Izixhobo zeSemiconductor
-
IsiXhobo sokuSaha ngocingo seSapphire/iCeramics/iMarble Materials kwi-Vertical/Horizontal/Multi-Wire Cutting
-
Izahlulo zoNxibelelwano lweLaser oluPhakamileyo kunye neZiphelo
-
Idayimani yocingo lweMininzi yocingo oluPhezulu-Isantya esiphezulu-Ukuchaneka ezantsi umatshini wokusika ujingi
-
IziXhobo zokuhombisa ezikwicala elinye elichanekileyo
-
Umatshini wokuSila onamacala amabini oChanekileyo weSiC Sapphire Si wafer
-
Multi-Wire Diamond Sawing Machine for SiC Sapphire Ultra-Hard Brittle Materials
-
Umatshini wokusika iDayimane yocingo lweSiC | Isafire | Iquartz | Iglasi
-
Umatshini wokuNgcwelisa iRobhothi-UkuGqiba okuPhakamileyo okuSebenzayo okuSebenzayo koMphezulu
-
Umatshini wokumenyezisa we-Ion Beam weSapphire SiC Si
-
Idayimani yocingo lweSikhululo esiNye esiNdwe ngocingo oluNye umatshini wokusika weSi Wafer/Optical Glass Material Cutting
-
Inkqubo yokuJonga iWafer yoMlinganiselo wokuJongene neCrystal
-
Semiconductor Laser Lift-Off isixhobo Revolutionize Ingot Thinning