukeneyo ngeendlela ezibonakalayo okanye zeekhemikhali, ezineempawu ezibalaseleyo ezibanzi.
4. Izixhobo ezikhethekileyo: Kwiindawo ezithile, oomatshini bokubhoboza nge-laser banokusetyenziselwa ukucubungula ezinye izixhobo ezikhethekileyo.
Iiparamitha zeenkcukacha
| Igama | Idatha |
| Amandla elaser: | 1000W-6000W |
| Ukuchaneka kokusika: | ± 0.03MM |
| Ukuvulwa kwexabiso eliphantsi: | 0.1MM |
| Ubude bokusika: | 650MM×800MM |
| Ukuchaneka kwendawo: | ≤±0.008MM |
| Ukuchaneka okuphindaphindwayo: | 0.008MM |
| Ukusika igesi: | Umoya |
| Imodeli ezinzileyo: | Ukubopha umphetho womoya, inkxaso yesixhobo |
| Inkqubo yokuqhuba: | Imoto yomgca wokuxhoma ngemagnethi |
| Ukusika ubukhulu | 0.01MM-3MM |
Iingenelo zobugcisa
1. Ukubhola ngokufanelekileyo: Ukusetyenziswa komqadi welaser onamandla aphezulu ekucutshungulweni okungaqhagamshelwaniyo, ngokukhawuleza, umzuzwana omnye ukugqiba ukucutshungulwa kwemingxunya emincinci.
2. Ukuchaneka okuphezulu: Ngokulawula ngokuchanekileyo amandla, i-pulse frequency kunye nendawo yokugxila kwe-laser, umsebenzi wokugrumba ngobuchule be-micron unokufezekiswa.
3. Isebenza ngokubanzi: ingacubungula iintlobo ngeentlobo zezinto ezibuthathaka, ezinzima ukuzicubungula kunye nezixhobo ezikhethekileyo, ezifana neplastiki, irabha, isinyithi (intsimbi engatyiwayo, i-aluminium, ubhedu, i-titanium alloy, njl.njl.), iglasi, iiseramikhi njalo njalo.
4. Ukusebenza okukrelekrele: Umatshini wokubhoboza nge-laser uxhotyiswe ngenkqubo yolawulo lwamanani oluphambili, olukrelekrele kakhulu kwaye kulula ukuludibanisa noyilo oluncediswa yikhompyutha kunye nenkqubo yokuvelisa encediswa yikhompyutha ukuze kufezekiswe ucwangciso olukhawulezileyo kunye nokwenza ngcono indlela yokudlula entsonkothileyo kunye nendlela yokucubungula.
Iimeko zokusebenza
1.Ukwahluka: inokwenza iintlobo ngeentlobo zemingxunya yemilo entsonkothileyo, efana nemingxunya engqukuva, imingxunya yesikwere, imingxunya engxantathu kunye neminye imingxunya enemilo ekhethekileyo.
2. Umgangatho ophezulu: Umgangatho womngxuma uphezulu, umphetho uthambile, akukho mvakalelo irhabaxa, kwaye ukuguquguquka kuncinci.
3.Ukwenza izinto ngokuzenzekelayo: Ingagqibezela ukucutshungulwa kwemingxunya emincinci ngobukhulu obufanayo bomngxuma kunye nokusasazwa okufanayo ngexesha elinye, kwaye ixhasa ukucutshungulwa kwemingxunya yeqela ngaphandle kokungenelela ngesandla.
Iimpawu zezixhobo
■ Ubungakanani obuncinci bezixhobo, ukusombulula ingxaki yendawo encinci.
■ Ukuchaneka okuphezulu, umngxuma ophezulu ungafikelela kwi-0.005mm.
■ Izixhobo kulula ukuzisebenzisa kwaye kulula ukuzisebenzisa.
■ Umthombo wokukhanya ungatshintshwa ngokwezixhobo ezahlukeneyo, kwaye ukuhambelana kwawo kunamandla ngakumbi.
■ Indawo encinci echaphazeleka bubushushu, i-oxidation encinci ejikeleze imingxunya.
Intsimi yesicelo
1. Ishishini le-elektroniki
●Ukubhoboza iBhodi yeSekethe ePrintiweyo (PCB):
Umatshini wokulungisa imingxunya emincinci: Usetyenziselwa umatshini wokulungisa imingxunya emincinci enobubanzi obungaphantsi kwe-0.1mm kwi-PCBS ukuhlangabezana neemfuno zeebhodi zokudibanisa ezixineneyo (HDI).
Imingxunya engaboniyo nefihliweyo: Ukulungisa imingxunya engabonakaliyo nefihliweyo kwi-PCBS enamaleko amaninzi ukuphucula ukusebenza kunye nokuhlanganiswa kwebhodi.
●Ukupakisha i-semiconductor:
Ukubhola ifreyimu yelead: Imingxunya echanekileyo ifakwa ngomatshini kwifreyimu yelead ye-semiconductor ukuze kuqhagamshelwe itshiphu kwisekethe yangaphandle.
Isixhobo sokusika iwafer: Bhoboza imingxunya kwiwafer ukuze uncede kwiinkqubo ezilandelayo zokusika nokupakisha.
2. Oomatshini abachanekileyo
● Ukucubungula iinxalenye ezincinci:
Ukubhola izixhobo ezichanekileyo: Ukubhola imingxunya echanekileyo kakhulu kwiigiya ezincinci ukuze kusetyenziswe iinkqubo zokuhambisa izixhobo ezichanekileyo.
Ukubhoboza icandelo lesenzwa: Ukufaka imingxunya emincinci kwizixhobo zesenzwa ukuphucula uvakalelo kunye nesantya sokuphendula kwesenzwa.
●Ukwenziwa kweMold:
Umngxuma wokupholisa isikhunta: Umatshini wokupholisa umngxuma kwisikhunta se-injection okanye kwisikhunta se-die casting ukuze kuphuculwe ukusebenza kokusasazwa kobushushu kwesikhunta.
Ukulungiswa komoya ophumayo: Ukulungisa umoya ophumayo omncinci kwisikhunta ukunciphisa iziphene.
3. Izixhobo zonyango
●Izixhobo Zotyando Ezingenamsebenzi Kakhulu:
Ukugqobhoza kweCatheter: IiMicroholes zicutshungulwa kwii-catheters zotyando ezingangenisi kakhulu ukuze kuhanjiswe amayeza okanye kukhutshwe amanzi.
Izinto ze-Endoscope: Imingxunya echanekileyo ifakwa kwilensi okanye entloko yesixhobo se-endoscope ukuphucula ukusebenza kwesixhobo.
● Inkqubo yokuhambisa amayeza:
Ukubhola uluhlu lweenaliti ze-Microneedle: Ukufaka imingxunya emincinci kwi-patch yeziyobisi okanye uluhlu lweenaliti ze-microneedle ukulawula izinga lokukhululwa kweziyobisi.
Ukubhoboza ii-biochip: Ii-Microholes zicutshungulwa kwii-biochips ukuze kukhuliswe okanye kufunyanwe iiseli.
4. Izixhobo ezibonakalayo
●Isixhumi se-fiber optic:
Ukubhola imingxunya yemibhobho esekupheleni kwefayibha ye-optical: Ukufaka imingxunya emincinci ekwicala lokugqibela lesixhumi se-optical ukuphucula ukusebenza kakuhle kokudluliselwa kwesignali ye-optical.
Umatshini wokulungisa iifayibha: Umatshini wokulungisa iimbobo ezichanekileyo kakhulu kwipleyiti yomatshini wokulungisa iifayibha ukuze kubekho unxibelelwano lwe-optical olunemijelo emininzi.
●Isihluzi se-Optical:
Ukubhola isihluzo: Ukusika imingxunya emincinci kwisihluzo se-optical ukuze kukhethwe ubude be-wavelengths ethile.
Umatshini wokwahlulahlula izinto: Umatshini wokwahlulahlula izinto ezibonisa ukukhanya ukuze kuqhekeke okanye kubumbe umqadi welaser.
5. Ukuveliswa kweemoto
●Inkqubo yokufaka ipetroli:
Ukubhoboza umlomo ngenaliti: Ukucubungula imingxunya emincinci kwimilomo ngenaliti ukuze kuphuculwe isiphumo se-atomization yamafutha kunye nokuphucula ukusebenza kakuhle kokutsha.
●Ukwenziwa kwezixhobo zokuvavanya:
Ukubhola i-pressure sensor: Ukufaka i-microholes kwi-diaphragm ye-pressure sensor ukuphucula uvakalelo kunye nokuchaneka kwe-sensor.
●Ibhetri yamandla:
Ukubhola iitshiphusi zeepali zebhetri: Ukulungisa imingxunya emincinci kwiitshiphusi zeepali zebhetri zelithium ukuphucula ukungena kwe-electrolyte kunye nokuthuthwa kwee-ion.
I-XKH inikezela ngeenkonzo ezipheleleyo zokumisa indawo enye kwii-laser zetafile ezincinci, kuquka kodwa kungaphelelanga apho: Ukubonisana ngokuthengisa ngobuchule, uyilo lwenkqubo eyenzelwe wena, ukubonelela ngezixhobo ezikumgangatho ophezulu, ukufakelwa kakuhle kunye nokuqaliswa, uqeqesho oluneenkcukacha lokusebenza, ukuqinisekisa ukuba abathengi bafumana amava enkonzo asebenzayo, achanekileyo kwaye angenangxaki kwinkqubo yokubhoboza.
Umzobo oneenkcukacha
