Izixhobo ze-semiconductor
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Umgca we-Silicon / Silicon Carbide (SiC) we-Wafer oQhagamshelweyo we-Four-Stage Linked Polishing Automation (Umgca wokuphatha odibeneyo emva kwe-Polish)
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Isisombululo esidibeneyo sokugquma imbewu yeSiC–Bonding–Sintering
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Inkqubo yeMicromachining yeLaser echanekileyo kakhulu
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I-Multi-Wire Diamond Wire Saw yokusika izinto eziqinileyo nezithambileyo ngobuchule obuphezulu
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Umatshini Wokucubungula I-Laser Okhokelwa yi-Micro Waterjet
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Umatshini wokubona idayimani ye-Inverted Swing-Type Multi-Wire Diamond Saw okhawulezayo oluphezulu oluchanekileyo
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I-Diamond Saw enezintambo ezininzi i-TJ3000 12″ Ijika Elihlayo Eliguqulweyo
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Izixhobo zeSaw yeWire zeSapphire/Ceramics/Marble kwi-Vertical/Horizontal/Multi-Wire Cutting
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Izixhobo zoNxibelelwano lweLaser ekhawulezayo kunye neeTerminali
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Umatshini Wokusika Umatshini Wokusika Umatshini Wokusika Umatshini Wokusika Umatshini Wokusika Umatshini Weentambo Ezininzi Ophezulu Ophezulu Ochanekileyo Ophezulu
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Izixhobo zokupolisha eziBalaseleyo ezichanekileyo
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Umatshini Wokugaya Ochanekileyo Omacala Ambini we-SiC Sapphire Si wafer